Patents by Inventor Erik Wilson

Erik Wilson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12117867
    Abstract: A divider screen is described in various embodiments having various numbers of screens and screen members, and various arrangements. One divider screen has a post, a first screen member and a second screen member. The first screen member has a first screen attached to a first rotation member. The first rotation member is rotatably located to the post with the first screen member rotatable about the post. The second screen member has a second screen attached to a second rotation member. The second rotation member is rotatably located to the post with the second screen member rotatable about the post. The first and second screen members are arrangeable in at least a closed 0° position, an open 90° position, and an open 180° position.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: October 15, 2024
    Assignee: PAIR, LLC
    Inventors: Brian Wilson, Elliot Whalen, Benjamin Edmund Hopkins, Erik Ruzich
  • Publication number: 20240303748
    Abstract: Systems and methods for determining an event and resulting damage using crowdsourced data are disclosed. A computer-implemented method in accordance with the present disclosure may comprise (i) receiving hazard event data; (ii) retrieving supplemental hazard event data (e.g., crowdsourced, donated, and/or public text data, image data, video data, and/or audio data) associated with the hazard event; (iii) applying the supplemental hazard event data to the trained event assessment model to generate model outputs; (iv) determining a recommendation based upon model outputs; and (v) transmitting a message.
    Type: Application
    Filed: March 6, 2024
    Publication date: September 12, 2024
    Inventors: Rick Lovings, Jody A. Thoele, Erik Skyten, Joann C. Yant, Joshua Sutter, Miguel A. Garcia-Peguero, Shawn R. Harbaugh, Tishauna Wilson
  • Publication number: 20240303795
    Abstract: A computer system may include at least one memory and at least one processor in communication with the at least one memory. The processor may be programmed to: (1) receive photographic data including one or more images of a structure; (2) in response to receiving the photographic data, apply the photographic data to a structure assessment model configured to determine a structural status of the structure, wherein the structure assessment model is trained using historical photographic data including a plurality of historical images of structures; (3) receive an output from the structure assessment model, wherein the output at least one determined characteristic of the structure; and/or (4) based upon the output, transmit a message to a user computing device associated with the structure that causes display of the determined characteristic.
    Type: Application
    Filed: March 6, 2024
    Publication date: September 12, 2024
    Inventors: Rick Lovings, Jody A. Thoele, Erik Skyten, Joann C. Yant, Joshua Sutter, Miguel A. Garcia-Peguero, Shawn R. Harbaugh, Tishauna Wilson
  • Publication number: 20240303747
    Abstract: A computer system may include at least one memory and at least one processor in communication with the at least one memory. The processor may be programmed to: (1) receive photographic data including one or more images of a structure; (2) in response to receiving the photographic data, apply the photographic data to a structure assessment model configured to determine a structural status of the structure, wherein the structure assessment model is trained using historical photographic data including a plurality of historical images of structures; (3) receive an output from the structure assessment model, wherein the output at least one determined characteristic of the structure; and/or (4) based upon the output, transmit a message to a user computing device associated with the structure that causes display of the determined characteristic.
    Type: Application
    Filed: March 6, 2024
    Publication date: September 12, 2024
    Inventors: Rick Lovings, Jody A. Thoele, Erik Skyten, Joann C. Yant, Joshua Sutter, Miguel A. Garcia-Peguero, Shawn R. Harbaugh, Tishauna Wilson
  • Publication number: 20240057994
    Abstract: An incisionless fully endoscopic method of reducing the capacity of the stomach is provided to surgically treat obesity. The method is directed to endoluminal tissue approximation of a portion of the stomach, including at least a portion of the greater curvature thereof. The method includes a pattern of stitching in which a portion of the stomach is closed off. One stitching pattern causes the lateral portion of the stomach to be drawn to reduce the usable volume of the stomach while maintaining a pathway from the esophagus to the pylorus. As the stitching pattern advances, the fundus is automatically drawn downward so that it may be endoscopically approached for stitching in a facilitated manner According to another aspect of the invention, another stitching pattern extends from the antrum to the fundus between the anterior and posterior portions of the stomach.
