Patents by Inventor Ernest Wayne Balch
Ernest Wayne Balch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8466007Abstract: A power semiconductor module includes: an interconnect layer including an electrical conductor patterned on a dielectric layer, the electrical conductor including a power coupling portion having a thickness sufficient to carry power currents and a control coupling portion having a thickness thinner than that of the power coupling portion; and a semiconductor power device physically coupled to the interconnect layer and electrically coupled to the power coupling portion of the electrical conductor.Type: GrantFiled: September 20, 2011Date of Patent: June 18, 2013Assignee: General Electric CompanyInventors: Eladio Clemente Delgado, Richard Alfred Beaupre, Stephen Daley Arthur, Ernest Wayne Balch, Kevin Matthew Durocher, Paul Alan McConnelee, Raymond Albert Fillion
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Publication number: 20120009733Abstract: A power semiconductor module includes: an interconnect layer including an electrical conductor patterned on a dielectric layer, the electrical conductor including a power coupling portion having a thickness sufficient to carry power currents and a control coupling portion having a thickness thinner than that of the power coupling portion; and a semiconductor power device physically coupled to the interconnect layer and electrically coupled to the power coupling portion of the electrical conductor.Type: ApplicationFiled: September 20, 2011Publication date: January 12, 2012Inventors: Eladio Clemente Delgado, Richard Alfred Beaupre, Stephen Daley Arthur, Ernest Wayne Balch, Kevin Matthew Durocher, Paul Alan Mcconnelee, Raymond Albert Fillion
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Patent number: 8053260Abstract: Large-Area lighting systems and methods of making the same. More specifically, groups of organic light emitting modules, such as organic light emitting diode modules, coupled in series with respect to on another are provided. The modules cathode of each organic light emitting module is electrically coupled to the anode of an adjacent light emitting module in an interconnect region. A portion of the cathode of each module extends adjacent to an active area of an adjacent module at an interconnect region. Methods of fabricating series groups of organic light emitting modules employing continuous material layers is also provided.Type: GrantFiled: November 17, 2006Date of Patent: November 8, 2011Assignee: General Electric CompanyInventors: Donald Franklin Foust, Larry Gene Turner, Ernest Wayne Balch, Hak Fei Poon, William Francis Nealon, Jie Liu, Tami Janene Faircloth
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Patent number: 8049338Abstract: A power semiconductor module includes: an interconnect layer including an electrical conductor patterned on a dielectric layer, the electrical conductor including a power coupling portion having a thickness sufficient to carry power currents and a control coupling portion having a thickness thinner than that of the power coupling portion; and a semiconductor power device physically coupled to the interconnect layer and electrically coupled to the power coupling portion of the electrical conductor.Type: GrantFiled: April 7, 2006Date of Patent: November 1, 2011Assignee: General Electric CompanyInventors: Eladio Clemente Delgado, Richard Alfred Beaupre, Stephen Daley Arthur, Ernest Wayne Balch, Kevin Matthew Durocher, Paul Alan McConnelee, Raymond Albert Fillion
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Publication number: 20090199392Abstract: A method for fabricating an ultrasound transducer structure is disclosed. The method includes performing the steps of forming a functional layer, including an ultrasound transducer material and a photopolymer, and exposing a plurality of selected regions of the functional layer to a programmable light pattern to cure the selected regions of the functional layer to form polymerized ultrasound transducer material regions, repeatedly. The method further includes selectively removing unexposed regions of the functional layer to obtain a green component, and sintering the green component to obtain the sensing structure. A system for making at least one piezoelectric element is also disclosed.Type: ApplicationFiled: April 1, 2008Publication date: August 13, 2009Applicant: GENERAL ELECTRIC COMPANYInventors: Prabhjot Singh, Martin Kin-Fei Lee, James Anthony Brewer, Paul Aloysius Meyer, Thomas James Batzinger, Venkat Subramaniam Venkataramani, James Norman Barshinger, Ernest Wayne Balch
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Patent number: 7427566Abstract: A method is provided. The method includes forming a conductive layer on an inner surface of a substrate and providing a sacrificial layer over the conductive layer. The method includes forming a plurality of channels in the sacrificial layer and plating the sacrificial layer to substantially fill the plurality of channels with a plating material comprising conducting material. The method also includes etching the sacrificial layer to form a conducting structure having fins where conducting material remains separated by microchannels where the sacrificial layer is etched.Type: GrantFiled: December 9, 2005Date of Patent: September 23, 2008Assignee: General Electric CompanyInventors: Kevin Matthew Durocher, Stacey Joy Goodwin, Ernest Wayne Balch, Christopher James Kapusta
