Patents by Inventor Erik Wilson
Erik Wilson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12117867Abstract: A divider screen is described in various embodiments having various numbers of screens and screen members, and various arrangements. One divider screen has a post, a first screen member and a second screen member. The first screen member has a first screen attached to a first rotation member. The first rotation member is rotatably located to the post with the first screen member rotatable about the post. The second screen member has a second screen attached to a second rotation member. The second rotation member is rotatably located to the post with the second screen member rotatable about the post. The first and second screen members are arrangeable in at least a closed 0° position, an open 90° position, and an open 180° position.Type: GrantFiled: May 17, 2021Date of Patent: October 15, 2024Assignee: PAIR, LLCInventors: Brian Wilson, Elliot Whalen, Benjamin Edmund Hopkins, Erik Ruzich
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Publication number: 20240303748Abstract: Systems and methods for determining an event and resulting damage using crowdsourced data are disclosed. A computer-implemented method in accordance with the present disclosure may comprise (i) receiving hazard event data; (ii) retrieving supplemental hazard event data (e.g., crowdsourced, donated, and/or public text data, image data, video data, and/or audio data) associated with the hazard event; (iii) applying the supplemental hazard event data to the trained event assessment model to generate model outputs; (iv) determining a recommendation based upon model outputs; and (v) transmitting a message.Type: ApplicationFiled: March 6, 2024Publication date: September 12, 2024Inventors: Rick Lovings, Jody A. Thoele, Erik Skyten, Joann C. Yant, Joshua Sutter, Miguel A. Garcia-Peguero, Shawn R. Harbaugh, Tishauna Wilson
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Publication number: 20240303795Abstract: A computer system may include at least one memory and at least one processor in communication with the at least one memory. The processor may be programmed to: (1) receive photographic data including one or more images of a structure; (2) in response to receiving the photographic data, apply the photographic data to a structure assessment model configured to determine a structural status of the structure, wherein the structure assessment model is trained using historical photographic data including a plurality of historical images of structures; (3) receive an output from the structure assessment model, wherein the output at least one determined characteristic of the structure; and/or (4) based upon the output, transmit a message to a user computing device associated with the structure that causes display of the determined characteristic.Type: ApplicationFiled: March 6, 2024Publication date: September 12, 2024Inventors: Rick Lovings, Jody A. Thoele, Erik Skyten, Joann C. Yant, Joshua Sutter, Miguel A. Garcia-Peguero, Shawn R. Harbaugh, Tishauna Wilson
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Publication number: 20240303747Abstract: A computer system may include at least one memory and at least one processor in communication with the at least one memory. The processor may be programmed to: (1) receive photographic data including one or more images of a structure; (2) in response to receiving the photographic data, apply the photographic data to a structure assessment model configured to determine a structural status of the structure, wherein the structure assessment model is trained using historical photographic data including a plurality of historical images of structures; (3) receive an output from the structure assessment model, wherein the output at least one determined characteristic of the structure; and/or (4) based upon the output, transmit a message to a user computing device associated with the structure that causes display of the determined characteristic.Type: ApplicationFiled: March 6, 2024Publication date: September 12, 2024Inventors: Rick Lovings, Jody A. Thoele, Erik Skyten, Joann C. Yant, Joshua Sutter, Miguel A. Garcia-Peguero, Shawn R. Harbaugh, Tishauna Wilson
