Abstract: The disclosure relates to systems and methods for dynamic release planning for insect release. One example method includes receiving information indicating a population of wild insects within a geographic region; determining a number of wild insects per unit area within the geographic region; placing, based on the number of wild insects per unit area, one or more insect release points based on the number of wild insects per unit area, each insect release point indicating a release of a predefined quantity of insects; and generating an insect release route through the geographic region, the insect release route passing through each insect release point.

Abstract: One example method includes receiving information indicating a population of wild insects within a geographic region; determining a number of wild insects per unit area within the geographic region; placing, based on the number of wild insects per unit area, one or more insect release points based on the number of wild insects per unit area, each insect release point indicating a release of a predefined quantity of insects; and generating an insect release route through the geographic region, the insect release route passing through each insect release point.

Abstract: The disclosure relates to systems and methods for dynamic release planning for insect release. One example method includes receiving information indicating a population of wild insects within a geographic region; determining a number of wild insects per unit area within the geographic region; placing, based on the number of wild insects per unit area, one or more insect release points based on the number of wild insects per unit area, each insect release point indicating a release of a predefined quantity of insects; and generating an insect release route through the geographic region, the insect release route passing through each insect release point.

Abstract: A landing gear platform is positionable between rearward and forward tires on one side of an aircraft landing gear and rearward and forward tires on the opposite side of the aircraft landing gear. The platform includes a pair of chocks that engage between the rearward and forward tires on the one side of the aircraft landing gear and the rearward and forward tires on the opposite side of the aircraft landing gear and prevent the tires from rotating. A panel spans over the tops of the pair of chocks. A top surface of the panel can be reached by a worker using a stepstool, enabling the worker to stand on the top surface of the panel when performing work on the landing gear above the rearward and forward tires of the aircraft landing gear.

Abstract: A landing gear platform is positionable between rearward and forward tires on one side of an aircraft landing gear and rearward and forward tires on the opposite side of the aircraft landing gear. The platform includes a pair of chocks that engage between the rearward and forward tires on the one side of the aircraft landing gear and the rearward and forward tires on the opposite side of the aircraft landing gear and prevent the tires from rotating. A panel spans over the tops of the pair of chocks. A top surface of the panel can be reached by a worker using a stepstool, enabling the worker to stand on the top surface of the panel when performing work on the landing gear above the rearward and forward tires of the aircraft landing gear.

Abstract: Method for removing contaminants from a surface during semiconductor fabrication. A preferred embodiment comprises developing a resist layer on a top surface of a semiconductor substrate, curing the developed resist layer, and cleaning the developed resist layer with a developer solution to remove contaminants. The cleaning makes use of the same developer solution used to develop the resist layer, so the cleaning makes use of a process that already exists and requires no additional investment to implement, while the curing stabilizes the developed resist layer so that the cleaning does not damage the developed resist layer.

Abstract: Method for removing contaminants from a surface during semiconductor fabrication. A preferred embodiment comprises developing a resist layer on a top surface of a semiconductor substrate, curing the developed resist layer, and cleaning the developed resist layer with a developer solution to remove contaminants. The cleaning makes use of the same developer solution used to develop the resist layer, so the cleaning makes use of a process that already exists and requires no additional investment to implement, while the curing stabilizes the developed resist layer so that the cleaning does not damage the developed resist layer.