Patents by Inventor Erik Paul Vick

Erik Paul Vick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220165666
    Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.
    Type: Application
    Filed: February 14, 2022
    Publication date: May 26, 2022
    Inventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick
  • Patent number: 11282786
    Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: March 22, 2022
    Assignee: X Display Company Technology Limited
    Inventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick
  • Publication number: 20210151630
    Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.
    Type: Application
    Filed: January 29, 2021
    Publication date: May 20, 2021
    Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
  • Patent number: 10944027
    Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: March 9, 2021
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
  • Publication number: 20210043618
    Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.
    Type: Application
    Filed: September 23, 2020
    Publication date: February 11, 2021
    Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
  • Publication number: 20200395510
    Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.
    Type: Application
    Filed: June 14, 2019
    Publication date: December 17, 2020
    Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
  • Publication number: 20200194370
    Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.
    Type: Application
    Filed: December 3, 2019
    Publication date: June 18, 2020
    Inventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick
  • Publication number: 20200051482
    Abstract: A redundant pixel layout for a display comprises a display substrate and an array of pixels disposed on or over the display substrate. Each pixel comprises a first subpixel and a redundant second subpixel. The first subpixel includes a first subpixel controller electrically connected to controller wires and a first light emitter electrically connected to a first-light-emitter wire. The first light emitter is controlled by the first subpixel controller through the first-light-emitter wire. The second subpixel includes a second-subpixel-controller location connected to the controller wires and a second-light-emitter location comprising a second-light-emitter wire. The first light emitter is adjacent to the second-light-emitter location and the first light emitter and the second-light-emitter location are closer together than are any two pixels in the array of pixels.
    Type: Application
    Filed: August 13, 2018
    Publication date: February 13, 2020
    Inventors: Ronald S. Cok, Erich Radauscher, Erik Paul Vick, Andrew Tyler Pearson, Christopher Andrew Bower, Matthew Alexander Meitl
  • Patent number: 10418344
    Abstract: An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: September 17, 2019
    Assignee: Micross Advanced Interconnect Technology LLC
    Inventors: Erik Paul Vick, Dorota Temple
  • Publication number: 20180151542
    Abstract: An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer.
    Type: Application
    Filed: January 26, 2018
    Publication date: May 31, 2018
    Inventors: Erik Paul Vick, Dorota Temple
  • Publication number: 20170324016
    Abstract: A method of forming a thermoelectric device structure and the resultant thermoelectric device structure. The method forms a first pattern of epitaxial thermoelectric elements of a first conductivity type on a first semiconductor substrate, forms a second pattern of epitaxial thermoelectric elements of a second conductivity type on a second semiconductor substrate, separates the epitaxial thermoelectric elements of the first conductivity type and places the epitaxial thermoelectric elements of the first conductivity type and the epitaxial thermoelectric elements of the second conductivity type on a heat sink, and integrates the heat sink to a device substrate including an electronic device to be cooled.
    Type: Application
    Filed: May 3, 2017
    Publication date: November 9, 2017
    Applicant: RESEARCH TRIANGLE INSTITUTE
    Inventors: Philip BARLETTA, Brian GRANT, Erik Paul VICK, Christopher GREGORY
  • Patent number: 9576889
    Abstract: An electronic package may be fabricated by forming a first layer of insulating material on a first substrate such that the first layer covers a contact pad; forming an opening through the first layer to expose the contact pad; forming an un-patterned second layer on the first layer, the second layer including an adhesive having a viscosity less than that of the first layer, wherein a region of the second layer obstructs the contact pad; removing the region to re-expose the contact pad; aligning a second substrate with the first substrate such that a via of the second substrate is aligned with the opening; bonding the first substrate and the second substrate together at the second layer; and forming an interconnect in contact with the contact pad by depositing a conductive material through the via and the opening.
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: February 21, 2017
    Assignee: Research Triangle Institute
    Inventor: Erik Paul Vick