Abstract: Examples are disclosed that relate to sealing a heat pipe. One example provides a heat pipe including a heat pipe body having a sealed end at which opposing interior surfaces of the heat pipe body are joined, a sealant located in a least a portion of the sealed end of the heat pipe body between the opposing interior surface, the sealant having a higher oxygen transport rate than the heat pipe body, and a permanent seal forming an outer surface of the sealed end.

Abstract: A vapor chamber includes an electromagnetic (EM) shielding layer. The vapor chamber is constructed from a structural base material that provides for a suitable size, strength, and/or weight for a specific application. The vapor chamber is treated at the region(s) to provide suitable EM shielding characteristics for the specific application. For example, an oxidation layer is removed from the region(s) to expose the structural base material while the vapor chamber is in an inert environment that prevents further oxidation. Then, while the vapor chamber remains within the same inert environment, a material having suitable electrical conductive properties is deposited onto the exposed structural base material to form an EM shielding layer at the region(s). When the vapor chamber is installed into an electronic device, the EM shielding layer may be electrically grounded so as to isolate one or more components within the electronic device from EM signal interference.

Abstract: Examples are disclosed that relate to sealing a heat pipe. One example provides a heat pipe including a heat pipe body having a sealed end at which opposing interior surfaces of the heat pipe body are joined, a sealant located in a least a portion of the sealed end of the heat pipe body between the opposing interior surface, the sealant having a higher oxygen transport rate than the heat pipe body, and a permanent seal forming an outer surface of the sealed end.

Abstract: A perspiration dissipating support assembly for head-mounted-display (HMD) devices. Variations of the perspiration dissipating support assembly disclosed herein enable supporting forces for an HMD device to be spread over a large portion of a user's head while facilitating dissipation of both liquid perspiration and vapor perspiration via respective dedicated dissipation mechanisms. In some embodiments, the perspiration dissipating support assembly includes a vapor-permeable contact layer that contacts the user's head and a vapor-permeable spacer that provides a Moisture Vapor Transmission Rate on the order of several times greater than that of the vapor-permeable contact layer. The vapor-permeable contact layer may have wicking properties that tend to draw perspiration (e.g., via capillary action resulting from a particular technical-weave pattern) away from the user's head and into the vapor-permeable spacer through which the perspiration evaporates into the ambient environment.

Abstract: A heat transfer device, and methods and systems using such devices, including a major surface wall forming a bottom side of the device; a first hermetic chamber of a first design and with the surface wall forming a bottom wall of the first vapor chamber; a second hermetic chamber of a second design, positioned adjacent to the first chamber along a length of the first surface wall, and with the surface wall forming a bottom wall of the second vapor chamber. The first chamber includes a first heat transfer medium and a first wick arranged to transport the first heat transfer medium to an evaporator region of the first chamber. The second chamber includes a second heat transfer medium and a second wick arranged to transport the second heat transfer medium to an evaporator region of the second chamber.

Abstract: A vapor chamber includes an electromagnetic (EM) shielding layer. The vapor chamber is constructed from a structural base material that provides for a suitable size, strength, and/or weight for a specific application. The vapor chamber is treated at the region(s) to provide suitable EM shielding characteristics for the specific application. For example, an oxidation layer is removed from the region(s) to expose the structural base material while the vapor chamber is in an inert environment that prevents further oxidation. Then, while the vapor chamber remains within the same inert environment, a material having suitable electrical conductive properties is deposited onto the exposed structural base material to form an EM shielding layer at the region(s). When the vapor chamber is installed into an electronic device, the EM shielding layer may be electrically grounded so as to isolate one or more components within the electronic device from EM signal interference.

Abstract: Examples are disclosed that relate to heat transfer devices comprising a vapor chamber and a flexible hinge. One disclosed example provides an electronic device comprising a first portion and a second portion connected by a hinge region, and a vapor chamber extending from the first portion to the second portion across the hinge region, the vapor chamber comprising a first layer comprising titanium, a second layer comprising titanium joined to the first layer to form the vapor chamber, a working fluid within the vapor chamber, and a third layer comprising titanium positioned between the first layer and the second layer, the third layer comprising one or more features configured to conduct the working fluid via capillary action.

