Patents by Inventor Eriko Mori

Eriko Mori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080068580
    Abstract: A wafer chuck includes a plurality of supporting pins protruding upward. The rigidity of the supporting pins in the horizontal direction is lower than that in the vertical direction in a central area of the wafer chuck. The supporting pins deform in response to a force for returning a central warped portion of a wafer from a warped state to an original state, thereby releasing part of or all the strain in the wafer.
    Type: Application
    Filed: September 19, 2007
    Publication date: March 20, 2008
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Eriko Mori, Ken Katsuta