Abstract: A method comprising: cold-spraying a surface of a substrate with a bond material to form a bond coating; and cold-spraying a surface of the bond coating with a coating material to form a top coating. The bond material is different from the coating material and harder than the surface of the substrate.

Abstract: A method of joining first and second component bodies comprises: cold-spraying a first joining surface of the first component body with a bond material which is harder than the first joining surface; cold-spraying a second joining surface of the second component body with the bond material; and joining the first and second component bodies by way of the first joining surface.

Abstract: A method comprising: cold-spraying a surface of a substrate with a bond material to form a bond coating; and cold-spraying a surface of the bond coating with a coating material to form a top coating. The bond material is different from the coating material and harder than the surface of the substrate.

Abstract: A method of spray coating a substrate is disclosed, the method comprising: a step of spray coating metal particles onto a substrate; and a step of induction heating the coating; wherein the step of induction heating comprises performing the induction heating in a vacuum.

Abstract: A Cold spray nozzle assembly for depositing powder material onto a component surface includes a primary spray nozzle, two or more secondary spray nozzles, and a support mechanism supporting each spray nozzle. Each spray nozzle deposits powder material on a single target point on the surface, a reference plane being defined normal to a surface plane at the target point. The primary nozzle is in a primary plane that is normal to the surface plane, and that defines a primary dihedral angle with the reference plane. An axis of the primary nozzle defines a primary nozzle angle with the surface plane. Each of the secondary spray nozzles is in a corresponding secondary plane, with each being normal to the surface plane and defining a respective secondary dihedral-angle with the reference plane. An axis of each secondary spray nozzle defines a respective secondary nozzle angle with the surface plane.

Abstract: Cold spray nozzle assembly for depositing powder material onto a surface of a component includes a primary spray nozzle, two or more secondary spray nozzles, and nozzle support mechanism that supports each spray nozzle. Each spray nozzle deposits powder material on a single target point on the surface, a reference-plane being defined normal to a surface-plane at the target point. The primary nozzle is in a primary-plane, the primary-plane being normal to the surface-plane, and defining a primary dihedral-angle with the reference-plane. An axis of the primary nozzle defines a primary nozzle-angle with the surface-plane. Each of the two or more secondary spray nozzles is in a corresponding secondary-plane, with each of the two or more secondary-planes being normal to the surface-plane, defining a respective secondary dihedral-angle with the reference-plane. An axis of each of the two or more secondary spray nozzles defines a respective secondary nozzle-angle with the surface-plane.

Abstract: In a first aspect, the present invention is directed to a microelectrode array for detecting heavy metals in an aqueous solution. The microelectrode array can comprise a layer of a doped carbon film and a patterning layer arranged on the doped carbon film for defining multiple microelectrodes in the doped carbon film to form the microelectrode array. The size, and shape, and arrangement of each of the multiple microelectrodes can be defined by the size, and shape, and arrangement of each of the openings in the patterning layer which expose the underlying doped carbon film. Furthermore, the ratio of the maximal width of a microelectrode relative to the shortest distance between the neighboring microelectrodes (center to center) in the microelectrode array is between about 1:1.2 and about 1:6. The present invention is also directed to an apparatus using the microelectrode array and methods of manufacturing the same.