Abstract: In general, techniques are described for processing a set of high-resolution images of an integrated circuit, the images captured at different locations with respect to the integrated circuit, to automatically align and “stitch” the set of high-resolution images into a larger composite image. For example, an imaging system as described herein may use sampled feature points distributed across different grid tiles within overlap regions for pairs of images to match feature points to inform the alignments of a pair with respect to each image in the pair. The system may in some cases further apply a bundle adjustment to iteratively align and refine the alignment results for each image in a set of images being processed. In some examples, the bundle adjustment is a best-fit adjustment based on minimizing the net error associated with the alignment of the set of images.

Abstract: In general, techniques are described for processing a set of high-resolution images of an integrated circuit, the images captured at different locations with respect to the integrated circuit, to automatically align and “stitch” the set of high-resolution images into a larger composite image. For example, an imaging system as described herein may use sampled feature points distributed across different grid tiles within overlap regions for pairs of images to match feature points to inform the alignments of a pair with respect to each image in the pair. The system may in some cases further apply a bundle adjustment to iteratively align and refine the alignment results for each image in a set of images being processed. In some examples, the bundle adjustment is a best-fit adjustment based on minimizing the net error associated with the alignment of the set of images.