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Publication number: 20240057994Abstract: An incisionless fully endoscopic method of reducing the capacity of the stomach is provided to surgically treat obesity. The method is directed to endoluminal tissue approximation of a portion of the stomach, including at least a portion of the greater curvature thereof. The method includes a pattern of stitching in which a portion of the stomach is closed off. One stitching pattern causes the lateral portion of the stomach to be drawn to reduce the usable volume of the stomach while maintaining a pathway from the esophagus to the pylorus. As the stitching pattern advances, the fundus is automatically drawn downward so that it may be endoscopically approached for stitching in a facilitated manner According to another aspect of the invention, another stitching pattern extends from the antrum to the fundus between the anterior and posterior portions of the stomach.Type: ApplicationFiled: October 27, 2023Publication date: February 22, 2024Applicant: BOSTON SCIENTIFIC SCIMED, INC.Inventors: Alonso Alvarado, Manoel Galvao, Eddie Gomez, Nicole Pena, Sohail Shaikh, Chris Thompson, Erik Wilson, Natan Zundel, Robert Lulo, Ted Stephens
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Patent number: 11832808Abstract: An incisionless fully endoscopic method of reducing the capacity of the stomach is provided to surgically treat obesity. The method is directed to endoluminal tissue approximation of a portion of the stomach, including at least a portion of the greater curvature thereof. The method includes a pattern of stitching in which a portion of the stomach is closed off. One stitching pattern causes the lateral portion of the stomach to be drawn to reduce the usable volume of the stomach while maintaining a pathway from the esophagus to the pylorus. As the stitching pattern advances, the fundus is automatically drawn downward so that it may be endoscopically approached for stitching in a facilitated manner. According to another aspect of the invention, another stitching pattern extends from the antrum to the fundus between the anterior and posterior portions of the stomach.Type: GrantFiled: April 29, 2019Date of Patent: December 5, 2023Assignee: Apollo Endosurgery US, Inc.Inventors: Alonso Alvarado, Manoel Galvao, Eddie Gomez, Nicole Pena, Sohail Shaikh, Chris Thompson, Erik Wilson, Natan Zundel, Robert Lulo, Ted Stephens
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Publication number: 20210367434Abstract: A method is provided comprising: detecting a connection between an electronic device and a battery charger; transmitting to the battery charger a first request for at least one of a first voltage level and a first current level; receiving from the battery charger a signal; and charging a battery of the electronic device with the signal.Type: ApplicationFiled: August 9, 2021Publication date: November 25, 2021Inventors: Ku-Chul JUNG, Erik Wilson MAIER, Oscar FREITAS, Kisun LEE, Chul-Eun YUN, Kwang-Sub LEE
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Patent number: 11121559Abstract: A method is provided comprising: detecting a connection between an electronic device and a battery charger; transmitting to the battery charger a first request for at least one of a first voltage level and a first current level; receiving from the battery charger a signal; and charging a battery of the electronic device with the signal.Type: GrantFiled: November 19, 2018Date of Patent: September 14, 2021Assignees: Samsung Electronics Co., Ltd., Fairchild Korea Semiconductor Ltd.Inventors: Ku-Chul Jung, Erik Wilson Maier, Oscar Freitas, Kisun Lee, Chul-Eun Yun, Kwang-Sub Lee
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Publication number: 20190247041Abstract: An incisionless fully endoscopic method of reducing the capacity of the stomach is provided to surgically treat obesity. The method is directed to endoluminal tissue approximation of a portion of the stomach, including at least a portion of the greater curvature thereof. The method includes a pattern of stitching in which a portion of the stomach is closed off. One stitching pattern causes the lateral portion of the stomach to be drawn to reduce the usable volume of the stomach while maintaining a pathway from the esophagus to the pylorus. As the stitching pattern advances, the fundus is automatically drawn downward so that it may be endoscopically approached for stitching in a facilitated manner. According to another aspect of the invention, another stitching pattern extends from the antrum to the fundus between the anterior and posterior portions of the stomach.Type: ApplicationFiled: April 29, 2019Publication date: August 15, 2019Applicant: Apollo Endosurgery US, Inc.Inventors: Alonso Alvarado, Manoel Galvao, Eddie Gomez, Nicole Pena, Sohail Shaikh, Chris Thompson, Erik Wilson, Natan Zundel, Robert Lulo, Ted Stephens
