Patents by Inventor Eriko Tsukuda

Eriko Tsukuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8747972
    Abstract: To provide a packaging material for boiling treatment or retort treatment that is inexpensive and has excellent low-elution properties and transparency, as well as a pouch comprising the same. A packaging material for boil/retort treatment having at least a transparent gas barrier film layer, an adhesive layer and a sealant film layer in that order, the packaging material for boil/retort treatment being one in which, when it is heated at 121° C. for 2 hours by contact with a sufficient amount of 95% ethanol in a one-side elution test, the masses of the unreacted residual ?-caprolactam and ?-laurolactam eluting into the 95% ethanol are no greater than 0.15 mg and no greater than 0.04 mg, respectively, per square inch of the sealant film layer, and a pouch comprising the material.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: June 10, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Noriko Sakamoto, Noriyuki Shiina, Eriko Tsukuda, Mitsuru Bushida