Patents by Inventor Eriko Ajioka

Eriko Ajioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9153274
    Abstract: A microwave-assisted magnetic head provides a high-reliability microwave-assisted magnetic head that reduces effective coercivity by giving microwave energy to a magnetic recording medium in an auxiliary manner and writes a data signal, a head gimbal assembly, and a magnetic recording and reproducing apparatus. A microwave magnetic field generating element is arranged on a trailing shield side or a reproducing head element side with respect to a main magnetic pole that generates a recording magnetic field for writing a data signal into a magnetic recording medium, the microwave magnetic field generating element having a coil configuration in which a plurality of microwave magnetic field generating lines and a return line are formed by a continuous single line.
    Type: Grant
    Filed: May 19, 2014
    Date of Patent: October 6, 2015
    Assignee: TDK CORPORATION
    Inventor: Eriko Ajioka
  • Patent number: 8988813
    Abstract: A microwave-assisted magnetic recording and reproducing apparatus includes a microwave power generator, a microwave magnetic field generating element, and a thin film magnetic head that may record a data signal in high density in a magnetic recording medium that has a high coercivity. A magnetic recording medium, a magnetic head that records information in the magnetic recording medium, a microwave power generator provided independently of the magnetic head, and a differential signal supply unit used to supply microwave power generated by the microwave power generator as differential signals to a microwave magnetic field generating element provided at the magnetic head are included.
    Type: Grant
    Filed: May 19, 2014
    Date of Patent: March 24, 2015
    Assignee: TDK Corporation
    Inventor: Eriko Ajioka
  • Publication number: 20140340782
    Abstract: A microwave-assisted magnetic head provides a high-reliability microwave-assisted magnetic head that reduces effective coercivity by giving microwave energy to a magnetic recording medium in an auxiliary manner and writes a data signal, a head gimbal assembly, and a magnetic recording and reproducing apparatus. A microwave magnetic field generating element is arranged on a trailing shield side or a reproducing head element side with respect to a main magnetic pole that generates a recording magnetic field for writing a data signal into a magnetic recording medium, the microwave magnetic field generating element having a coil configuration in which a plurality of microwave magnetic field generating lines and a return line are formed by a continuous single line.
    Type: Application
    Filed: May 19, 2014
    Publication date: November 20, 2014
    Applicant: TDK CORPORATION
    Inventor: Eriko AJIOKA
  • Publication number: 20140340781
    Abstract: A microwave-assisted magnetic recording and reproducing apparatus includes a microwave power generator, a microwave magnetic field generating element, and a thin film magnetic head that may record a data signal in high density in a magnetic recording medium that has a high coercivity. A magnetic recording medium, a magnetic head that records information in the magnetic recording medium, a microwave power generator provided independently of the magnetic head, and a differential signal supply unit used to supply microwave power generated by the microwave power generator as differential signals to a microwave magnetic field generating element provided at the magnetic head are included.
    Type: Application
    Filed: May 19, 2014
    Publication date: November 20, 2014
    Applicant: TDK CORPORATION
    Inventor: Eriko AJIOKA
  • Patent number: 8693143
    Abstract: A suspension is configured to support a magnetic head slider having a recording head element for recording to a magnetic recording medium and a microwave generating element that applies a high-frequency magnetic field to the magnetic recording medium when recording to the magnetic recording medium is conducted by the recording head element. The suspension includes a flexure that supports the magnetic head slider, and a microwave signal transmission line and a recording signal transmission line that are supported by the flexure. The microwave signal transmission line is connected to the microwave generating element and configured to transmit microwave signals for generating the high-frequency magnetic field, the recording signal transmission line being connected to the recording head element and configured to transmit recording signals. The flexure has a main body part, a support part for the magnetic head slider, and a pair of arm parts that links the main body part and the support part.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: April 8, 2014
    Assignee: TDK Corporation
    Inventors: Eriko Ajioka, Yoshikazu Soeno
  • Patent number: 8587903
    Abstract: A suspension is configured to support a magnetic head slider having a recording head element for recording to a magnetic recording medium and a microwave generating element that applies a high-frequency magnetic field to the magnetic recording medium when recording is conducted by the recording head element. The suspension has a flexure that supports the magnetic head slider, a microwave signal transmission line and a recording signal transmission line. The microwave signal transmission line is connected to the microwave generating element and configured to transmit microwave signals for generating the high-frequency magnetic field. The microwave signal transmission line and the recording signal transmission line are supported between the main body part and the support part, a portion of which has a first lamination structure where a first ground layer is conductive and a first insulating layer supports the microwave signal transmission.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: November 19, 2013
    Assignee: TDK Corporation
    Inventors: Eriko Ajioka, Yoshikazu Soeno
  • Publication number: 20130128382
    Abstract: A suspension is configured to support a magnetic head slider having a recording head element for recording to a magnetic recording medium and a microwave generating element that applies a high-frequency magnetic field to the magnetic recording medium when recording to the magnetic recording medium is conducted by the recording head element. The suspension includes a flexure that supports the magnetic head slider, and a microwave signal transmission line and a recording signal transmission line that are supported by the flexure. The microwave signal transmission line is connected to the microwave generating element and configured to transmit microwave signals for generating the high-frequency magnetic field, the recording signal transmission line being connected to the recording head element and configured to transmit recording signals. The flexure has a main body part, a support part for the magnetic head slider, and a pair of arm parts that links the main body part and the support part.
