Abstract: The present invention comprises a lighting apparatus main body having a reflecting surface, a main light source arranged in the reflecting surface of the lighting apparatus main body, a sub-light source which is arranged at the lighting apparatus main body and illuminates the neighborhood of the main light source directly, and a control circuit which controls the main light source and the sub-light source. Since the lighting apparatus illuminates downward with a direct illumination of the main light source and an indirect illumination of the sub-light source, the glare of the main light source is reduced.

Abstract: A light emitting apparatus comprising a light reflecting surface made of a metal, a light emitting element which has an electrode and is mounted on the light reflecting surface, and a sealing member which covers the light reflecting surface and the light emitting element. The sealing member has translucency and oxygen gas permeability of 40000 cc/m2·day or below.

Abstract: A lighting device and a lighting fixture of the embodiment of the present invention comprises a thermally conductive main body having a substrate support portion in one end portion, and having a through-hole and a groove portion formed in the substrate support portion, the through-hole penetrating from the one end portion to the other end portion of the main body, the groove portion extending continuously from the through-hole, a substrate mounted with a semiconductor light-emitting device, and disposed on the substrate support portion, an electrical connector connected to the semiconductor light-emitting device, a power supply device housed in the main body and configured to light the semiconductor light-emitting device, a wire connected to the power supply device and to the electrical connector while being inserted through the through-hole and the groove portion, and a base member provided in the other end portion of the main body and connected to the power supply device.

Abstract: According to one embodiment, a luminaire includes a substrate, a light-emitting section mounted on the substrate and including a light-emitting element, an outer frame body provided with a through-hole in a bottom surface, provided on the substrate to locate the light-emitting section in the through-hole, and made of an insulator, and a cylindrical reflector in the outer frame body, including a first opening end and a second opening end having an area larger than the first opening end, and provided on the bottom surface with the first opening end. A step is absent in at least one part of the part between an inner wall surface of the through-hole and an inner wall surface of the reflector. An area of a third opening end on the substrate side of the through-hole is smaller than an area of a fourth opening end on the reflector side of the through-hole.

Abstract: According to one embodiment, a light-emitting device includes a substrate, a light reflection layer, a plurality of light-emitting elements, and a sealing member. The substrate includes an insulating layer constituted of epoxy resin using an acid anhydride as a hardening agent or one of a polyimide resin, a polyethylene terephthalate resin, and a fluororesin. The light reflection layer is formed on the insulating layer. The light reflection layer includes a metallic light-reflecting surface higher in optical reflectance than the insulating layer. The light-emitting elements are mounted on the light-reflecting surface. The sealing member is constituted of a material having gas permeability and translucency, and is formed on the insulating layer to seal the light reflection layer and the light-emitting elements.

Abstract: According to one embodiment, a light emitting device includes a ceramics substrate, a metallic thermally-conductive layer formed on the substrate in which the substrate involves no electric connection, a light emitting element mounted on the metallic thermally-conductive layer, and a metallic bonding layer interposed between the metallic thermally-conductive layer and the light emitting element to bond the light emitting element to the metallic thermally-conductive layer.

Abstract: According to one embodiment, a light-emitting device includes a substrate including power-supply conductors, a frame member, and a sealing member. The power-supply conductors are formed on the substrate. A plurality of light-emitting elements including electrodes are mounted on the substrate. The electrodes of the light-emitting elements adjacent to the power-supply conductors are electrically connected to the power-supply conductors by a plurality of bonding wires. The frame member is made of resin which is coated on the substrate so as to surround the light-emitting elements and the bonding wires. The sealing member is filled in an area surrounded by the frame member and seals the light-emitting elements and the bonding wires.

Abstract: A lighting fixture includes a light-emitting section composed of a plurality of semiconductor light-emitting devices arranged separated from one another on a planar substrate and a lighting control section configured to control lighting of the semiconductor light-emitting devices of the light-emitting section. The light-emitting section is attached at a front of a fixture main body, and a convection generation section configured to generate convection is provided at a back of the fixture main body. The convection generation section generates convection and promotes heat radiation. With the configuration, even if the lighting fixture is installed to abut on a ceiling surface, the effect of radiating heat generated by the semiconductor light-emitting devices can be ensured.

Abstract: A light emitting apparatus comprising a light reflecting surface made of a metal, a light emitting element which has an electrode and is mounted on the light reflecting surface, and a sealing member which covers the light reflecting surface and the light emitting element. The sealing member has translucency and oxygen gas permeability of 40000 cc/m2·day or below.

Abstract: According to one embodiment, a light-emitting module includes a module substrate, a reflective layer, conductive layers, a light-emitting element, and a sealing member. A reflective layer is provided on a surface of an insulating layer of the module substrate, and the conductive layers are provided in the vicinity of the reflective layer. Further, the light-emitting element is provided on the reflective layer. Moreover, the translucent sealing member has translucency and bury the reflective layer, the conductive layers, and the light-emitting element. The ratio of the area occupied by the reflective layer and the conductive layers to the sealed region sealed by the sealing member is equal to or greater than 80%.

