Patents by Inventor Ernest W. Combs

Ernest W. Combs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Textured encapsulant surface in LED packages
    Patent number: 9431589
    Abstract: A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.
    Type: Grant
    Filed: December 14, 2007
    Date of Patent: August 30, 2016
    Assignee: CREE, INC.
    Inventors: Ban P. Loh, Chenhua You, Bernd Keller, Nathaniel O. Cannon, Mitch Jackson, Ernest W. Combs
  • Textured encapsulant surface in LED packages
    Publication number: 20090152573
    Abstract: A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.
    Type: Application
    Filed: December 14, 2007
    Publication date: June 18, 2009
    Inventors: Ban P. Loh, Chenhua You, Bernd Keller, Nathaniel O. Cannon, Mitch Jackson, Ernest W. Combs