Abstract: An optical mount includes a frame adapted to support display optical systems and heat emitting electronic components. The mount includes a first portion housing the electronic components and one or more support components extending away from the electronic components. The one or more support components may include temple arms adapted to support the frame on the head of a wearer of the optical mount. The frame may be comprised of a thermally conductive material coupled to the electronic components. The support components include a first side and a second side, and at least one void positioned between the first side and the second side adapted to convey heat away from the electronic components. The void may define a bifurcated region in the support component.

Abstract: A thermal dissipation system for wearable electronic devices transfers heat away from a housing enclosing a heat source and dissipates the heat through a region of the support assembly that is noncontiguous with the housing. The support assembly may be coupled to the housing to enable the housing to be worn by a user. Various regions of the support assembly have different thermal resistances between a thermal conduit and an ambient environment. The thermal resistances may decrease as the thermal conduit becomes farther away from the heat source. The variations in thermal resistances enable modulation of relative heat flux between the various regions. For example, heat may be internally routed through the wearable electronic device to be dissipated through a surface that a user does not typically touch during operation.

Abstract: Examples are disclosed herein that relate to a heat removal system utilizing a dispersion that includes particles of an electrical conductor. One example provides a heat removal system including a conduit loop, a dispersion of particles of an electrical conductor in a heat transfer fluid, a pair of electrodes configured to introduce a flow of electric current through the particles in the dispersion, and one or more magnets configured to introduce a magnetic field within the conduit loop in a region of the pair of electrodes, such that the electrodes are operable to apply an electromagnetic pumping force on the particles in the dispersion.

Abstract: A thermal conduit configured to conduct heat from a heat source to a heat sink and method of forming said conduit are disclosed herein. The thermal conduit may comprise a plurality of stacked sheets formed of an anisotropically thermally conductive material, a non-limiting example of which is graphite, each sheet with a respective orientation of thermal conduction. The orientations of thermal conduction of the plurality of sheets may change stepwise in a stacking direction to form a curved thermal flow path.

Abstract: An adhesive joint system comprises a circuit board with a distal end and a proximal end mounted on a first side via a tongue and groove connection to a housing. An adhesive is positioned at least in the gap surrounding the tongue, and an electrical component mounted to the distal end on a second side of the circuit board that is opposite the first side. The respective coefficients of thermal expansion (CTE) of the tongue, adhesive, and the material defining the groove are related, such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap.

Abstract: A thermal dissipation system for wearable electronic devices transfers heat away from a housing enclosing a heat source and dissipates the heat through a region of the support assembly that is noncontiguous with the housing. The support assembly may be coupled to the housing to enable the housing to be worn by a user. Various regions of the support assembly have different thermal resistances between a thermal conduit and an ambient environment. The thermal resistances may decrease as the thermal conduit becomes farther away from the heat source. The variations in thermal resistances enable modulation of relative heat flux between the various regions. For example, heat may be internally routed through the wearable electronic device to be dissipated through a surface that a user does not typically touch during operation.

Abstract: A vapor chamber that emits a non-uniform radiative heat flux. The vapor chamber may have a convection cavity that contains a working fluid and outer surfaces that have two or more emissivity regions to dissipate heat from the working fluid at non-uniform levels of radiative heat flux. The non-uniform levels of radiative heat flux may result from exposure to emissivity decreasing surface treatments and/or emissivity increasing surface treatments. The vapor chamber may be utilized in thermal management systems to protect heat-sensitive components from thermal radiation that results from heat being dissipated from a heat source. For example, the vapor chamber may be oriented with respect to a heat-sensitive component so that thermal radiation is emitted at a higher radiative heat flux away from the heat-sensitive component than towards the heat-sensitive component.

Abstract: The examples disclosed herein are related to graphene-based materials on see-through optical displays. One example provides, a computing device, including a see-through display system including an optical component through which a surrounding environment is viewable, an electrical component disposed on a user-facing side of the optical component, and a graphene-based layer disposed on the optical component, the graphene-based layer comprising a greater thickness of a graphene-based material on a portion closer to the electrical component and a lesser thickness of a graphene-based material on a portion farther from the electrical component.

Abstract: Examples are disclosed that relate to the manufacture of a reinforced graphitic material. One example provides a method for making a reinforced graphitic material including sorbing an organic compound into void space of a graphitic host material, and heating the graphitic host material to pyrolyze the sorbed organic compound. Elemental carbon is thereby deposited in the void space.

Abstract: A passive thermal heat-pipe material comprising an optical mounting structure including heat producing electronic components is provided. Each structural component of the optical mounting structure may be at least partially comprised of a polymer including a plurality of carbon nanoparticles. In a further aspect, a method of creating an optical structure adapted to support a plurality of heat emitting components is provided. The method includes adding a percentage by concentration of carbon nanoparticles to a polymer base material, mixing the polymer base material and carbon nanoparticles uniformly, melting the mixture at high temperature, forming the melted mixture into a component of the optical structure, and cooling the formed component to solidify the component. The percentage may be between 2 and 10 percent.

