Patents by Inventor Eriko Nishikawa

Eriko Nishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7247820
    Abstract: A heat sink that is disposed on a heating element and absorbs the heat generated by the heating element includes: a contact surface to which recessed grooves are formed and the region of which excluding the recessed grooves is in contact with the heating element; insertion members having a thickness, which permits them to fill the recessed grooves, and come into contact with the heating element by being inserted into the recessed grooves; and a turning mechanism that separates the contact surface from the heating element by turning the insertion members in response to a manipulation while abutting the extreme ends of the insertion members against the heating element. With such arrangement, there can be provided the heat sink that can reduce time and effort for removing the heat sink from the heating element while suppressing deterioration of heat absorption capability and an information processing device including the heat sink.
    Type: Grant
    Filed: November 22, 2005
    Date of Patent: July 24, 2007
    Assignee: Fujitsu Limited
    Inventor: Eriko Nishikawa
  • Publication number: 20070045283
    Abstract: A heat sink that is disposed on a heating element and absorbs the heat generated by the heating element includes: a contact surface to which recessed grooves are formed and the region of which excluding the recessed grooves is in contact with the heating element; insertion members having a thickness, which permits them to fill the recessed grooves, and come into contact with the heating element by being inserted into the recessed grooves; and a turning mechanism that separates the contact surface from the heating element by turning the insertion members in response to a manipulation while abutting the extreme ends of the insertion members against the heating element. With such arrangement, there can be provided the heat sink that can reduce time and effort for removing the heat sink from the heating element while suppressing deterioration of heat absorption capability and an information processing device including the heat sink.
    Type: Application
    Filed: November 22, 2005
    Publication date: March 1, 2007
    Applicant: FUJITSU LIMITED
    Inventor: Eriko Nishikawa