Patents by Inventor Erina Kimura

Erina Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240112226
    Abstract: An information transmission apparatus can use a salesclerk information storage unit. The salesclerk information storage unit stores, by a plurality of salesclerks, salesclerk identification information about the salesclerk and detailed information about the salesclerk in association with each other. Then, the information transmission apparatus includes a salesclerk position transmission unit and a detailed information transmission unit. The salesclerk position transmission unit transmits, for each of a plurality of salesclerks present in a store, salesclerk position information about the salesclerk and salesclerk identification information about the salesclerk in association with each other to a customer terminal.
    Type: Application
    Filed: March 19, 2021
    Publication date: April 4, 2024
    Applicants: NEC Corporation, NEC Platforms, Ltd.
    Inventors: Shunya MARUYAMA, Yoshiki MATSUMOTO, Hiroaki SATO, Erina TANAKA, Mami KIMURA
  • Publication number: 20220217978
    Abstract: Provided is an agricultural or horticultural fungicide that has low toxicity to humans and animals, that is excellent in handling safety, and that has an excellent controlling effect against a wide range of plant diseases and a high antimicrobial action against plant disease fungi. The agricultural or horticultural fungicide of the present invention includes, as an active ingredient, an azole derivative represented by the following general formula (I) and other active ingredients.
    Type: Application
    Filed: April 20, 2020
    Publication date: July 14, 2022
    Applicant: Kureha Corporation
    Inventors: Hideaki TATEISHI, Erina KIMURA, Tatsuyuki KOSHIYAMA, Mayumi ISHIKAWA
  • Patent number: 8981014
    Abstract: The present invention provides a novel phosphorus-containing phenolic resin. When the phosphorus-containing phenolic resin is used as an epoxy resin curing agent, the cured product thereof has various excellent properties such as excellent moisture resistance, low permittivity, a low dissipation factor, and excellent adhesion in addition to improved flame retardation. Specifically, the phosphorus-containing phenolic resin of the invention is represented by formula (1). The invention also provides a method for manufacturing the novel phosphorus-containing phenolic resin, a phenolic resin composition including the phosphorus-containing phenolic resin, an epoxy resin curing agent including the phenolic resin composition, an epoxy resin composition including the epoxy resin curing agent and an epoxy resin, a cured product obtained by curing the epoxy resin composition, and a copper-clad laminated plate obtained by using the epoxy resin composition as a matrix resin.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: March 17, 2015
    Assignees: Meiwa Plastic Industries, Ltd., UFC Corporation
    Inventors: Masato Takenouchi, Tadatoshi Fujinaga, Erina Kimura, Yu-Chin Lee, Jen-Hai Liao, Sung-Chen Lo
  • Publication number: 20140378622
    Abstract: The present invention provides a novel phosphorus-containing phenolic resin. When the phosphorus-containing phenolic resin is used as an epoxy resin curing agent, the cured product thereof has various excellent properties such as excellent moisture resistance, low permittivity, a low dissipation factor, and excellent adhesion in addition to improved flame retardation. Specifically, the phosphorus-containing phenolic resin of the invention is represented by formula (1). The invention also provides a method for manufacturing the novel phosphorus-containing phenolic resin, a phenolic resin composition including the phosphorus-containing phenolic resin, an epoxy resin curing agent including the phenolic resin composition, an epoxy resin composition including the epoxy resin curing agent and an epoxy resin, a cured product obtained by curing the epoxy resin composition, and a copper-clad laminated plate obtained by using the epoxy resin composition as a matrix resin.
    Type: Application
    Filed: May 16, 2014
    Publication date: December 25, 2014
    Applicants: MEIWA PLASTIC INDUSTRIES, LTD., UFC CORPORATION
    Inventors: Masato Takenouchi, Tadatoshi Fujinaga, Erina Kimura, Yu-Chin Lee, Jen-Hai Liao, Sung-Chen Lo