Abstract: A liquid cooling device comprises a heat spreader disposed along a plurality of memory modules on a dual in-line memory module (DIMM), a cold rail block extending along the heat spreader and a compressible thermal adapter interleaved between the cold rail block and the memory modules. The thermal adapter is compressible in a direction perpendicular to the plane of the DIMM board, thus allowing the components of the cooling device to be moved and adjusted relative to each other in a direction perpendicular to the plane of the DIMM. In a preferred embodiment, matching smooth surfaces of adjacent components within the cooling device are collated with a lubricant, thus permitting a low-friction gliding of these components relative to each other and allowing the DIMM to be easily removed from the cooling device and to be replaced without effort and without tooling.

Abstract: A liquid cooling device comprises a heat spreader disposed along a plurality of memory modules on a dual in-line memory module (DIMM), a cold rail block extending along the heat spreader and a compressible thermal adapter interleaved between the cold rail block and the memory modules. The thermal adapter is compressible in a direction perpendicular to the plane of the DIMM board, thus allowing the components of the cooling device to be moved and adjusted relative to each other in a direction perpendicular to the plane of the DIMM. In a preferred embodiment, matching smooth surfaces of adjacent components within the cooling device are collated with a lubricant, thus permitting a low-friction gliding of these components relative to each other and allowing the DIMM to be easily removed from the cooling device and to be replaced without effort and without tooling.