Patents by Inventor Erik Probstfield

Erik Probstfield has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS
    Publication number: 20070278729
    Abstract: A method of forming a semiconductor interconnect including, in the order recited: (a) providing a semiconductor wafer; (b) forming bonding pads in a terminal wiring level on the frontside of the wafer; (c) reducing the thickness of the wafer; (d) forming solder bumps on the bonding pads; and (e) dicing the wafer into bumped semiconductor chips.
    Type: Application
    Filed: July 3, 2007
    Publication date: December 6, 2007
    Inventors: Leonard Gardecki, James Palmer, Erik Probstfield, Adolf Wirsing
  • Method for forming interconnects on thin wafers
    Publication number: 20050272241
    Abstract: A method of forming a semiconductor interconnect including, in the order recited: (a) providing a semiconductor wafer; (b) forming bonding pads in a terminal wiring level on the frontside of the wafer; (c) reducing the thickness of the wafer; (d) forming solder bumps on the bonding pads; and (e) dicing the wafer into bumped semiconductor chips.
    Type: Application
    Filed: July 19, 2005
    Publication date: December 8, 2005
    Inventors: Leonard Gardecki, James Palmer, Erik Probstfield, Adolf Wirsing