Patents by Inventor Erik Vick

Erik Vick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible electronic assemblies with embedded electronic devices and methods for their fabrication
    Patent number: 10264669
    Abstract: A flexible electronic assembly includes a flexible current-carrying device, an electrically insulating flexible substrate, and an electronic device embedded in the substrate. The electronic device is mounted face-down on the current-carrying device such that a contact side or component side of the electronic device faces the current-carrying device and is positioned at an interface between the current-carrying device and the substrate. The current-carrying device, substrate, and electronic device are co-planar at the interface. This configuration enables the flexible electronic assembly to have an ultra-thin thickness, for example on the order of micrometers.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: April 16, 2019
    Assignee: Research Triangle Institute
    Inventors: Jay Lewis, Dorota Temple, Erik Vick, Ethan Klem
  • FLEXIBLE ELECTRONIC ASSEMBLIES WITH EMBEDDED ELECTRONIC DEVICES AND METHODS FOR THEIR FABRICATION
    Publication number: 20170064810
    Abstract: A flexible electronic assembly includes a flexible current-carrying device, an electrically insulating flexible substrate, and an electronic device embedded in the substrate. The electronic device is mounted face-down on the current-carrying device such that a contact side or component side of the electronic device faces the current-carrying device and is positioned at an interface between the current-carrying device and the substrate. The current-carrying device, substrate, and electronic device are co-planar at the interface. This configuration enables the flexible electronic assembly to have an ultra-thin thickness, for example on the order of micrometers.
    Type: Application
    Filed: April 28, 2016
    Publication date: March 2, 2017
    Inventors: Jay Lewis, Dorota Temple, Erik Vick, Ethan Klem
  • Electronic devices utilizing contact pads with protrusions and methods for fabrication
    Patent number: 9257335
    Abstract: An electronic device includes a substrate including a front side, a back side, a thickness between the front side and back side, one or more front-side vias extending from the front side into a part of the thickness, and an interconnect via extending from the back side toward the front side; a contact pad on the front side and including one or more protrusions extending through corresponding front-side vias and into the interconnect via; and an interconnect extending through the interconnect via and into contact with the protrusion(s).
    Type: Grant
    Filed: September 4, 2013
    Date of Patent: February 9, 2016
    Assignee: Research Triangle Institute
    Inventors: Erik Vick, Garry Brian Cunningham, Dorota Temple
  • ELECTRONIC DEVICES UTILIZING CONTACT PADS WITH PROTRUSIONS AND METHODS FOR FABRICATION
    Publication number: 20150235898
    Abstract: An electronic device includes a substrate including a front side, a back side, a thickness between the front side and back side, one or more front-side vias extending from the front side into a part of the thickness, and an interconnect via extending from the back side toward the front side; a contact pad on the front side and including one or more protrusions extending through corresponding front-side vias and into the interconnect via; and an interconnect extending through the interconnect via and into contact with the protrusion(s).
    Type: Application
    Filed: September 4, 2013
    Publication date: August 20, 2015
    Applicant: Research Triangle Institute
    Inventors: Erik Vick, Garry Brian Cunningham, Dorota Temple