Abstract: According to one embodiment, a light-emitting module includes a module substrate, a light-reflecting layer, and a light-emitting element. The light-reflecting layer is superposed on the module substrate and has a reflection ratio higher than the reflection ratio of the module substrate. The light-emitting element is mounted on the module substrate. The light-reflecting layer includes a copper layer, a copper plating layer which covers the copper layer, and a metal layer which is superposed on the copper plating layer and reflects light emitted from the light-emitting element.

Abstract: According to one embodiment, a light emitting device includes a ceramics substrate, a metallic thermally-conductive layer formed on the substrate in which the substrate involves no electric connection, a light emitting element mounted on the metallic thermally-conductive layer, and a metallic bonding layer interposed between the metallic thermally-conductive layer and the light emitting element to bond the light emitting element to the metallic thermally-conductive layer.

Abstract: A light-emitting module includes at least one light-emitting element provided on a mount surface of a substratum. A translucent member is provided so as to face the mount surface of the substratum. The translucent member is separated from the light-emitting element and contains a phosphor material that converts a wavelength of light emitted by the light-emitting element. A frame having heat conducting properties is interposed between the substratum and the translucent member. The frame surrounds the light-emitting element. The frame includes an opening that leads light emitted by the light-emitting element to the translucent member, and a heat conductor thermally connected to the translucent member. The heat conductor includes a heat radiator exposed outside of the translucent member.

Abstract: A lighting device includes a printed wiring board, a plurality of light-emitting elements, a sealing member, and a color conversion unit, and an adhesive layer. The sealing member has light transmitting properties and seals the light-emitting elements mounted on the printed wiring board. The color conversion unit includes a cover member of light transmitting properties, and a fluorescent substance layer provided on the inner surface of the cover member. The adhesive layer has light-transmitting properties, and adheres the sealing member to the fluorescent substance layer of the color conversion unit in an airtight manner.

Abstract: According to one embodiment, a light-emitting device includes a substrate, a light reflection layer, a plurality of light-emitting elements, and a sealing member. The substrate includes an insulating layer constituted of epoxy resin using an acid anhydride as a hardening agent or one of a polyimide resin, a polyethylene terephthalate resin, and a fluororesin. The light reflection layer is formed on the insulating layer. The light reflection layer includes a metallic light-reflecting surface higher in optical reflectance than the insulating layer. The light-emitting elements are mounted on the light-reflecting surface. The sealing member is constituted of a material having gas permeability and translucency, and is formed on the insulating layer to seal the light reflection layer and the light-emitting elements.

Abstract: According to one embodiment, a light-emitting device includes a substrate including power-supply conductors, a frame member, and a sealing member. The power-supply conductors are formed on the substrate. A plurality of light-emitting elements including electrodes are mounted on the substrate. The electrodes of the light-emitting elements adjacent to the power-supply conductors are electrically connected to the power-supply conductors by a plurality of bonding wires. The frame member is made of resin which is coated on the substrate so as to surround the light-emitting elements and the bonding wires. The sealing member is filled in an area surrounded by the frame member and seals the light-emitting elements and the bonding wires.

Abstract: The present invention provides a self-ballasted lamp which efficiently conducts heat of a plurality of LED chips of a light emitting module to its holder, and can prevent the temperature rise of the LED chips. The holder has a base portion, an edge portion provided at one end side of the base portion, which is thick at the base portion side thereof and thin at the distal end side thereof, and heat radiation fins provided at the other end side from the edge part and at the circumference of the base portion. The heat from the semiconductor light emitting elements is conducted from the base portion to the edge part and radiated therefrom. At this time, the edge part is thickened at the base portion side, wherein the thermal capacity is increased, and the heat conduction is improved.

Abstract: According to one embodiment, a light-emitting module includes a module substrate, a reflective layer, conductive layers, a light-emitting element, and a sealing member. A reflective layer is provided on a surface of an insulating layer of the module substrate, and the conductive layers are provided in the vicinity of the reflective layer. Further, the light-emitting element is provided on the reflective layer. Moreover, the translucent sealing member has translucency and bury the reflective layer, the conductive layers, and the light-emitting element. The ratio of the area occupied by the reflective layer and the conductive layers to the sealed region sealed by the sealing member is equal to or greater than 80%.

Abstract: A lighting device and a lighting fixture of the embodiment of the present invention comprises a thermally conductive main body having a substrate support portion in one end portion, and having a through-hole and a groove portion formed in the substrate support portion, the through-hole penetrating from the one end portion to the other end portion of the main body, the groove portion extending continuously from the through-hole, a substrate mounted with a semiconductor light-emitting device, and disposed on the substrate support portion, an electrical connector connected to the semiconductor light-emitting device, a power supply device housed in the main body and configured to light the semiconductor light-emitting device, a wire connected to the power supply device and to the electrical connector while being inserted through the through-hole and the groove portion, and a base member provided in the other end portion of the main body and connected to the power supply device.

Abstract: A light-emitting module includes at least one light-emitting element provided on a mount surface of a substratum. A translucent member is provided so as to face the mount surface of the substratum. The translucent member is separated from the light-emitting element and contains a phosphor material that converts a wavelength of light emitted by the light-emitting element. A frame having heat conducting properties is interposed between the substratum and the translucent member. The frame surrounds the light-emitting element. The frame includes an opening that leads light emitted by the light-emitting element to the translucent member, and a heat conductor thermally connected to the translucent member. The heat conductor includes a heat radiator exposed outside of the translucent member.