Abstract: A metal encased multilayer stack of graphite sheets used as a passive thermal conductor. In the stack, each sheet has a plane high thermal conductivity along a first axis and a plane of lower thermal conductivity along a second axis. The stack is created to have a three-dimensional shape including a length and a width, and the first axis is aligned parallel to said length, the multilayer stack having a height less than the width. A first metal structure surrounds the multilayer stack of graphite sheets, with the metal structure encasing the multilayer stack along the length, width and height of the multilayer stack.

Abstract: Technologies provide a heat pipe having a controlled torque resistance. The techniques disclosed herein provide a heat pipe that can function as a coupling device and as a thermal interface between two moving components of a device without the need of a mechanical hinge. In some configurations, a heat pipe comprises a housing having an outer surface and having an inner surface defining a cavity. The heat pipe can also comprise one or more components for transferring heat from a first region to a second region. In addition, the heat pipe is configured to provide a predetermined torque resistance about a first axis that is perpendicular to a longitudinal axis of the heat pipe. Components, such as a heat source and a heat sink, that are attached to the heat pipe can be hingeably coupled with a predetermined torque resistance without requiring a hinge and a separate thermal interface device.

Abstract: Technologies provide a heat pipe having a controlled torque resistance. The techniques disclosed herein provide a heat pipe that can function as a coupling device and as a thermal interface between two moving components of a device without the need of a mechanical hinge. In some configurations, a heat pipe comprises a housing having an outer surface and having an inner surface defining a cavity. The heat pipe can also comprise one or more components for transferring heat from a first region to a second region. In addition, the heat pipe is configured to provide a predetermined torque resistance about a first axis that is perpendicular to a longitudinal axis of the heat pipe. Components, such as a heat source and a heat sink, that are attached to the heat pipe can be hingeably coupled with a predetermined torque resistance without requiring a hinge and a separate thermal interface device.

Abstract: An apparatus including a palette body, a plurality of heat distribution plates mounted on the body and positioned adjacent each other, a plurality of insulators positioned intermediate the adjacently positioned heat distribution plates, and a plurality of thermal camera calibration reference swatches including a near-ideal blackbody reference swatch, a diffuse reflective reference swatch, and a first material of the device under testing reference swatch, each reference swatch being mounted on a corresponding one of the heat distribution plates and thermally insulated from other reference swatches by the insulators.

Abstract: Examples are disclosed herein that relate to insert molding a heat pipe into a molded part. One example provides a method including inserting a heat pipe into a mold, injecting a material into the mold to at least partially surround the heat pipe and allowing the material to harden into a molded part that incorporates the heat pipe, and incorporating the molded part into a computing device.

Abstract: Examples are disclosed that relate to the manufacture of a reinforced graphitic material. One example provides a method for making a reinforced graphitic material including sorbing an organic compound into void space of a graphitic host material, and heating the graphitic host material to pyrolyze the sorbed organic compound. Elemental carbon is thereby deposited in the void space.

Abstract: An adhesive joint system comprises a circuit board with a distal end and a proximal end mounted on a first side via a tongue and groove connection to a housing. An adhesive is positioned at least in the gap surrounding the tongue, and an electrical component mounted to the distal end on a second side of the circuit board that is opposite the first side. The respective coefficients of thermal expansion (CTE) of the tongue, adhesive, and the material defining the groove are related, such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap.

Abstract: Examples are disclosed herein that relate to a heat removal system utilizing a dispersion that includes particles of an electrical conductor. One example provides a heat removal system including a conduit loop, a dispersion of particles of an electrical conductor in a heat transfer fluid, a pair of electrodes configured to introduce a flow of electric current through the particles in the dispersion, and one or more magnets configured to introduce a magnetic field within the conduit loop in a region of the pair of electrodes, such that the electrodes are operable to apply an electromagnetic pumping force on the particles in the dispersion.

Abstract: The examples disclosed herein are related to graphene-based materials on see-through optical displays. One example provides, a computing device, including a see-through display system including an optical component through which a surrounding environment is viewable, an electrical component disposed on a user-facing side of the optical component, and a graphene-based layer disposed on the optical component, the graphene-based layer comprising a greater thickness of a graphene-based material on a portion closer to the electrical component and a lesser thickness of a graphene-based material on a portion farther from the electrical component.

Abstract: A thermal conduit configured to conduct heat from a heat source to a heat sink and method of forming said conduit are disclosed herein. The thermal conduit may comprise a plurality of stacked sheets formed of an anisotropically thermally conductive material, a non-limiting example of which is graphite, each sheet with a respective orientation of thermal conduction. The orientations of thermal conduction of the plurality of sheets may change stepwise in a stacking direction to form a curved thermal flow path.