Abstract: A perspiration dissipating support assembly for head-mounted-display (HMD) devices. Variations of the perspiration dissipating support assembly disclosed herein enable supporting forces for an HMD device to be spread over a large portion of a user's head while facilitating dissipation of both liquid perspiration and vapor perspiration via respective dedicated dissipation mechanisms. In some embodiments, the perspiration dissipating support assembly includes a vapor-permeable contact layer that contacts the user's head and a vapor-permeable spacer that provides a Moisture Vapor Transmission Rate on the order of several times greater than that of the vapor-permeable contact layer. The vapor-permeable contact layer may have wicking properties that tend to draw perspiration (e.g., via capillary action resulting from a particular technical-weave pattern) away from the user's head and into the vapor-permeable spacer through which the perspiration evaporates into the ambient environment.

Abstract: Devices with components mounted to a surface interior often encounter problems with generated heat, which is difficult to dissipate from a tightly packed and sealed device interior. Excessive heat may also distort the surface substrate material, which may become brittle from accumulated thermal stress and/or warp in a manner that displaces the position and/or orientation of the components. Presented herein are device manufacturing techniques in view of temperature considerations. Devices may comprise a device housing of a housing material that exhibits a substantially isotropic coefficient of thermal expansion (CTE) and/or thermal conductivity in various dimensions.

Abstract: Examples are disclosed that relate to sealing a heat pipe. One example provides a heat pipe including a heat pipe body having a sealed end at which opposing interior surfaces of the heat pipe body are joined, a sealant located in a least a portion of the sealed end of the heat pipe body between the opposing interior surface, the sealant having a higher oxygen transport rate than the heat pipe body, and a permanent seal forming an outer surface of the sealed end.

Abstract: A first surface of a heat source is spaced from a support by a first gap, in a thermal path from the first surface to the support. A second surface of the heat source, opposite to the first surface, is spaced by a second gap from a heat sink, in a thermal path from the second surface to the heat sink. The thermal path to the support provides a first thermal resistance, based on a gap spacing of the first gap and the thermal path to the heat sink provides a second thermal resistance, based on a gap spacing of the second gap.

Abstract: A heat transfer device, and methods and systems using such devices, including a major surface wall forming a bottom side of the device; a first hermetic chamber of a first design and with the surface wall forming a bottom wall of the first vapor chamber; a second hermetic chamber of a second design, positioned adjacent to the first chamber along a length of the first surface wall, and with the surface wall forming a bottom wall of the second vapor chamber. The first chamber includes a first heat transfer medium and a first wick arranged to transport the first heat transfer medium to an evaporator region of the first chamber. The second chamber includes a second heat transfer medium and a second wick arranged to transport the second heat transfer medium to an evaporator region of the second chamber.

Abstract: A first surface of a heat source is spaced from a support by a first gap, in a thermal path from the first surface to the support. A second surface of the heat source, opposite to the first surface, is spaced by a second gap from a heat sink, in a thermal path from the second surface to the heat sink. The thermal path to the support provides a first thermal resistance, based on a gap spacing of the first gap and the thermal path to the heat sink provides a second thermal resistance, based on a gap spacing of the second gap.

Abstract: Devices with components mounted to a surface interior often encounter problems with generated heat, which is difficult to dissipate from a tightly packed and sealed device interior. Excessive heat may also distort the surface substrate material, which may become brittle from accumulated thermal stress and/or warp in a manner that displaces the position and/or orientation of the components. Presented herein are device manufacturing techniques in view of temperature considerations. Devices may comprise a device housing of a housing material that exhibits a substantially isotropic coefficient of thermal expansion (CTE) and/or thermal conductivity in various dimensions.