Abstract: A multilevel semiconductor integrated circuit (IC) structure including a first interconnect level including a layer of dielectric material over a semiconductor substrate, the layer of dielectric material comprising a dense material for passivating semiconductor devices and local interconnects underneath; multiple interconnect layers of dielectric material formed above the layer of dense dielectric material, each layer of dielectric material including at least a layer of low-k dielectric material; and, a set of stacked via-studs in the low-k dielectric material layers, each of said set of stacked via studs interconnecting one or more patterned conductive structures, a conductive structure including a cantilever formed in the low-k dielectric material.

Abstract: A multilevel semiconductor integrated circuit (IC) structure including a first interconnect level including a layer of dielectric material over a semiconductor substrate, the layer of dielectric material comprising a dense material for passivating semiconductor devices and local interconnects underneath; multiple interconnect layers of dielectric material formed above the layer of dense dielectric material, each layer of dielectric material including at least a layer of low-k dielectric material; and, a set of stacked via-studs in the low-k dielectric material layers, each of said set of stacked via studs interconnecting one or more patterned conductive structures, a conductive structure including a cantilever formed in the low-k dielectric material.

Abstract: A multilevel semiconductor integrated circuit (IC) structure including a first interconnect level including a layer of dielectric material over a semiconductor substrate, the layer of dielectric material comprising a dense material for passivating semiconductor devices and local interconnects underneath; multiple interconnect layers of dielectric material formed above the layer of dense dielectric material, each layer of dielectric material including at least a layer of low-k dielectric material; and, a set of stacked via-studs in the low-k dielectric material layers, each of said set of stacked via studs interconnecting one or more patterned conductive structures, a conductive structure including a cantilever formed in the low-k dielectric material.

Abstract: The adhesion of a silicon carbide containing film to a surface is enhanced by employing a transition film of silicon nitride, silicon dioxide and/or silicon oxynitride.

Abstract: A method in a plasma processing chamber for etching through a selected portion of a layer stack. The layer stack comprises a metallization layer, a first barrier layer disposed adjacent to the metallization layer, and a photoresist layer disposed above the metallization layer. The method includes etching at least partially through the first barrier layer using a high sputter component etch. The method further includes etching at least partially through the metallization layer using a low sputter component etch. The low sputter component etch has a sputter component lower than a sputter component of the high sputter component etch.

Abstract: A method is disclosed for locating a particular small objects (down to submicron) within an array of periodically arranged like objects utilizing a scanning tool. The method includes scanning the array for generating a plurality of pulses, which correspond to these objects contained within the array. Counting the plurality of pulses in order to locate the particular object within the array.