Patents by Inventor Erik M. Probstfield

Erik M. Probstfield has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inspection method for protecting image sensor devices with front surface protection
    Patent number: 7844099
    Abstract: A method for inspecting a semiconductor wafer fabricated for image sensing operation that has had a transparent protective tape layer applied to a front or active wafer surface. The method includes quantifying chip defects in the image sensor wafer that lie under the protective layer using automatic disposition equipment.
    Type: Grant
    Filed: November 15, 2006
    Date of Patent: November 30, 2010
    Assignee: International Business Machines Corporation
    Inventors: Timothy C. Krywanczyk, Timothy E. Neary, Erik M. Probstfield
  • COLLAPSABLE CONNECTION MOLD REPAIR METHOD UTILIZING FEMTOSECOND LASER PULSE LENGTHS
    Publication number: 20090013527
    Abstract: A method for repairing molds for collapsible connections utilizing a femtosecond laser pulse length. Also provided is a laser source for implementing a multistep profile repair process for the removal of excess material in C4 molds by utilizing the femtosecond laser pulse lengths.
    Type: Application
    Filed: July 11, 2007
    Publication date: January 15, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy E. Neary, Erik M. Probstfield
  • INSPECTION METHOD FOR PROTECTING IMAGE SENSOR DEVICES WITH FRONT SURFACE PROTECTION
    Publication number: 20080113458
    Abstract: A method for inspecting a semiconductor wafer fabricated for image sensing operation that has had a transparent protective tape layer applied to a front or active wafer surface. The method includes quantifying chip defects in the image sensor wafer that lie under the protective layer using automatic disposition equipment.
    Type: Application
    Filed: November 15, 2006
    Publication date: May 15, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy C. Krywanczyk, Timothy E. Neary, Erik M. Probstfield
  • Method for forming interconnects on thin wafers
    Patent number: 7288492
    Abstract: A method of forming a semiconductor interconnect including, in the order recited: (a) providing a semiconductor wafer; (b) forming bonding pads in a terminal wiring level on the frontside of the wafer; (c) reducing the thickness of the wafer; (d) forming solder bumps on the bonding pads; and (e) dicing the wafer into bumped semiconductor chips.
    Type: Grant
    Filed: July 19, 2005
    Date of Patent: October 30, 2007
    Assignee: International Business Machines Corporation
    Inventors: Leonard J. Gardecki, James R. Palmer, Erik M. Probstfield, Adolf E. Wirsing
  • Method for forming interconnects on thin wafers
    Patent number: 6951775
    Abstract: A method of forming a semiconductor interconnect including, in the order recited: (a) providing a semiconductor wafer; (b) forming bonding pads in a terminal wiring level on the frontside of the wafer; (c) reducing the thickness of the wafer; (d) forming solder bumps on the bonding pads; and (e) dicing the wafer into bumped semiconductor chips.
    Type: Grant
    Filed: June 28, 2003
    Date of Patent: October 4, 2005
    Assignee: International Business Machines Corporation
    Inventors: Leonard J. Gardecki, James R. Palmer, Erik M. Probstfield, Adolf E. Wirsing
  • METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS
    Publication number: 20040266159
    Abstract: A method of forming a semiconductor interconnect including, in the order recited: (a) providing a semiconductor wafer; (b) forming bonding pads in a terminal wiring level on the frontside of the wafer; (c) reducing the thickness of the wafer; (d) forming solder bumps on the bonding pads; and (e) dicing the wafer into bumped semiconductor chips.
    Type: Application
    Filed: June 28, 2003
    Publication date: December 30, 2004
    Applicant: International Business Machines Corporation
    Inventors: Leonard J Gardecki, James R Palmer, Erik M Probstfield, Adolf E Wirsing