Abstract: Small articles, such as miniature ceramics having integrated circuits bonded thereon, are adjacently positioned with an initial row orientation in parallel first rows in guide tracks having a first row spacing. The first articles in each track are lifted from the tracks by a transfer arm, having rotatable vacuum pickups, along a line angular to the tracks such that the articles have a predetermined second row spacing measured along the transfer arm. The lifted articles are transferred to second rows of vacuum supports therefor by pivoting movement of the arm. The supports have pedestals in columns transverse to the second rows which are indexed into position for repeated transfer of articles thereto to form an array (or matrix) of articles having the second spacing between the second rows of the articles on the supports. A link mechanism is provided to rotate the vacuum pickups and re-establish the initial row orientation of the articles with respect to the second rows.

Abstract: An apparatus aligns small articles, such as semiconductor chips, to a reference axis and loads them on predetermined sites of a carrier, such as a tape. The loading requires precisely positioning adhesive dots and the articles at the sites of the tape. Precision within desired limits is achieved by aligning both an applicator for applying the adhesive and the articles in sequence to a common centerline. The tape is maintained in contact with two diametrically opposed locations of an index wheel located on the common centerline. The index wheel is then reciprocated along the centerline to alternately apply adhesive to one of the sites on the tape and then load the aligned article to another one of the sites. An additional article is aligned to the centerline each time loading is completed of a previously aligned article to its respective site. The aligning facility is operated by a cam which controls the vertical position of a plunger and acts as a valving means for selective vacuum and air purge applications.