Patents by Inventor Erik Wasinger

Erik Wasinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE
    Publication number: 20070238393
    Abstract: Methods of and systems for polishing an edge of a substrate are provided. The invention includes rotating a substrate against a polishing film so as to remove material from the edge of the substrate; and detecting an amount of one of energy and torque exerted in rotating the substrate against the polishing film. The invention may further include determining an amount of material removed from the edge of the substrate based on the detected energy or torque exerted in rotating the substrate against the polishing film; ascertaining a difference between the determined amount of material removed and a preset polish level; and determining an amount of energy or torque to be exerted in rotating the substrate adapted to attain the preset polish level based on the difference between the determined amount of material removed and the preset polish level. Numerous other aspects are provided.
    Type: Application
    Filed: March 29, 2007
    Publication date: October 11, 2007
    Inventors: Ho Shin, Gary Ettinger, Donald Olgado, Erik Wasinger, Sen-Hou Ko, Charles Dodds, Yufei Chen, Wei-Yung Hsu
  • Methods and apparatus for processing a substrate
    Publication number: 20070131653
    Abstract: Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.
    Type: Application
    Filed: December 9, 2005
    Publication date: June 14, 2007
    Inventors: Gary Ettinger, Erik Wasinger, Sen-Hou Ko, Wui-Yung Hsu, Liang-Yuh Chen, Ho Shin, Donald Olgado
  • Methods and apparatus for processing a substrate
    Publication number: 20070131654
    Abstract: Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.
    Type: Application
    Filed: December 9, 2005
    Publication date: June 14, 2007
    Applicant: Applied Materials, Inc.
    Inventors: Erik Wasinger, Gary Ettinger, Sen-Hou Ko, Wei-Yung Hsu, Liang-Yuh Chen, Ho Shin, Donald Olgado