Abstract: A method for applying a layer having a relief on a substrate includes steps of securing the substrate, applying a layer of a curable liquid on the substrate, bringing a mould having a relief being the negative of the relief to be provided on the substrate, into contact with a part of the upper surface of the liquid layer, curing the liquid layer while the mould is in contact with the liquid and separating the mould from the substrate. Initially the mould is brought into contact with the liquid in a bent position while the substrate is kept flat and subsequently the mould is brought into contact over an increasing surface area keeping the mould in a bent position until the complete liquid layer is in contact with the mould.

Abstract: A method for applying a layer having a relief on a substrate includes, steps of securing the substrate, applying a layer of a curable liquid on the substrate, bringing a mould having a relief being the negative of the relief to be provided on the substrate, into contact with a part of the upper surface of the liquid layer, curing the liquid layer while the mould is in contact with the liquid and separating the mould from the substrate. Initially the mould is brought into contact with the liquid in a bent position while the substrate is kept flat and subsequently the mould is brought into contact over an increasing surface area keeping the mould in a bent position until the complete liquid layer is in contact with the mould.