Patents by Inventor Erin K. Yeager

Erin K. Yeager has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8053587
    Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: November 8, 2011
    Assignee: Henkel Corporation
    Inventors: Philip T. Klemarczyk, Andrew D. Messana, Afranio Torres-Filho, Erin K. Yeager, Takahisa Doba