    Type: Application
    Filed: October 27, 2023
    Publication date: February 22, 2024
    Applicant: BOSTON SCIENTIFIC SCIMED, INC.
    Inventors: Alonso Alvarado, Manoel Galvao, Eddie Gomez, Nicole Pena, Sohail Shaikh, Chris Thompson, Erik Wilson, Natan Zundel, Robert Lulo, Ted Stephens
  • Patent number: 11832808
    Abstract: An incisionless fully endoscopic method of reducing the capacity of the stomach is provided to surgically treat obesity. The method is directed to endoluminal tissue approximation of a portion of the stomach, including at least a portion of the greater curvature thereof. The method includes a pattern of stitching in which a portion of the stomach is closed off. One stitching pattern causes the lateral portion of the stomach to be drawn to reduce the usable volume of the stomach while maintaining a pathway from the esophagus to the pylorus. As the stitching pattern advances, the fundus is automatically drawn downward so that it may be endoscopically approached for stitching in a facilitated manner. According to another aspect of the invention, another stitching pattern extends from the antrum to the fundus between the anterior and posterior portions of the stomach.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: December 5, 2023
    Assignee: Apollo Endosurgery US, Inc.
    Inventors: Alonso Alvarado, Manoel Galvao, Eddie Gomez, Nicole Pena, Sohail Shaikh, Chris Thompson, Erik Wilson, Natan Zundel, Robert Lulo, Ted Stephens
  • Publication number: 20210367434
    Abstract: A method is provided comprising: detecting a connection between an electronic device and a battery charger; transmitting to the battery charger a first request for at least one of a first voltage level and a first current level; receiving from the battery charger a signal; and charging a battery of the electronic device with the signal.
    Type: Application
    Filed: August 9, 2021
    Publication date: November 25, 2021
    Inventors: Ku-Chul JUNG, Erik Wilson MAIER, Oscar FREITAS, Kisun LEE, Chul-Eun YUN, Kwang-Sub LEE
  • Patent number: 11121559
    Abstract: A method is provided comprising: detecting a connection between an electronic device and a battery charger; transmitting to the battery charger a first request for at least one of a first voltage level and a first current level; receiving from the battery charger a signal; and charging a battery of the electronic device with the signal.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: September 14, 2021
    Assignees: Samsung Electronics Co., Ltd., Fairchild Korea Semiconductor Ltd.
    Inventors: Ku-Chul Jung, Erik Wilson Maier, Oscar Freitas, Kisun Lee, Chul-Eun Yun, Kwang-Sub Lee
  • Publication number: 20190247041
    Abstract: An incisionless fully endoscopic method of reducing the capacity of the stomach is provided to surgically treat obesity. The method is directed to endoluminal tissue approximation of a portion of the stomach, including at least a portion of the greater curvature thereof. The method includes a pattern of stitching in which a portion of the stomach is closed off. One stitching pattern causes the lateral portion of the stomach to be drawn to reduce the usable volume of the stomach while maintaining a pathway from the esophagus to the pylorus. As the stitching pattern advances, the fundus is automatically drawn downward so that it may be endoscopically approached for stitching in a facilitated manner. According to another aspect of the invention, another stitching pattern extends from the antrum to the fundus between the anterior and posterior portions of the stomach.
    Type: Application
    Filed: April 29, 2019
    Publication date: August 15, 2019
    Applicant: Apollo Endosurgery US, Inc.
    Inventors: Alonso Alvarado, Manoel Galvao, Eddie Gomez, Nicole Pena, Sohail Shaikh, Chris Thompson, Erik Wilson, Natan Zundel, Robert Lulo, Ted Stephens
  • Publication number: 20190097431
    Abstract: A method is provided comprising: detecting a connection between an electronic device and a battery charger; transmitting to the battery charger a first request for at least one of a first voltage level and a first current level; receiving from the battery charger a signal; and charging a battery of the electronic device with the signal.