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Publication number: 20190097431Abstract: A method is provided comprising: detecting a connection between an electronic device and a battery charger; transmitting to the battery charger a first request for at least one of a first voltage level and a first current level; receiving from the battery charger a signal; and charging a battery of the electronic device with the signal.Type: ApplicationFiled: November 19, 2018Publication date: March 28, 2019Inventors: Ku-Chul JUNG, Erik Wilson MAIER, Oscar FREITAS, Kisun LEE, Chul-Eun YUN, Kwang-Sub LEE
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Patent number: 10135263Abstract: A method is provided comprising: detecting a connection between an electronic device and a battery charger; transmitting to the battery charger a first request for at least one of a first voltage level and a first current level; receiving from the battery charger a signal; and charging a battery of the electronic device with the signal.Type: GrantFiled: December 19, 2014Date of Patent: November 20, 2018Assignees: Samsung Electronics Co., Ltd, Fairchild Korea Semiconductor Ltd.Inventors: Ku-Chul Jung, Erik Wilson Maier, Oscar Freitas, Kisun Lee, Chul-Eun Yun, Kwang-Sub Lee
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Patent number: 9299643Abstract: An electrically conductive interconnect is provided through an opening in a dielectric layer, electrically connecting two conductive layers. In one embodiment, the interconnect is formed by ruthenium entirely filling the opening in the dielectric layer. In another embodiment, an adhesion layer of titanium is provided in the opening prior to providing the ruthenium. In using this approach, an aspect ratio (i.e., the ratio of the length of the interconnect to the width thereof) of 20:1 or greater is achievable.Type: GrantFiled: September 29, 2008Date of Patent: March 29, 2016Assignee: Cypress Semiconductor CorporationInventors: Zheng Wang, Connie Wang, Erik Wilson, Wen Yu, Robert Chiu
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Publication number: 20150180244Abstract: A method is provided comprising: detecting a connection between an electronic device and a battery charger; transmitting to the battery charger a first request for at least one of a first voltage level and a first current level; receiving from the battery charger a signal; and charging a battery of the electronic device with the signal.Type: ApplicationFiled: December 19, 2014Publication date: June 25, 2015Inventors: Ku-Chul JUNG, Erik Wilson MAIER, Oscar FREITAS, Kisun LEE, Chul-Eun YUN, Kwang-Sub LEE
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Publication number: 20150126983Abstract: An incisionless fully endoscopic method of reducing the capacity of the stomach is provided to surgically treat obesity. The method is directed to endoluminal tissue approximation of a portion of the stomach, including at least a portion of the greater curvature thereof. The method includes a pattern of stitching in which a portion of the stomach is closed off. One stitching pattern causes the lateral portion of the stomach to be drawn to reduce the usable volume of the stomach while maintaining a pathway from the esophagus to the pylorus. As the stitching pattern advances, the fundus is automatically drawn downward so that it may be endoscopically approached for stitching in a facilitated manner. According to another aspect of the invention, another stitching pattern extends from the antrum to the fundus between the anterior and posterior portions of the stomach.Type: ApplicationFiled: October 7, 2014Publication date: May 7, 2015Applicant: APOLLO ENDOSURGERY, INC.Inventors: Alonso Alvarado, Manoel Galvao, Eddie Gomez, Nicole Pena, Sohail Shaikh, Chris Thompson, Erik Wilson, Natan Zundel, Robert Lulo, Ted Stephens
