Abstract: A heat transfer device includes a storage chamber, a coolant housed within the storage chamber, a cooling chamber, one or more heat transfer components, a fluid passage between the storage chamber and the cooling chamber, and a barrier element. The one or more heat transfer components facilitate heat transfer from a heat source outside of the cooling chamber to the cooling chamber. The barrier element may have (i) a closed configuration, and (ii) an open configuration in which the barrier element is configured to allow the coolant in the storage chamber to flow from the storage chamber into the cooling chamber. The barrier element may reconfigure from the closed configuration to the open configuration in response to a trigger condition, such as the coolant housed within the storage chamber reaching a trigger temperature and/or the initial pressure of the coolant housed within the storage chamber reaching a trigger pressure.

Abstract: Heat transfer devices, electronic devices, and methods for heat transfer with an external body. Heat transfer devices include a first disc, a second disc positioned adjacent to the first disc, and at least one spacer positioned between the first disc and the second disc. The first disc defines an aperture and comprises a pin cooling structure extending from around the aperture. The pin cooling structure comprises a distal end configured to facilitate heat exchange between the pin cooling structure and an external/adjacent/separate body and one or more side walls. At least one of the one or more side walls, the distal end, and the aperture at least partially define a pin volume. The second disc defines an inlet that is configured to (i) receive a fluid, and (ii) allow the fluid to flow from the inlet and into the pin volume.

Abstract: Embodiments of the present disclosure generally relate to heat transferring apparatuses and methods. The apparatus and methods utilize the Joule-Thomson effect to remove heat from a heat source to facilitate cooling of the heat source. In one example, an apparatus receives heat from an object to be cooled. The received heat is used to pressurize a fluid. The pressurized fluid is depressurized through a venturi using vapor pressure as a driving force, thus cooling the fluid.

Abstract: Heat transfer devices and methods for enclosing a heat source and facilitating convective heat transfer from the heat source. A heat transfer device includes an outer wall having an outer surface exposed to an environment of the heat transfer device and defining an outer shape of the heat transfer device, and an inner wall defining a flow passage through the heat transfer device. The outer wall and the inner wall collectively define an internal volume that is configured to house the heat source. The flow passage includes an inlet configured to receive a fluid from the environment, and an outlet configured to exhaust the fluid from the flow passage that includes a core region extending between the inlet and the outlet and configured to deliver the fluid from the inlet to the outlet and allow heat to exchange between the fluid within the core region and the internal volume.

Abstract: Heat transfer devices and methods for enclosing a heat source and facilitating convective heat transfer from the heat source. A heat transfer device includes an outer wall having an outer surface exposed to an environment of the heat transfer device and defining an outer shape of the heat transfer device, and an inner wall defining a flow passage through the heat transfer device. The outer wall and the inner wall collectively define an internal volume that is configured to house the heat source. The flow passage comprises an inlet configured to receive a fluid from the environment, and an outlet configured to exhaust the fluid from the flow passage that comprises a core region extending between the inlet and the outlet and configured to deliver the fluid from the inlet to the outlet and allow heat to exchange between the fluid within the core region and the internal volume.

Abstract: Heat transfer devices, electronic devices, and methods for heat transfer with an external body. Heat transfer devices include a first disc, a second disc positioned adjacent to the first disc, and at least one spacer positioned between the first disc and the second disc. The first disc defines an aperture and comprises a pin cooling structure extending from around the aperture. The pin cooling structure comprises a distal end configured to facilitate heat exchange between the pin cooling structure and an external/adjacent/separate body and one or more side walls. At least one of the one or more side walls, the distal end, and the aperture at least partially define a pin volume. The second disc defines an inlet that is configured to (i) receive a fluid, and (ii) allow the fluid to flow from the inlet and into the pin volume.

Abstract: A heat transfer device includes a storage chamber, a coolant housed within the storage chamber, a cooling chamber, one or more heat transfer components, a fluid passage between the storage chamber and the cooling chamber, and a barrier element. The one or more heat transfer components facilitate heat transfer from a heat source outside of the cooling chamber to the cooling chamber. The barrier element may have (i) a closed configuration, and (ii) an open configuration in which the barrier element is configured to allow the coolant in the storage chamber to flow from the storage chamber into the cooling chamber. The barrier element may reconfigure from the closed configuration to the open configuration in response to a trigger condition, such as the coolant housed within the storage chamber reaching a trigger temperature; and/or the initial pressure of the coolant housed within the storage chamber reaching a trigger pressure.

Abstract: Embodiments of the present disclosure generally relate to heat transferring apparatuses and methods. The apparatus and methods utilize the Joules-Thompson effect to remove heat from a heat source to facilitate cooling of the heat source. In one example, an apparatus receives heat from an object to be cooled. The received heat is used to pressurize a fluid. The pressurized fluid is depressurized through a venturi using vapor pressure as a driving force, thus cooling the fluid.

Abstract: The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.

Abstract: The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.

Abstract: The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.

Abstract: The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.

Abstract: The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.

Abstract: The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.