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Publication number: 20080116815Abstract: Large-Area lighting systems and methods of making the same. More specifically, groups of organic light emitting modules, such as organic light emitting diode modules, coupled in series with respect to on another are provided. The modules cathode of each organic light emitting module is electrically coupled to the anode of an adjacent light emitting module in an interconnect region. A portion of the cathode of each module extends adjacent to an active area of an adjacent module at an interconnect region. Methods of fabricating series groups of organic light emitting modules employing continuous material layers is also provided.Type: ApplicationFiled: November 17, 2006Publication date: May 22, 2008Inventors: Donald Franklin Foust, Larry Gene Turner, Ernest Wayne Balch, Hak Fei Poon, William Francis Nealon, Jie Liu, Tami Janene Faircloth
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Patent number: 7146081Abstract: A method for adaptively fabricating a waveguide comprises: measuring misplacement of a photonic device relative to a substrate; generating computer readable instructions for using a plurality of graphics primitives to form the waveguide; and photocomposing the waveguide on the substrate in accordance with the computer readable instructions. A reticle comprises a plurality of graphics primitives with at least one of the plurality of graphics primitives comprising a tapered end. A waveguide comprises a plurality of waveguide segments with each of the plurality of waveguide segments comprising a tapered end and being adjacent to at least one other of the plurality of waveguide segments.Type: GrantFiled: July 8, 2005Date of Patent: December 5, 2006Assignee: General Electric CompanyInventors: Ernest Wayne Balch, Leonard Richard Douglas, Min-Yi Shih
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Patent number: 7049757Abstract: A light emitting device comprises a plurality of organic light emitting diode (OLED) modules. The OLED modules are arranged into a series group where the individual OLED modules are electrically connected in series. The device is configured to be coupled to a power supply. A display is also provided. The display includes a plurality of OLED modules arranged to depict a shape selected from the group consisting of at least one letter, at least one number, at least one image, and a combination thereof.Type: GrantFiled: August 5, 2002Date of Patent: May 23, 2006Assignee: General Electric CompanyInventors: Donald Franklin Foust, Ernest Wayne Balch, Anil Raj Duggal, Christian Maria Anton Heller, Renato Guida, William Francis Nealon, Tami Janene Faircloth
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Patent number: 6957007Abstract: A method for adaptively fabricating a waveguide comprises: measuring misplacement of a photonic device relative to a substrate; generating computer readable instructions for using a plurality of graphics primitives to form the waveguide; and photocomposing the waveguide on the substrate in accordance with the computer readable instructions. A reticle comprises a plurality of graphics primitives with at least one of the plurality of graphics primitives comprising a tapered end. A waveguide comprises a plurality of waveguide segments with each of the plurality of waveguide segments comprising a tapered end and being adjacent to at least one other of the plurality of waveguide segments.Type: GrantFiled: July 29, 2002Date of Patent: October 18, 2005Assignee: General Electric CompanyInventors: Ernest Wayne Balch, Leonard Richard Douglas, Min-Yi Shih
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Patent number: 6935792Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.Type: GrantFiled: October 21, 2002Date of Patent: August 30, 2005Assignee: General Electric CompanyInventors: Richard Joseph Saia, Thomas Bert Gorczyca, Christopher James Kapusta, Ernest Wayne Balch, Glenn Scott Claydon, Samhita Dasgupta, Eladio Clemente Delgado
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Patent number: 6733711Abstract: There is provided a flexible circuit module, including at least one rigid carrier, at least one solid state device mounted over a first side of the at least one rigid carrier, a flexible base supporting a second side of the at least one rigid carrier, a conductive interconnect pattern on the flexible base, and a plurality of feed through electrodes extending from the first side to the second side of the at least one rigid carrier and electrically connecting the conductive interconnect pattern with the at least one of a plurality of the solid state devices. The solid state devices may be LED chips to form an LED array module.Type: GrantFiled: March 14, 2003Date of Patent: May 11, 2004Assignee: General Electric CompanyInventors: Kevin Matthew Durocher, Ernest Wayne Balch, Vikram B. Krishnamurthy, Richard Joseph Saia, Herbert Stanley Cole, Ronald Frank Kolc
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Patent number: 6730533Abstract: There is provided a flexible circuit module, including at least one rigid carrier, at least one solid state device mounted over a first side of the at least one rigid carrier, a flexible base supporting a second side of the at least one rigid carrier, a conductive interconnect pattern on the flexible base, and a plurality of feed through electrodes extending from the first side to the second side of the at least one rigid carrier and electrically connecting the conductive interconnect pattern with the at least one of a plurality of the solid state devices. The solid state devices may be LED chips to form an LED array module.Type: GrantFiled: March 14, 2003Date of Patent: May 4, 2004Assignee: General Electric CompanyInventors: Kevin Matthew Durocher, Ernest Wayne Balch, Vikram B. Krishnamurthy, Richard Joseph Saia, Herbert Stanley Cole, Ronald Frank Kolc
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Publication number: 20040076382Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.Type: ApplicationFiled: October 21, 2002Publication date: April 22, 2004Applicant: General Electric CompanyInventors: Richard Joseph Saia, Thomas Bert Gorczyca, Christopher James Kapusta, Ernest Wayne Balch, Glenn Scott Claydon, Samhita Dasgupta, Eladio Clemente Delgado