    Type: Application
    Filed: November 22, 2011
    Publication date: May 23, 2013
    Applicant: TDK CORPORATION
    Inventors: Eriko AJIOKA, Yoshikazu SOENO
  • Publication number: 20130128388
    Abstract: A suspension is configured to support a magnetic head slider having a recording head element for recording to a magnetic recording medium and a microwave generating element that applies a high-frequency magnetic field to the magnetic recording medium when recording is conducted by the recording head element. The suspension has a flexure that supports the magnetic head slider, a microwave signal transmission line and a recording signal transmission line. The microwave signal transmission line is connected to the microwave generating element and configured to transmit microwave signals for generating the high-frequency magnetic field. The microwave signal transmission line and the recording signal transmission line are supported between the main body part and the support part, a portion of which has a first lamination structure where a first ground layer is conductive and a first insulating layer supports the microwave signal transmission.
    Type: Application
    Filed: November 22, 2011
    Publication date: May 23, 2013
    Applicant: TDK CORPORATION
    Inventors: Eriko AJIOKA, Yoshikazu SOENO
  • Publication number: 20130128387
    Abstract: A suspension is configured to support a magnetic head slider having a recording head element for recording data signals to a magnetic recording medium and a microwave generating element that applies a high-frequency magnetic field to the magnetic recording medium when recording is conducted by the recording head element. The suspension includes a flexure that supports the magnetic head slider and a microwave signal transmission line. The microwave signal transmission line is connected to the microwave generating element and configured to transmit microwave signals for generating the high-frequency magnetic field. A portion that supports the microwave signal transmission line of the flexure includes a lamination structure, a ground layer with the thickness of 0.1 ?m or greater and less than 2 ?m and having higher conductivity than that of the flexure main plate, and an insulating layer that supports the microwave signal transmission line.
    Type: Application
    Filed: November 22, 2011
    Publication date: May 23, 2013
    Applicant: TDK CORPORATION
    Inventors: Eriko AJIOKA, Yoshikazu Soeno
  • Patent number: 7236070
    Abstract: An electronic component module has a device-side module A and an antenna-side module B. The device-side module A is equipped with a first dielectric substrate 11 that is formed with a first transmission line 11a and a high-frequency device 13 that is mounted on the first dielectric substrate 11 and is connected to the first transmission line 11a. The antenna-side module B is equipped with a second dielectric substrate 12 that is laid on the first dielectric substrate 11 in such a manner that they are arranged in a lamination direction and that is formed with a second transmission line 12a that is electrically connected to the first transmission line 11, and an antenna element 14 that is provided on the second dielectric substrate 12 and electrically connected to the high-frequency device 13 via the second transmission line 12a and the first transmission line 11a.
    Type: Grant
    Filed: August 30, 2004
    Date of Patent: June 26, 2007
    Assignee: TDK Corporation
    Inventors: Eriko Ajioka, Hitoyoshi Kurata, Hideaki Shimoda, Shigeru Asami
  • Patent number: 7102896
    Abstract: An electronic component module according to the invention includes: a mounting substrate 11 including a shield layer 13 and on which a first cavity 14a and a second cavity 14b are formed; a first electronic component 16a positioned in the first cavity 14a and used in a first frequency band; a second electronic component 16b positioned in the second cavity 14b and used in a second frequency band; lid members 15 which seal the first cavity 14a and the second cavity 14b; and patch antennas 17 which transmit/receive radio waves in the frequency bands, the antennas connected to the electronic components 16; wherein the electronic components 16 are mounted on the mounting substrate 11 via a substrate component 19 having a higher heat resistance than the mounting substrate 11 and that the mounting substrate 11 is composed of a member having a lower dielectric constant that the substrate component 19.
    Type: Grant
    Filed: May 18, 2004
    Date of Patent: September 5, 2006
    Assignee: TDK Corporation
    Inventors: Eriko Ajioka, Shigeru Asami, Hideaki Shimoda, Hiroshi Ikeda, Yoshinari Yamashita, Hitoyoshi Kurata
  • Patent number: 6917526
    Abstract: An electronic component module includes: printed-circuit boards on which a shield layer is formed; a spacer positioned between the printed-circuit boards, the spacer equipped with a shielding feature which forms as partitions a first cavity and a second cavity between the printed-circuit boards; a first electronic component positioned in the first cavity and mounted on any one of the printed-circuit boards and used in a first frequency band; a second electronic component positioned in the second cavity and mounted on any one of the printed-circuit boards, the second electronic component used in a second frequency band; a patch antenna formed on the surface of the printed-circuit board opposite that on which the spacer is mounted, the antenna transmitting and receiving radio waves at least one of in the first and second frequency bands; and terminals formed on the surface of the printed-circuit board opposite that on which the spacer is mounted.
