Abstract: The Present Disclosure is a module socket for mounting a module on a mounting member, in which the module socket has a first connector including a flat housing, a first conductive pattern arranged on the mating side surface of the housing, and a male terminal protruding from a surface of the first conductive pattern, and a flat second connector formed from plate-shaped metal and including a female terminal elastically interposing the male terminal, and in which either the first conductor or the second conductor is attached to the module and the other is attached to the mounting member.

Abstract: An easily dismantlable adhesive composition containing: an acrylic block polymer having a poly(meth)acrylate chain (A) formed of a carboxyl precursor group-containing (meth)acrylate monomer (a) and a poly(meth)acrylate chain (B) that contains, as monomer components, a (meth)acrylate (b) having an alkyl group having 1 to 14 carbon atoms and a polar group-containing monomer (c); and either an acid catalyst or an acid generator, makes it possible to achieve favorable adhesiveness and dismantlability and suppress stick-slip at the time of dismantlement.

Abstract: The present invention provides an easily dismantlable adhesive composition as an adhesive composition containing an acrylic polymer (X) that contains a (meth)acrylate monomer as a main monomer component, and an acid catalyst or an acid generator, in which the acrylic polymer (X) contains a poly(meth)acrylate chain (A) that is formed of repeating units derived from a carboxyl precursor group-containing (meth)acrylate monomer (a), and a number of the repeating units is 10 or greater.

Abstract: An imaging apparatus has an AEC function that can prevent irregularities in photographed images, without being increased in size. The imaging apparatus comprises a plurality of pixels arranged in a matrix shape, each of the plurality of pixels including a conversion element for converting radiation or light into an electric charge, a plurality of lines that are connected to the plurality of pixel units and that extend in different directions to each other, a current monitor circuit that monitors currents flowing in the plurality of lines, and an arithmetic unit that calculates a two-dimensional distribution by performing back-projection processing with respect to the currents flowing in the plurality of lines monitored by the current monitor circuit.

Abstract: Suitable adhesive properties and dismantling properties can be obtained, and an interface between an adherent/an adhesive layer or an adhesive layer/a substrate can be suitably dismantlable by the easily dismantlable adhesive composition including an acrylate polymer including a (meth)acrylate monomer having a carboxyl precursor group, 2-ethyl hexyl acrylate, and a monomer having a polar group as a monomer, and an acid catalyst or an acid generator.

Abstract: An easily dismantlable adhesive composition is provided containing: an acrylic polymer; and either an acid catalyst or an acid generator, the acrylic polymer containing: as monomer components, a carboxyl-precursor-group-containing-(meth)acrylate monomer; an n-butyl acrylate; and a polar-group-containing monomer, the content of the polar-group-containing monomer being 5 to 30% by mass, relative to the total mass of the monomer components composing the acrylic polymer, makes it possible to realize favorable adhesion- and dismantling properties and favorable delamination at an interface between an adherend and a substrate or an interface between an adhesive agent layer and an adherend when dismantled.

Abstract: Provided are a method for producing a Cu—Ga alloy powder, by which a high quality Cu—Ga alloy powder to be produced readily; a Cu—Ga alloy powder; a method for producing a Cu—Ga alloy sputtering target; and a Cu—Ga alloy sputtering target. Specifically, a Cu—Ga alloy powder is produced by stirring a mixed powder containing a Cu powder and a Ga in a mass ratio of 85:15 to 55:45 at a temperature of 30 to 700° C. in an inert atmosphere thereby accomplishing alloying. Also a Cu—Ga alloy sputtering target is produced by molding the Cu—Ga alloy powder followed by sintering.

Abstract: The Present Disclosure is a module socket for mounting a module on a mounting member, in which the module socket has a first connector including a flat housing, a first conductive pattern arranged on the mating side surface of the housing, and a male terminal protruding from a surface of the first conductive pattern, and a flat second connector formed from plate-shaped metal and including a female terminal elastically interposing the male terminal, and in which either the first conductor or the second conductor is attached to the module and the other is attached to the mounting member.