Abstract: A method of processing a wafer in a production tool includes receiving a wafer at a process tool, the wafer associated with a wafer process history, acquiring data associated with wafers processed by the process tool and having the wafer process history, when the amount of acquired data is insufficient, acquiring additional data associated with wafers processed by the process tool and having a process history differing from the wafer process history by a single factor, when the amount of acquired data is sufficient, determining a process parameter using the acquired data, and processing the wafer with the production tool using the process parameter.

Abstract: A method and an apparatus are provided for parallel fault detection. The method comprises receiving data associated with processing of a workpiece by a first processing tool, receiving data associated with processing of a workpiece by a second processing tool and comparing at least a portion of the received data to a common fault model to determine if a fault associated with at least one of the processing of the workpiece by the first processing tool and processing of the workpiece by the second processing tool occurred.

Abstract: A method includes providing a process controller for controlling a process tool. The process tool is controlled in accordance with a process parameter. Measurements associated with the processing parameter for a plurality of runs of the process tool are accessed. A performance measure for the process controller is generated based on the process parameter and the measurements. A system includes a process tool, a process controller, and a performance monitor. The process controller is configured to control the process tool in accordance with a process parameter. The performance monitor is configured to retrieve measurements associated with the processing parameter for a plurality of runs of the process tool and generate a performance measure for the process controller based on the measured processing parameters.

Abstract: A method and an apparatus for the determination of a process flow based upon fault detection. A process step upon a workpiece is performed. Fault detection analysis based upon the process step performed upon the workpiece is performed. A workpiece routing process is performed based upon the fault detection analysis. The wafer routing process includes using a controller to perform one or a rework process routing, a non-standard process routing, a fault verification process routing, a normal process routing, or a termination process routing, based upon the fault detection analysis.