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Patent number: 8415256Abstract: During semiconductor fabrication homogeneous gap-filling is achieved by depositing a thin dielectric layer into the gap, post deposition curing, and then repeating deposition and post deposition curing until gap-filling is completed. Embodiments include depositing a layer of low deposition temperature gap-fill dielectric into a high aspect ratio opening, such as a shallow trench or a gap between closely spaced apart gate electrode structures, as at a thickness of about 10 ? to about 500 ?, curing after deposition, as by UV radiation or by heating at a temperature of about 400° C. to about 1000° C., depositing another layer of low deposition temperature gap-filled dielectric, and curing after deposition. Embodiments include separately depositing and separately curing multiple layers.Type: GrantFiled: December 30, 2010Date of Patent: April 9, 2013Inventors: Alexander Nickel, Lu You, Hirokazu Tokuno, Minh Tran, Minh Van Ngo, Hieu Pham, Erik Wilson, Robert Huertas
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Patent number: 8202810Abstract: A method for forming a single damascene and/or dual damascene, contact and interconnect structure, comprising: performing front end processing, depositing copper including a copper barrier, annealing the copper in at least 90% N2 with less than 10% H2, performing planarization, performing in-situ low-H NH3 plasma treatment and low Si—H SiN etch stop layer deposition, and performing remaining back end processing.Type: GrantFiled: January 9, 2008Date of Patent: June 19, 2012Assignee: Spansion LLCInventors: Alexander H. Nickel, Allen L. Evans, Minh Quoc Tran, Lu You, Minh Van Ngo, Pei-Yuan Gao, William S. Brennan, Erik Wilson, Sung Jin Kim, Hieu Trung Pham
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Patent number: 8026169Abstract: Data retention in flash memory devices, such as mirrorbit devices, is improved by reducing the generation and/or diffusion of hydrogen ions during back end processing, such as annealing inlaid Cu. Embodiments include annealing inlaid Cu in an N2 atmosphere containing low H2 or no H2, and at temperatures less than 200° C., e.g., 100° C. to 150° C.Type: GrantFiled: November 6, 2006Date of Patent: September 27, 2011Assignee: Advanced Micro Devices, Inc.Inventors: Lu You, Alexander Nickel, Minh Q. Tran, Minh-Van Ngo, Hieu Pham, Erik Wilson, Hirokazu Tokuno, Amir Hossein Jafarpour, Inkuk Kang, Robert Huertas
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Patent number: 7884030Abstract: During semiconductor fabrication homogeneous gap-filling is achieved by depositing a thin dielectric layer into the gap, post deposition curing, and then repeating deposition and post deposition curing until gap-filling is completed. Embodiments include depositing a layer of low deposition temperature gap-fill dielectric into a high aspect ratio opening, such as a shallow trench or a gap between closely spaced apart gate electrode structures, as at a thickness of about 10 ? to about 500 ?, curing after deposition, as by UV radiation or by heating at a temperature of about 400° C. to about 1000° C., depositing another layer of low deposition temperature gap-filled dielectric, and curing after deposition. Embodiments include separately depositing and separately curing multiple layers.Type: GrantFiled: April 21, 2006Date of Patent: February 8, 2011Assignee: Advanced Micro Devices, Inc. and Spansion LLCInventors: Alexander Nickel, Lu You, Hirokazu Tokuno, Minh Tran, Minh Van Ngo, Hieu Pham, Erik Wilson, Robert Huertas
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Publication number: 20100270845Abstract: A modular seat frame for a school bus seat includes riser assemblies for supporting the seat fabricated from a moldable material reinforced locally by attachment and reinforcement members.Type: ApplicationFiled: April 28, 2009Publication date: October 28, 2010Applicant: International Truck Intellectual Property Company LLCInventors: Erik Wilson, Yogesh Dattatraya Aundhkar, Atul Prabhakar Khanapurkar, Narasimha Dhanayutham Gupta
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Publication number: 20100078815Abstract: An electrically conductive interconnect is provided through an opening in a dielectric layer, electrically connecting two conductive layers. In one embodiment, the interconnect is formed by ruthenium entirely filling the opening in the dielectric layer. In another embodiment, an adhesion layer of titanium is provided in the opening prior to providing the ruthenium. In using this approach, an aspect ratio (i.e., the ratio of the length of the interconnect to the width thereof) of 20:1 or greater is achievable.Type: ApplicationFiled: September 29, 2008Publication date: April 1, 2010Inventors: Zheng Wang, Connie Wang, Erik Wilson, Wen Yu, Robert Chiu