Abstract: A photocurable formulation containing a partially polymerized DVS resin formed by heating DVS monomer (1,3-bis(2-bicyclo?4.2.0!octa-1,3,5-trien-3-ylethenyl)-1,1,3,3-tetramethyl disiloxane) in a solvent at an initial concentration of DVS monomer in the solvent of from about 12 to about 32 weight percent. This photocurable formulation may be used as an interlayer dielectric to fabricate thin film multichip modules.

Abstract: A process for forming a partially polymerized DVS resin comprising heating DVS monomer (1,3-bis(2-bicyclo?4.2.0!octa-1,3,5-trien-3-ylethenyl)-1,1,3,3-tetramethyl disiloxane) in a solvent at a concentration of DVS monomer in the solvent such that:(a) the DVS resin, when applied and polymerized in a thin layer on a solid substrate does not craze; and(b) the DVS resin, is rendered photocurable by the addition of at least one photosensitive agent in an amount sufficient to convert the mixture to an organic-insoluble solid upon exposing the mixture to photon radiation and the film retention upon development with a solvent is at least 50 percent. The DVS resin may be used as an interlayer dielectric to fabricate thin film multichip modules.

Abstract: A crude vinylically unsaturated product formed from a palladium-complex-catalyzed reaction of a reactant halide selected from the group consisting of aryl, allyl, vinyl, and benzyl halides, and a reactant olefin having a vinylic hydrogen, wherein the reaction is carried out in the presence of a hydrogen halide acceptor, is purified by first contacting the crude product with a base that is stronger than the hydrogen halide acceptor, then heating the stronger base-contacted product. The purified product shows a marked reduction in concentration bromine and palladium impurities. The product can then be further purified by such methods as chromatography, crystallization, or distillation to achieve a product that is more suitable for applications where very low levels of inorganic impurities are required.

Abstract: The novel compositions of this invention are ignition resistant thermoplastic compositions comprising in admixture a thermoplastic resin and an ignition resistant additive selected from the group consisting of: at least one unsymmetrical carbonic acid ester of the general formula ##STR1## at least one unsymmetrical ether of the general formulaR.sup.2 --O--R.sup.3 ; anda mixture of at least one unsymmetrical carbonic acid ester and at least one unsymmetrical ether;wherein R, R.sup.1, R.sup.2 and R.sup.3 are selected from the group consisting of a halogenated aryl group, a halogenated alkyl group, a halogenated ether group, and mixtures thereof, containing a halogen selected from the group consisting of Br, Cl, I, Fl, and mixtures thereof, wherein R and R.sup.1 are dissimilar and R.sup.2 and R.sup.3 are dissimilar.

Abstract: The compound 1,1,2-trichloro-2,2-difluoroethane is prepared in high yield by contacting 1,1-difluoroethylene and chlorine in the presence of a free radical initiator in a liquid reaction medium.

Abstract: Unsaturated esters can be prepared from dicarboxylic acids and dibromoneopentyl glycol with improved resin color in a shorter reaction time with minimal corrosion of metallic reaction vessels and with a net energy saving by the process using an aryl sulfonic acid as the esterification catalyst and following completion of the reaction neutralizing the acid catalyst.

Abstract: Unsaturated esters can be prepared from dicarboxylic acids and dibromoneopentyl glycol with improved resin color in a shorter reaction time with minimal corrosion of metallic reaction vessels and with a net energy saving by the process using an aryl sulfonic acid as the esterification catalyst and following completion of the reaction neutralizing the acid catalyst.

Abstract: This invention relates to a method for recovering hydrogen bromide gas from a gaseous stream. The method comprises contacting the gaseous stream with a nonaqeous hydrogen bromide absorbent containing acetic acid to absorb at least a portion of the hydrogen bromide. The hydrogen bromide containing absorbent is then heated to desorb at least a portion of the hydrogen bromide.