Abstract: An apparatus for positioning dicing saw blades at a fixed axial distance from one another independent of the thicknesses of the saw blades, where the saw blade thickness varies within a range. Flanges, spacers, and retention elements may be employed to achieve desired spacing of dicing saw blades in an assembly. At least one biasing element that is at least partially constrained about its outer radial periphery may be employed to achieve axial positional independence of each dicing saw blade with respect to other dicing saw blades of the assembly. Further, at least one retention feature may also be used to fix the position of the at least one biasing element in the assembly. Machining techniques may be used to form the components and features of the present invention.

Abstract: Centering elements effectively reduce the clearance between a shaft and a rotatable element, such as a blade-fixing flange of a dicing saw for use with semiconductor substrates or carrier substrates. The centering elements may be used to substantially align a center of mass of a rotatable element installed onto the shaft with the axis of rotation of the shaft. The centering element may position the center of mass of a rotatable element at a position that is in substantial alignment with the axis of rotation. Methods for assembling rotatable elements onto shafts and methods for balancing such rotatable elements are also disclosed. Multiple fixtures as well as multiple centering elements may be employed. In addition, one centering element may position more than one fixture.

Abstract: A gang blade assembly which controls the trajectory of detritus from a ball grid array substrate dicing operation is described. The assembly includes a cover which partially encases a hub with a plurality of blades. A brush is mounted on the cover to disrupt an air flow created by rotation of the hub and blades. The brush extends beneath the cover and has bristles which contact the hub. The bristles also serve to clear the hub of any detritus produced during dicing. More than one brush may be mounted on the cover.

Abstract: An apparatus for positioning dicing saw blades at a fixed axial distance from one another independent of the thickness of the saw blades, where the saw blade thickness varies within a range. Flanges, spacers, and retention spacers may be employed to achieve desired spacing of dicing saw blades in the assembly. At least one biasing element that is at least partially constrained about its outer radial periphery may be employed to achieve axial positional independence of each dicing saw blade with respect to other dicing saw blades of the assembly. Further, at least one retention feature may also be used to fix the position of the at least one biasing element in the assembly. Machining techniques may be used to form the components and features of the present invention.

Abstract: Centering elements for effectively reducing the clearance between a shaft and a rotatable element, such as a blade-fixing flange of a dicing saw for semiconductor substrates or carrier substrates, installable thereon are disclosed. In addition, the centering elements may be used to substantially align a center of mass of a rotatable element installed onto the shaft with the axis of rotation of the shaft. The centering element may position the center of mass of a rotatable element at a position that is in substantial alignment with the axis of rotation. Methods for assembling rotatable elements onto shafts and methods for balancing such rotatable elements are also disclosed. Multiple fixtures as well as multiple centering elements may be employed. In addition, one centering element may position more than one fixture.

Abstract: A gang blade assembly which controls the trajectory of detritus from a ball grid array substrate dicing operation is described. The assembly includes a cover which partially encases a hub with a plurality of blades. A brush is mounted on the cover to disrupt an air flow created by rotation of the hub and blades. The brush extends beneath the cover and has bristles which contact the hub. The bristles also serve to clear the hub of any detritus produced during dicing. More than one brush may be mounted on the cover.

Abstract: A gang blade assembly which controls the trajectory of detritus from a ball grid array substrate dicing operation is described. The assembly includes a cover which partially encases a hub with a plurality of blades. A brush is mounted on the cover to disrupt an air flow created by rotation of the hub and blades. The brush extends beneath the cover and has bristles which contact the hub. The bristles also serve to clear the hub of any detritus produced during dicing. More than one brush may be mounted on the cover.

Abstract: Centering elements for effectively reducing the clearance between a shaft and a rotatable element, such as a blade-fixing flange of a dicing saw for semiconductor substrates or carrier substrates, installable thereon are disclosed. In addition, the centering elements may be used to substantially align a center of mass of a rotatable element installed onto the shaft with the axis of rotation of the shaft. The centering element may position the center of mass of a rotatable element at a position that is in substantial alignment with the axis of rotation. Methods for assembling rotatable elements onto shafts and methods for balancing such rotatable elements are also disclosed. Multiple fixtures as well as multiple centering elements may be employed. In addition, one centering element may position more than one fixture.

Abstract: A gang blade assembly which controls the trajectory of detritus from a ball grid array substrate dicing operation is described. The assembly includes a cover which partially encases a hub with a plurality of blades. A brush is mounted on the cover to disrupt an air flow created by rotation of the hub and blades. The brush extends beneath the cover and has bristles which contact the hub. The bristles also serve to clear the hub of any detritus produced during dicing. More than one brush may be mounted on the cover.

Abstract: A gang blade assembly which controls the trajectory of detritus from a bail grid array substrate dicing operation is described. The assembly includes a cover which partially encases a hub with a plurality of blades. A brush is mounted on the cover to disrupt an air flow created by rotation of the hub and blades. The brush extends beneath the cover and has bristles which contact the hub. The bristles also serve to clear the hub of any detritus produced during dicing. More than one brush may be mounted on the cover.

Abstract: An apparatus for positioning dicing saw blades at a fixed axial distance from one another independent of the thicknesses of the saw blades, where the saw blade thickness varies within a range. Flanges, spacers, and retention spacers may be employed to achieve desired spacing of dicing saw blades in the assembly. At least one biasing element that is at least partially constrained about its outer radial periphery may be employed to achieve axial positional independence of each dicing saw blade with respect to other dicing saw blades of the assembly. Further, at least one retention feature may also be used to fix the position of the at least one biasing element in the assembly. Machining techniques may be used to form the components and features of the present invention.

Abstract: A pivot punch that has no explicit pivot point. In one embodiment, the tool includes a die, a punch holder pressable along a path toward the die and a punch supported by the punch holder. The punch extends through and is pivotable in an opening in the holder to move the lower part of the punch laterally toward the center of the die. In another embodiment, the upper part of the punch is held tightly in the holder. The lower part of the punch is flexible to move laterally toward the center of the die. A pivot punch that has no explicit pivot point. The punch is flexible and the punch pivot is permitted by the flexibility of the punch.

Abstract: An improved forming tool for forming at least one lead of a semiconductor package includes a member having at least one surface. The at least one surface of the member has a first shape for forming the at least one lead of the semiconductor package to a shape corresponding to the first shape. The at least one surface includes a diamond-like carbon coating thereon. The semiconductor package lead forming method in accordance with the present invention includes providing a semiconductor package having at least one lead in a first shape. A diamond-like carbon coated surface is applied to the at least one lead in the first shape to form the at least one lead into a second shape.

Abstract: An improved forming tool for forming at least one lead of a semiconductor package includes a member having at least one surface. The at least one surface of the member has a first shape for forming the at least one lead of the semiconductor package to a shape corresponding to the first shape. The at least one surface includes a diamond-like carbon coating thereon. The semiconductor package lead forming method in accordance with the present invention includes providing a semiconductor package having at least one lead in a first shape. A diamond-like carbon coated surface is applied to the at least one lead in the first shape to form the at least one lead into a second shape.