Abstract: A wallboard patching apparatus which takes the form of a thin sheet material, bendable base, the base including hiatus means in the form of a plurality of spaced-apart perforations. Centrally attached to the base and extending substantially perpendicular therefrom is a lock pin. The free end of the lock pin includes a hook. Adhesive is to be applied to the front operating face of the base adjacent the periphery thereof. The base is to be deformed and inserted through an opening in the wallboard. Once the base is extended through the wallboard, the lock pin is grasped and the now planar base is moved against the wallboard with the adhesive compressed between the front operating face and the inner surface of the wallboard. A wire bridge member is located between the hook of the lock pin and the exterior surface of the wallboard to fix the position of the base.