Patents by Inventor Erik Weisbrod

Erik Weisbrod has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ARRANGEMENT FOR A SEMICONDUCTOR ARRANGEMENT COMPRISING AT LEAST ONE PASSIVE COMPONENT AND A SUBSTRATE
    Publication number: 20250112142
    Abstract: An arrangement for a semiconductor arrangement includes a substrate including a dielectric material layer and a first metallization arranged on the dielectric material layer. A passive component is arranged completely in a cutout of the first metallization and bears directly on the dielectric material layer. The passive component is designed to include a first profile. The the first metallization includes a second profile in a region of contacting with the passive component, with the first and second profiles engaging with one another.
    Type: Application
    Filed: November 28, 2022
    Publication date: April 3, 2025
    Applicant: Siemens Aktiengesellschaft
    Inventors: MARKUS LASCH, ROLAND LORZ, MARKUS PFEIFER, STEFAN STEGMEIER, ERIK WEISBROD, RONNY WERNER, FELIX ZEYSS
  • Method for producing conductive tracks, and electronic module
    Patent number: 12183710
    Abstract: Various embodiments include a method for producing a least one conductive track comprising: forming a surface with a thermoplastic; and depositing conductive track material on the surface by thermal spraying.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: December 31, 2024
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Alexander Hensel, Stefan Stegmeier, Caroline Cassignol, Dulijano Pecanac, Oliver Raab, Erik Weisbrod
  • Electronic module, method for producing an electronic module, and industrial plant
    Patent number: 12082333
    Abstract: Various embodiments of the teachings herein include an electronic module comprising: a circuit carrier with an electrically conductive thick film with a thickness of at least 0.5 millimeter; and a plurality of thermally conductive elements connected to one another by a thermally conductive material. The thermally conductive elements have a base area with rotational symmetry.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: September 3, 2024
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Hubert Baueregger, Albrecht Donat, Axel Ganster, Franziska Lambrecht, Markus Lasch, Stefan Stegmeier, Erik Weisbrod, Jörg Zapf
  • Medical Imaging Apparatus with a Functional Housing Shell
    Publication number: 20230278078
    Abstract: The disclosure is based on a medical imaging apparatus with a scanner, a patient support apparatus and a housing, which is arranged on the scanner and/or on the patient support apparatus, wherein the housing comprises at least one functional housing shell, wherein the at least one functional housing shell comprises at least one sensor element for detection of a hygiene status on the at least one functional housing shell, at least one output element, which is embodied for a visual display of the hygiene status, and at least one cleaning element for cleaning a surface of the at least one functional housing shell.
    Type: Application
    Filed: March 1, 2023
    Publication date: September 7, 2023
    Applicant: Siemens Healthcare GmbH
    Inventors: Michael Ott, Martin Seifert, Erik Weisbrod, Stefan Stegmeier
  • Electronic Module, Method for Producing an Electronic Module, and Industrial Plant
    Publication number: 20230074572
    Abstract: Various embodiments of the teachings herein include an electronic module comprising: a circuit carrier with an electrically conductive thick film with a thickness of at least 0.5 millimeter; and a plurality of thermally conductive elements connected to one another by a thermally conductive material. The thermally conductive elements have a base area with rotational symmetry.
    Type: Application
    Filed: January 28, 2021
    Publication date: March 9, 2023
    Applicant: Siemens Aktiengesellschaft
    Inventors: Hubert Baueregger, Albrecht Donat, Axel Ganster, Franziska Lambrecht, Markus Lasch, Stefan Stegmeier, Erik Weisbrod, Jörg Zapf
  • Method for Producing Conductive Tracks, and Electronic Module
    Publication number: 20210202434
    Abstract: Various embodiments include a method for producing a least one conductive track comprising: forming a surface with a thermoplastic; and depositing conductive track material on the surface by thermal spraying.
    Type: Application
    Filed: August 30, 2019
    Publication date: July 1, 2021
    Applicant: Siemens Aktiengesellschaft
    Inventors: Alexander Hensel, Stefan Stegmeier, Caroline Cassignol, Dulijano Pecanac, Oliver Raab, Erik Weisbrod