Abstract: An electronic device assembly includes an electronic device having a mount that includes a mounting opening. The mounting opening is configured to receive mounting hardware therein for mounting the electronic device to a structure. An isolator is coupled to the mount. The isolator includes an elastomeric bushing configured to attenuate at least one of shock or vibration exerted on the electronic device. The isolator is incorporated within the mount such that the elastomeric bushing is received into the mounting opening of the mount.

Abstract: An isolation system is provided for an electronic device that is configured to be mounted to a structure. The isolation system includes a flexible conductor configured to be electrically connected to the electronic device. The isolation system also includes an isolator configured to be coupled between the electronic device and the structure such that the isolator is configured to attenuate at least one of shock or vibration exerted on the electronic device. At least a portion of the isolator is electrically conductive. The isolator is electrically connected to the flexible conductor and is configured to be electrically connected to the structure such that the isolator provides an electrical path between the flexible conductor and the structure.

Abstract: An electronic device assembly includes an electronic device having a mount that includes a mounting opening. The mounting opening is configured to receive mounting hardware therein for mounting the electronic device to a structure. An isolator is coupled to the mount. The isolator includes an elastomeric bushing configured to attenuate at least one of shock or vibration exerted on the electronic device. The isolator is incorporated within the mount such that the elastomeric bushing is received into the mounting opening of the mount.

Abstract: An isolation system is provided for an electronic device that is configured to be mounted to a structure. The isolation system includes a flexible conductor configured to be electrically connected to the electronic device. The isolation system also includes an isolator configured to be coupled between the electronic device and the structure such that the isolator is configured to attenuate at least one of shock or vibration exerted on the electronic device. At least a portion of the isolator is electrically conductive. The isolator is electrically connected to the flexible conductor and is configured to be electrically connected to the structure such that the isolator provides an electrical path between the flexible conductor and the structure.

Abstract: A method and system for packaging electronics with an electronic card rack of radial panels, an outer casing, a stabilizing ring, and a flex-circuit interconnect, whereby electronic cards inserted into the sectors formed by the radial panels do not carry the structural load. The card-mounted devices are optimally oriented for set back forces, and minimal potting and/or structural foam is required, if any. The present invention provides a lightweight, highly serviceable assembly that is relatively less expensive to produce, test and rework compared with potted assemblies.

Abstract: Disclosed is method and system for packaging electronics with an electronic card rack of radial panels, an outer casing, a stabilizing ring, and a flex-circuit interconnect, whereby electronic cards inserted into the sectors formed by the radial panels do not carry the structural load. The card-mounted devices are optimally oriented for set back forces, and minimal potting and/or structural foam is required, if any. The present invention provides a lightweight, highly serviceable assembly that is relatively less expensive to produce, test and rework compared with potted assemblies.