    Type: Grant
    Filed: April 22, 2004
    Date of Patent: July 12, 2005
    Assignee: TDK Corporation
    Inventors: Eriko Ajioka, Shigeru Asami, Hideaki Shimoda, Hiroshi Ikeda, Yoshinari Yamashita, Hitoyoshi Kurata
  • Patent number: 6914787
    Abstract: An electronic component module includes a mounting substrate including a shield layer and on which a first cavity and a second cavity are formed. A first electronic component positioned in the first cavity is used in a first frequency band. A second electronic component positioned in the second cavity is used in a second frequency band. Lid members seal the first cavity and the second cavity. Patch antennas transmit/receive radio waves in the first and second frequency bands, the antennas being formed on a surface opposite to the electronic components mounting surface. And, connection terminals formed on the mounting substrate are electrically connected to the electronic components through transmission lines.
    Type: Grant
    Filed: May 18, 2004
    Date of Patent: July 5, 2005
    Assignee: TDK Corporation
    Inventors: Eriko Ajioka, Shigeru Asami, Hideaki Shimoda, Hiroshi Ikeda, Yoshinari Yamashita, Hitoyoshi Kurata
  • Publication number: 20050088260
    Abstract: An electronic component module has a device-side module A and an antenna-side module B. The device-side module A is equipped with a first dielectric substrate 11 that is formed with a first transmission line 11a and a high-frequency device 13 that is mounted on the first dielectric substrate 11 and is connected to the first transmission line 11a. The antenna-side module B is equipped with a second dielectric substrate 12 that is laid on the first dielectric substrate 11 in such a manner that they are arranged in a lamination direction and that is formed with a second transmission line 12a that is electrically connected to the first transmission line 11, and an antenna element 14 that is provided on the second dielectric substrate 12 and electrically connected to the high-frequency device 13 via the second transmission line 12a and the first transmission line 11a.
    Type: Application
    Filed: August 30, 2004
    Publication date: April 28, 2005
    Applicant: TDK CORPORATION
    Inventors: Eriko Ajioka, Hitoyoshi Kurata, Hideaki Shimoda, Shigeru Asami
  • Publication number: 20040264156
    Abstract: An electronic component module includes: printed-circuit boards on which a shield layer is formed; a spacer positioned between the printed-circuit boards, the spacer equipped with a shielding feature which forms as partitions a first cavity and a second cavity between the printed-circuit boards; a first electronic component positioned in the first cavity and mounted on any one of the printed-circuit boards and used in a first frequency band; a second electronic component positioned in the second cavity and mounted on any one of the printed-circuit boards, the second electronic component used in a second frequency band; a patch antenna formed on the surface of the printed-circuit board opposite that on which the spacer is mounted, the antenna transmitting and receiving radio waves at least one of in the first and second frequency bands; and terminals formed on the surface of the printed-circuit board opposite that on which the spacer is mounted.
    Type: Application
    Filed: April 22, 2004
    Publication date: December 30, 2004
    Applicant: TDK CORPORATION
    Inventors: Eriko Ajioka, Shigeru Asami, Hideaki Shimoda, Hiroshi Ikeda, Yoshinari Yamashita, Hitoyoshi Kurata
  • Publication number: 20040233648
    Abstract: An electronic component module according to the invention includes: a mounting substrate 11 including a shield layer 13 and on which a first cavity 14a and a second cavity 14b are formed; a first electronic component 16a positioned in the first cavity 14a and used in a first frequency band; a second electronic component 16b positioned in the second cavity 14b and used in a second frequency band; lid members 15 which seal the first cavity 14a and the second cavity 14b; and patch antennas 17 which transmit/receive radio waves in the frequency bands, the antennas connected to the electronic components 16; wherein the electronic components 16 are mounted on the mounting substrate 11 via a substrate component 19 having a higher heat resistance than the mounting substrate 11 and that the mounting substrate 11 is composed of a member having a lower dielectric constant that the substrate component 19.
    Type: Application
    Filed: May 18, 2004
    Publication date: November 25, 2004
    Applicant: TDK CORPORATION
    Inventors: Eriko Ajioka, Shigeru Asami, Hideaki Shimoda, Hiroshi Ikeda, Yoshinari Yamashita, Hitoyoshi Kurata
  • Publication number: 20040233644
    Abstract: An electronic component module according to the invention includes: a mounting substrate 11 including a shield layer 13 and on which a first cavity 14a and a second cavity 14b are formed; a first electronic component 16a positioned in the first cavity 14a and used in a first frequency band; a second electronic component 16b positioned in the second cavity 14b and used in a second frequency band; lid members 15 which seal the first cavity 14a and the second cavity 14b; and patch antennas 17 which transmit/receive radio waves in the first and second frequency bands, the antennas being formed on a surface opposite to the electronic components mounting surface, and connection terminals 18 formed on the mounting substrate 11 and electrically connected to the electronic components 16 through transmission lines 12.
    Type: Application
    Filed: May 18, 2004
    Publication date: November 25, 2004
    Applicant: TDK CORPORATION
    Inventors: Eriko Ajioka, Shigeru Asami, Hideaki Shimoda, Hiroshi Ikeda, Yoshinari Yamashita, Hitoyoshi Kurata