Abstract: A substrate distortion measurement apparatus comprising one or more optical detectors arranged to measure the locations of pits or holes provided in a substrate, a memory arranged to store previously determined locations of the pits or holes in the substrate, and a comparator arranged to compare the measured locations of the pits or holes with the previously determined locations of the pits or holes, to determine distortion of the substrate.

Abstract: A substrate distortion measurement apparatus comprising one or more optical detectors arranged to measure the locations of pits or holes provided in a substrate, a memory arranged to store previously determined locations of the pits or holes in the substrate, and a comparator arranged to compare the measured locations of the pits or holes with the previously determined locations of the pits or holes, to determine distortion of the substrate.

Abstract: A distortion measurement apparatus comprising a detector arranged to measure distortion of a substrate, and a processor arranged to receive distortion data indicating the measured distortion of the substrate and to transform the distortion data into a frequency domain representation. The distortion data may alternatively be transformed into an orthogonal polynomial or an orthonormal polynomial representation.

Abstract: A substrate distortion measurement apparatus comprising one or more optical detectors arranged to measure the locations of pits or holes provided in a substrate, a memory arranged to store previously determined locations of the pits or holes in the substrate, and a comparator arranged to compare the measured locations of the pits or holes with the previously determined locations of the pits or holes, to determine distortion of the substrate.

Abstract: A masking apparatus for preventing irradiation of an outer region of a substrate during lithography is disclosed. The masking apparatus includes a mask that includes a plurality of discrete segments arranged to form a continuous ring shaped mask positioned between an outer region of a substrate and an illumination system.

Abstract: A positioning system for a lithographic apparatus including a control system to position a moveable object of the lithographic apparatus in at least one direction which is substantially parallel to a frame, the control system including a measurement system to measure a position of the moveable object, an actuator to apply a force to the moveable object, and a controller to provide a drive signal to the actuator based on an output of the measurement system; and an emergency brake system configured to determine a failure of the control system, and if the failure is determined disable the control system and pull the moveable object against the frame.

Abstract: A method of removing a substrate from a substrate table of a lithographic apparatus. The substrate table is provided with a mask arranged to form a peripheral exposure exclusion region on a substrate. The method includes moving the mask from an in use position to a storage position. The storage position is adjacent to a projection system of the lithographic apparatus. The method also includes removing the substrate from the lithographic apparatus.

Abstract: A substrate table for a lithographic apparatus includes a mask constructed and arranged to prevent exposure of a peripheral exposure region of a substrate on the substrate table. The mask is attached to a moveable carrier. The moveable carrier has a range of movement which at least partially circumnavigates the substrate table.

Abstract: A substrate table for a lithographic apparatus includes a mask constructed and arranged to prevent exposure of a peripheral exposure region of a substrate on the substrate table. The mask is attached to a moveable carrier. The moveable carrier has a range of movement which at least partially circumnavigates the substrate table.

Abstract: A method of removing a substrate from a substrate table of a lithographic apparatus. The substrate table is provided with a mask arranged to form a peripheral exposure exclusion region on a substrate. The method includes moving the mask from an in use position to a storage position. The storage position is adjacent to a projection system of the lithographic apparatus. The method also includes removing the substrate from the lithographic apparatus.

Abstract: A method of calculating an angle of an alignment beam of an alignment system in, for example, a lithographic projection apparatus includes measuring the position of at least two alignment marks. These two alignment marks are manufactured on a measurement substrate or they can be arranged on a reference on a substrate table of the lithographic apparatus itself. The second mark is covered by a transparent plate. Then, the position of the two marks is measured using the alignment system. Due to refraction of the alignment beam in the transparent plate, the alignment beam is shifted when returning to the alignment system. The shift of the alignment beam results in a deviated measured position of the second mark. This shift can be calculated because the distance between the two marks is known. The shift is used to calculate the angle of the alignment beam. The angle can be used to improve a FTBA error verification method.

Abstract: A flowcell including a plurality of separate chambers is provided on the substrate table so that a fluid can be brought into contact with exposed areas of the substrate to interact therewith. A series of exposures and chemical processes can thereby be carried out without removing the substrate from the substrate table.

Abstract: According to an aspect of the present invention, there is provided a method of projecting a pattern onto a substrate. The method includes rotating a mask having a plurality of patterns provided thereon, to select a pattern to be projected onto a substrate, using the selected pattern to impart a beam of radiation with a pattern in its cross-section corresponding to the selected pattern, and projecting the patterned beam of radiation onto a target portion of the substrate.

Abstract: A flowcell including a plurality of separate chambers is provided on the substrate table so that a fluid can be brought into contact with exposed areas of the substrate to interact therewith. A series of exposures and chemical processes can thereby be carried out without removing the substrate from the substrate table.