Patents by Inventor Erik Paul Vick
Erik Paul Vick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240105698Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: ApplicationFiled: December 7, 2023Publication date: March 28, 2024Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Patent number: 11881475Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: GrantFiled: June 22, 2022Date of Patent: January 23, 2024Assignee: X Display Company Technology LimitedInventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Publication number: 20240014129Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.Type: ApplicationFiled: September 26, 2023Publication date: January 11, 2024Applicant: X Display Company Technology LimitedInventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick
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Patent number: 11804431Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.Type: GrantFiled: February 14, 2022Date of Patent: October 31, 2023Assignee: Display Company Technology LimitedInventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick
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Patent number: 11488943Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: GrantFiled: September 23, 2020Date of Patent: November 1, 2022Assignee: X Display Company Technology LimitedInventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Publication number: 20220320061Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: ApplicationFiled: June 22, 2022Publication date: October 6, 2022Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Publication number: 20220165666Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.Type: ApplicationFiled: February 14, 2022Publication date: May 26, 2022Inventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick
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Patent number: 11282786Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.Type: GrantFiled: December 3, 2019Date of Patent: March 22, 2022Assignee: X Display Company Technology LimitedInventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick
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Publication number: 20210151630Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: ApplicationFiled: January 29, 2021Publication date: May 20, 2021Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Patent number: 10944027Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: GrantFiled: June 14, 2019Date of Patent: March 9, 2021Assignee: X Display Company Technology LimitedInventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Publication number: 20210043618Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: ApplicationFiled: September 23, 2020Publication date: February 11, 2021Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Publication number: 20200395510Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: ApplicationFiled: June 14, 2019Publication date: December 17, 2020Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Publication number: 20200194370Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.Type: ApplicationFiled: December 3, 2019Publication date: June 18, 2020Inventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick
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Publication number: 20200051482Abstract: A redundant pixel layout for a display comprises a display substrate and an array of pixels disposed on or over the display substrate. Each pixel comprises a first subpixel and a redundant second subpixel. The first subpixel includes a first subpixel controller electrically connected to controller wires and a first light emitter electrically connected to a first-light-emitter wire. The first light emitter is controlled by the first subpixel controller through the first-light-emitter wire. The second subpixel includes a second-subpixel-controller location connected to the controller wires and a second-light-emitter location comprising a second-light-emitter wire. The first light emitter is adjacent to the second-light-emitter location and the first light emitter and the second-light-emitter location are closer together than are any two pixels in the array of pixels.Type: ApplicationFiled: August 13, 2018Publication date: February 13, 2020Inventors: Ronald S. Cok, Erich Radauscher, Erik Paul Vick, Andrew Tyler Pearson, Christopher Andrew Bower, Matthew Alexander Meitl
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Patent number: 10418344Abstract: An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer.Type: GrantFiled: January 26, 2018Date of Patent: September 17, 2019Assignee: Micross Advanced Interconnect Technology LLCInventors: Erik Paul Vick, Dorota Temple
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Publication number: 20180151542Abstract: An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer.Type: ApplicationFiled: January 26, 2018Publication date: May 31, 2018Inventors: Erik Paul Vick, Dorota Temple
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Publication number: 20170324016Abstract: A method of forming a thermoelectric device structure and the resultant thermoelectric device structure. The method forms a first pattern of epitaxial thermoelectric elements of a first conductivity type on a first semiconductor substrate, forms a second pattern of epitaxial thermoelectric elements of a second conductivity type on a second semiconductor substrate, separates the epitaxial thermoelectric elements of the first conductivity type and places the epitaxial thermoelectric elements of the first conductivity type and the epitaxial thermoelectric elements of the second conductivity type on a heat sink, and integrates the heat sink to a device substrate including an electronic device to be cooled.Type: ApplicationFiled: May 3, 2017Publication date: November 9, 2017Applicant: RESEARCH TRIANGLE INSTITUTEInventors: Philip BARLETTA, Brian GRANT, Erik Paul VICK, Christopher GREGORY
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Patent number: 9576889Abstract: An electronic package may be fabricated by forming a first layer of insulating material on a first substrate such that the first layer covers a contact pad; forming an opening through the first layer to expose the contact pad; forming an un-patterned second layer on the first layer, the second layer including an adhesive having a viscosity less than that of the first layer, wherein a region of the second layer obstructs the contact pad; removing the region to re-expose the contact pad; aligning a second substrate with the first substrate such that a via of the second substrate is aligned with the opening; bonding the first substrate and the second substrate together at the second layer; and forming an interconnect in contact with the contact pad by depositing a conductive material through the via and the opening.Type: GrantFiled: June 25, 2013Date of Patent: February 21, 2017Assignee: Research Triangle InstituteInventor: Erik Paul Vick