Patents by Inventor Ernest N. Urfer

Ernest N. Urfer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process and structure for minimizing delamination in the fabrication of multi-layer ceramic substrate
    Patent number: 4407007
    Abstract: A process and a solid plane structure for minimizing delamination during sintering in the fabrication of multi-layer ceramic substrates, wherein the solid plane structure is designed to obtain maximum ceramic to ceramic interface contact.
    Type: Grant
    Filed: May 28, 1981
    Date of Patent: September 27, 1983
    Assignee: International Business Machines Corporation
    Inventors: Kamalesh S. Desai, Carl L. Eggerding, John A. Ferrante, Raymond Ricci, Ernest N. Urfer
  • Method of fabricating an improved multi-layer ceramic substrate
    Patent number: 4336088
    Abstract: A method of fabricating an improved multi-layer ceramic substrate for mounting semiconductor devices having a low incidence of cracks between metal filled surface vias, the substrate constructed with a top ceramic layer having a thickness that is at least 20 percent greater than the underlying sheets that embody a redistribution system.
    Type: Grant
    Filed: April 27, 1981
    Date of Patent: June 22, 1982
    Assignee: International Business Machines Corp.
    Inventors: Richard J. Hetherington, George E. Melvin, Stephen A. Milkovich, Ernest N. Urfer
  • Multi-layer ceramic substrate
    Patent number: 4302625
    Abstract: An improved multi-layer ceramic substrate for mounting semiconductor devices having a low incidence of cracks between metal filled surface vias, the substrate constructed with a top ceramic layer having a thickness that is at least 20 percent greater than the underlying sheets that embody a redistribution system.
    Type: Grant
    Filed: June 30, 1980
    Date of Patent: November 24, 1981
    Assignee: International Business Machines Corp.
    Inventors: Richard J. Hetherington, George E. Melvin, Stephen A. Milkovich, Ernest N. Urfer
  • Recessed metallurgy for dielectric substrates
    Patent number: 3956052
    Abstract: A ceramic green sheet material is metallized by laminating a thin organic material, preferably MYLAR, to a ceramic green sheet surface, and then employing an electron beam to define a predetermined pattern of openings extending through the organic material and selectively into and through the green sheet. The resulting channels and via holes are then filled with a metal paste. The organic mask is removed by peeling subsequent to the metal paste deposition step.
    Type: Grant
    Filed: February 11, 1974
    Date of Patent: May 11, 1976
    Assignee: International Business Machines Corporation
    Inventors: Walter W. Koste, Ernest N. Urfer