Patents by Inventor Erik Rocklinger

Erik Rocklinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060061969
    Abstract: A circuit arrangement comprises a circuit board (10), a semi-conductor (12) provided on a first side of the circuit board, and a heat sink (15) provided on a second side of the circuit board opposite to the first side and in heat transferring contact with the power semi-conductor. A heat conductive element (13) is provided in a hole (10a) in the circuit board, wherein the heat conductive element is positioned in heat transferring contact with both the semi-conductor and the heat sink for transfer of heat generated by the semi-conductor to the heat sink. A circuit arrangement is provided, wherein the provision of a low thermal resistance path through the circuit board by means of heat conductive elements provides a compact circuit arrangement well suited for assembly by means of an automated surface mounting process.
    Type: Application
    Filed: September 16, 2005
    Publication date: March 23, 2006
    Applicant: Danaher Motion Stockholm AB
    Inventors: Thord Nilson, Ulf Karlsson, Jan Berglund, Ola Ro, Carl Forborgen, Erik Rocklinger