    Type: Application
    Filed: November 19, 2018
    Publication date: March 28, 2019
    Inventors: Ku-Chul JUNG, Erik Wilson MAIER, Oscar FREITAS, Kisun LEE, Chul-Eun YUN, Kwang-Sub LEE
  • Patent number: 10135263
    Abstract: A method is provided comprising: detecting a connection between an electronic device and a battery charger; transmitting to the battery charger a first request for at least one of a first voltage level and a first current level; receiving from the battery charger a signal; and charging a battery of the electronic device with the signal.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: November 20, 2018
    Assignees: Samsung Electronics Co., Ltd, Fairchild Korea Semiconductor Ltd.
    Inventors: Ku-Chul Jung, Erik Wilson Maier, Oscar Freitas, Kisun Lee, Chul-Eun Yun, Kwang-Sub Lee
  • Patent number: 9299643
    Abstract: An electrically conductive interconnect is provided through an opening in a dielectric layer, electrically connecting two conductive layers. In one embodiment, the interconnect is formed by ruthenium entirely filling the opening in the dielectric layer. In another embodiment, an adhesion layer of titanium is provided in the opening prior to providing the ruthenium. In using this approach, an aspect ratio (i.e., the ratio of the length of the interconnect to the width thereof) of 20:1 or greater is achievable.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: March 29, 2016
    Assignee: Cypress Semiconductor Corporation
    Inventors: Zheng Wang, Connie Wang, Erik Wilson, Wen Yu, Robert Chiu
  • Publication number: 20150180244
    Abstract: A method is provided comprising: detecting a connection between an electronic device and a battery charger; transmitting to the battery charger a first request for at least one of a first voltage level and a first current level; receiving from the battery charger a signal; and charging a battery of the electronic device with the signal.
    Type: Application
    Filed: December 19, 2014
    Publication date: June 25, 2015
    Inventors: Ku-Chul JUNG, Erik Wilson MAIER, Oscar FREITAS, Kisun LEE, Chul-Eun YUN, Kwang-Sub LEE
  • Publication number: 20150126983
    Abstract: An incisionless fully endoscopic method of reducing the capacity of the stomach is provided to surgically treat obesity. The method is directed to endoluminal tissue approximation of a portion of the stomach, including at least a portion of the greater curvature thereof. The method includes a pattern of stitching in which a portion of the stomach is closed off. One stitching pattern causes the lateral portion of the stomach to be drawn to reduce the usable volume of the stomach while maintaining a pathway from the esophagus to the pylorus. As the stitching pattern advances, the fundus is automatically drawn downward so that it may be endoscopically approached for stitching in a facilitated manner. According to another aspect of the invention, another stitching pattern extends from the antrum to the fundus between the anterior and posterior portions of the stomach.
    Type: Application
    Filed: October 7, 2014
    Publication date: May 7, 2015
    Applicant: APOLLO ENDOSURGERY, INC.
    Inventors: Alonso Alvarado, Manoel Galvao, Eddie Gomez, Nicole Pena, Sohail Shaikh, Chris Thompson, Erik Wilson, Natan Zundel, Robert Lulo, Ted Stephens
  • Patent number: 8415256
    Abstract: During semiconductor fabrication homogeneous gap-filling is achieved by depositing a thin dielectric layer into the gap, post deposition curing, and then repeating deposition and post deposition curing until gap-filling is completed. Embodiments include depositing a layer of low deposition temperature gap-fill dielectric into a high aspect ratio opening, such as a shallow trench or a gap between closely spaced apart gate electrode structures, as at a thickness of about 10 ? to about 500 ?, curing after deposition, as by UV radiation or by heating at a temperature of about 400° C. to about 1000° C., depositing another layer of low deposition temperature gap-filled dielectric, and curing after deposition. Embodiments include separately depositing and separately curing multiple layers.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: April 9, 2013
    Inventors: Alexander Nickel, Lu You, Hirokazu Tokuno, Minh Tran, Minh Van Ngo, Hieu Pham, Erik Wilson, Robert Huertas
  • Patent number: 8202810
    Abstract: A method for forming a single damascene and/or dual damascene, contact and interconnect structure, comprising: performing front end processing, depositing copper including a copper barrier, annealing the copper in at least 90% N2 with less than 10% H2, performing planarization, performing in-situ low-H NH3 plasma treatment and low Si—H SiN etch stop layer deposition, and performing remaining back end processing.
