Patents by Inventor Erik Rabe

Erik Rabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for the production of electrooptical printed circuit boards comprising polysiloxane wave guides and use thereof
    Patent number: 7630592
    Abstract: The invention relates to the production of an electrooptical printed circuit board (EOLP) and to the use thereof. The optical layer in the printed circuit board is made of highly transparent and soldering bath-resistant polysiloxane wave guides. The polysiloxane wave guides are produced according to casting techniques, and the ends of the wave guides can comprise deviating mirrors which are integrated at 45°. During the casting process of the printed circuit board, the substrate layers and the supersubstrate layers made of polysiloxane are brought into contact with printed circuit board materials having microstructured spacers which are used to define the thickness of the substrate layer and/or the thickness of the supersubstrate layer. Openings are located in the printed circuit board material above the deviating mirrors, such that vertical light decoupling and coupling can take place.
    Type: Grant
    Filed: October 8, 2004
    Date of Patent: December 8, 2009
    Assignee: Universität Dortmund
    Inventors: Andreas Neyer, Erik Rabe, Stefan Kopetz
  • Method for the production of electrooptical printed circuit boards comprising polysiloxane wave guides and use thereof
    Publication number: 20070122073
    Abstract: The invention relates to the production of an electrooptical printed circuit board (EOLP) and to the use thereof. The optical layer in the printed circuit board is made of highly transparent and soldering bath-resistant polysiloxane wave guides. The polysiloxane wave guides are produced according to casting techniques, and the ends of the wave guides can comprise deviating mirrors which are integrated at 45°. During the casting process of the printed circuit board, the substrate layers and the supersubstrate layers made of polysiloxane are brought into contact with printed circuit board materials having microstructured spacers which are used to define the thickness of the substrate layer and/or the thickness of the supersubstrate layer. Openings are located in the printed circuit board material above the deviating mirrors, such that vertical light decoupling and coupling can take place.
    Type: Application
    Filed: October 8, 2004
    Publication date: May 31, 2007
    Inventors: Andreas Neyer, Erik Rabe, Stefan Kopetz