Patents by Inventor Ernest Shen

Ernest Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for fabricating a chemical-mechanical polishing composition
    Patent number: 9803106
    Abstract: Methods for fabricating a chemical-mechanical polishing composition include growing colloidal silica abrasive particles in a liquid including an aminosilane compound such that the aminosilane compound becomes incorporated in the abrasive particles. A dispersion including such colloidal silica abrasive particles may be further processed to obtain a chemical-mechanical polishing composition including colloidal silica particles having the aminosilane compound incorporated therein.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: October 31, 2017
    Assignee: Cabot Microelectronics Corporation
    Inventors: Steven Grumbine, Jeffrey Dysard, Ernest Shen, Mary Cavanaugh, Daniel Clingerman
  • Colloidal silica chemical-mechanical polishing composition
    Patent number: 9499721
    Abstract: A chemical-mechanical polishing composition includes colloidal silica abrasive particles dispersed in a liquid carrier. The colloidal silica abrasive particles include a nitrogen-containing or phosphorus-containing compound incorporated therein such that the particles have a positive charge. The composition may be used to polish a substrate including a silicon oxygen material such as TEOS.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: November 22, 2016
    Assignee: Cabot Microelectronics Corporation
    Inventors: Steven Grumbine, Jeffrey Dysard, Ernest Shen, Mary Cavanaugh
  • Colloidal silica chemical-mechanical polishing concentrate
    Patent number: 9422457
    Abstract: A chemical-mechanical polishing concentrate includes at least 10 weight percent of a colloidal silica abrasive particle dispersed in a liquid carrier having a pH in a range from about 1.5 to about 7. The colloidal silica abrasive includes an aminosilane compound or a phosphonium silane compound incorporated therein. The concentrate may be diluted with at least 3 parts water per one part concentrate prior to use.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: August 23, 2016
    Assignee: Cabot Microelectronics Corporation
    Inventors: Steven Grumbine, Jeffrey Dysard, Ernest Shen, Mary Cavanaugh
  • Colloidal silica chemical-mechanical polishing composition
    Patent number: 9422456
    Abstract: A chemical-mechanical polishing composition includes colloidal silica abrasive particles dispersed in a liquid carrier having a pH in a range from about 1.5 to about 7. The colloidal silica abrasive particles include an aminosilane compound or a phosphonium silane compound incorporated therein. The composition may be used to polish a substrate including a silicon oxygen material such as TEOS.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: August 23, 2016
    Assignee: Cabot Microelectronics Corporation
    Inventors: Steven Grumbine, Jeffrey Dysard, Ernest Shen, Mary Cavanaugh
  • METHODS FOR FABRICATING A CHEMICAL-MECHANICAL POLISHING COMPOSITION
    Publication number: 20150376460
    Abstract: Methods for fabricating a chemical-mechanical polishing composition include growing colloidal silica abrasive particles in a liquid including an aminosilane compound such that the aminosilane compound becomes incorporated in the abrasive particles. A dispersion including such colloidal silica abrasive particles may be further processed to obtain a chemical-mechanical polishing composition including colloidal silica particles having the aminosilane compound incorporated therein.
    Type: Application
    Filed: June 25, 2015
    Publication date: December 31, 2015
    Inventors: Steven Grumbine, Jeffrey Dysard, Ernest Shen, Mary Cavanaugh, Daniel Clingerman
  • COLLOIDAL SILICA CHEMICAL-MECHANICAL POLISHING CONCENTRATE
    Publication number: 20150376461
    Abstract: A chemical-mechanical polishing concentrate includes at least 10 weight percent of a colloidal silica abrasive particle dispersed in a liquid carrier having a pH in a range from about 1.5 to about 7. The colloidal silica abrasive includes an aminosilane compound or a phosphonium silane compound incorporated therein. The concentrate may be diluted with at least 3 parts water per one part concentrate prior to use.
    Type: Application
    Filed: June 25, 2015
    Publication date: December 31, 2015
    Inventors: Steven Grumbine, Jeffrey Dysard, Ernest Shen, Mary Cavanaugh
  • COLLOIDAL SILICA CHEMICAL-MECHANICAL POLISHING COMPOSITION
    Publication number: 20150376458
    Abstract: A chemical-mechanical polishing composition includes colloidal silica abrasive particles dispersed in a liquid carrier having a pH in a range from about 1.5 to about 7. The colloidal silica abrasive particles include an aminosilane compound or a phosphonium silane compound incorporated therein. The composition may be used to polish a substrate including a silicon oxygen material such as TEOS.
    Type: Application
    Filed: June 25, 2015
    Publication date: December 31, 2015
    Inventors: Steven Grumbine, Jeffrey Dysard, Ernest Shen, Mary Cavanaugh
  • COLLOIDAL SILICA CHEMICAL-MECHANICAL POLISHING COMPOSITION
    Publication number: 20150376459
    Abstract: A chemical-mechanical polishing composition includes colloidal silica abrasive particles dispersed in a liquid carrier. The colloidal silica abrasive particles include a nitrogen-containing or phosphorus-containing compound incorporated therein such that the particles have a positive charge. The composition may be used to polish a substrate including a silicon oxygen material such as TEOS.
    Type: Application
    Filed: June 25, 2015
    Publication date: December 31, 2015
    Inventors: Steven Grumbine, Jeffrey Dysard, Ernest Shen, Mary Cavanaugh