    Type: Grant
    Filed: January 9, 2008
    Date of Patent: June 19, 2012
    Assignee: Spansion LLC
    Inventors: Alexander H. Nickel, Allen L. Evans, Minh Quoc Tran, Lu You, Minh Van Ngo, Pei-Yuan Gao, William S. Brennan, Erik Wilson, Sung Jin Kim, Hieu Trung Pham
  • Patent number: 8026169
    Abstract: Data retention in flash memory devices, such as mirrorbit devices, is improved by reducing the generation and/or diffusion of hydrogen ions during back end processing, such as annealing inlaid Cu. Embodiments include annealing inlaid Cu in an N2 atmosphere containing low H2 or no H2, and at temperatures less than 200° C., e.g., 100° C. to 150° C.
    Type: Grant
    Filed: November 6, 2006
    Date of Patent: September 27, 2011
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Lu You, Alexander Nickel, Minh Q. Tran, Minh-Van Ngo, Hieu Pham, Erik Wilson, Hirokazu Tokuno, Amir Hossein Jafarpour, Inkuk Kang, Robert Huertas
  • Patent number: 7884030
    Abstract: During semiconductor fabrication homogeneous gap-filling is achieved by depositing a thin dielectric layer into the gap, post deposition curing, and then repeating deposition and post deposition curing until gap-filling is completed. Embodiments include depositing a layer of low deposition temperature gap-fill dielectric into a high aspect ratio opening, such as a shallow trench or a gap between closely spaced apart gate electrode structures, as at a thickness of about 10 ? to about 500 ?, curing after deposition, as by UV radiation or by heating at a temperature of about 400° C. to about 1000° C., depositing another layer of low deposition temperature gap-filled dielectric, and curing after deposition. Embodiments include separately depositing and separately curing multiple layers.
    Type: Grant
    Filed: April 21, 2006
    Date of Patent: February 8, 2011
    Assignee: Advanced Micro Devices, Inc. and Spansion LLC
    Inventors: Alexander Nickel, Lu You, Hirokazu Tokuno, Minh Tran, Minh Van Ngo, Hieu Pham, Erik Wilson, Robert Huertas
  • Publication number: 20100270845
    Abstract: A modular seat frame for a school bus seat includes riser assemblies for supporting the seat fabricated from a moldable material reinforced locally by attachment and reinforcement members.
    Type: Application
    Filed: April 28, 2009
    Publication date: October 28, 2010
    Applicant: International Truck Intellectual Property Company LLC
    Inventors: Erik Wilson, Yogesh Dattatraya Aundhkar, Atul Prabhakar Khanapurkar, Narasimha Dhanayutham Gupta
  • Publication number: 20100078815
    Abstract: An electrically conductive interconnect is provided through an opening in a dielectric layer, electrically connecting two conductive layers. In one embodiment, the interconnect is formed by ruthenium entirely filling the opening in the dielectric layer. In another embodiment, an adhesion layer of titanium is provided in the opening prior to providing the ruthenium. In using this approach, an aspect ratio (i.e., the ratio of the length of the interconnect to the width thereof) of 20:1 or greater is achievable.
    Type: Application
    Filed: September 29, 2008
    Publication date: April 1, 2010
    Inventors: Zheng Wang, Connie Wang, Erik Wilson, Wen Yu, Robert Chiu