Patents by Inventor Erik William Peter

Erik William Peter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mounting capacitors under ball grid array
    Publication number: 20040125580
    Abstract: An apparatus is disclosed. The apparatus has a printed circuit board and one or several integrated circuit substrates mounted to the printed circuit board. At least one SMT component with two or more terminals is arranged between the printed circuit board and the package. In one embodiment, the SMT component replaces interconnects in the ball grid array used to mount the substrate to the printed circuit board while simultaneously connecting the SMT terminals to the substrate and the printed circuit board. The disclosed apparatus of SMT components mount results in significant reduction of inductance of the SMT connection to the substrate.
    Type: Application
    Filed: December 31, 2002
    Publication date: July 1, 2004
    Applicant: Intel Corporation
    Inventors: Chee Yee Chung, Erik William Peter, Alexander Waizman