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Publication number: 20040021425Abstract: A light emitting device comprises a plurality of organic light emitting diode (OLED) modules. The OLED modules are arranged into a series group where the individual OLED modules are electrically connected in series. The device is configured to be coupled to a power supply. A display is also provided. The display includes a plurality of OLED modules arranged to depict a shape selected from the group consisting of at least one letter, at least one number, at least one image, and a combination thereof.Type: ApplicationFiled: August 5, 2002Publication date: February 5, 2004Inventors: Donald Franklin Foust, Ernest Wayne Balch, Anil Raj Duggal, Christian Maria Anton Heller, Renato Guida, William Francis Nealon, Tami Janene Faircloth
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Publication number: 20040017974Abstract: A method for adaptively fabricating a waveguide comprises: measuring misplacement of a photonic device relative to a substrate; generating computer readable instructions for using a plurality of graphics primitives to form the waveguide; and photocomposing the waveguide on the substrate in accordance with the computer readable instructions. A reticle comprises a plurality of graphics primitives with at least one of the plurality of graphics primitives comprising a tapered end. A waveguide comprises a plurality of waveguide segments with each of the plurality of waveguide segments comprising a tapered end and being adjacent to at least one other of the plurality of waveguide segments.Type: ApplicationFiled: July 29, 2002Publication date: January 29, 2004Applicant: General Electric CompanyInventors: Ernest Wayne Balch, Leonard Richard Douglas, Min-Yi Shih
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Patent number: 6614103Abstract: There is provided a flexible circuit module, including at least one rigid carrier, at least one solid state device mounted over a first side of the at least one rigid carrier, a flexible base supporting a second side of the at least one rigid carrier, a conductive interconnect pattern on the flexible base, and a plurality of feed through electrodes extending from the first side to the second side of the at least one rigid carrier and electrically connecting the conductive interconnect pattern with the at least one of a plurality of the solid state devices. The solid state devices may be LED chips to form an LED array module.Type: GrantFiled: September 1, 2000Date of Patent: September 2, 2003Assignee: General Electric CompanyInventors: Kevin Matthew Durocher, Ernest Wayne Balch, Vikram B. Krishnamurthy, Richard Joseph Saia, Herbert Stanley Cole, Ronald Frank Kolc
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Publication number: 20030160256Abstract: There is provided a flexible circuit module, including at least one rigid carrier, at least one solid state device mounted over a first side of the at least one rigid carrier, a flexible base supporting a second side of the at least one rigid carrier, a conductive interconnect pattern on the flexible base, and a plurality of feed through electrodes extending from the first side to the second side of the at least one rigid carrier and electrically connecting the conductive interconnect pattern with the at least one of a plurality of the solid state devices. The solid state devices may be LED chips to form an LED array module.Type: ApplicationFiled: March 14, 2003Publication date: August 28, 2003Applicant: General Electric CompanyInventors: Kevin Matthew Durocher, Ernest Wayne Balch, Vikram B. Krishnamurthy, Richard Joseph Saia, Herbert Stanley Cole, Ronald Frank Kolc
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Publication number: 20030153108Abstract: There is provided a flexible circuit module, including at least one rigid carrier, at least one solid state device mounted over a first side of the at least one rigid carrier, a flexible base supporting a second side of the at least one rigid carrier, a conductive interconnect pattern on the flexible base, and a plurality of feed through electrodes extending from the first side to the second side of the at least one rigid carrier and electrically connecting the conductive interconnect pattern with the at least one of a plurality of the solid state devices. The solid state devices may be LED chips to form an LED array module.Type: ApplicationFiled: March 14, 2003Publication date: August 14, 2003Applicant: General Electric CompanyInventors: Kevin Matthew Durocher, Ernest Wayne Balch, Vikram B. Krishnamurthy, Richard Joesph Saia, Herbert Stanley Cole, Ronald Frank Kolc
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Patent number: 6602739Abstract: A method for making a multichip “HDI” module includes the step of making a substrate for supporting the semiconductor or solid-state chips (or other components) by applying electrical conductor in a pattern to a first dielectric sheet, and applying encapsulating material to the electrical conductor. Apertures are made in the first dielectric sheet and encapsulant at locations at which the chips (or other components) are to be located. The components are affixed to a second dielectric sheet at locations registered with the apertures in the first sheet, and the sheets are juxtaposed with the chips extending into the apertures. This results in the formation of gaps between the components and the edges of the apertures, which gaps are then filled with hardenable or curable material. Electrical connection is made to the pads of the chips by means of a multilayer structure of dielectric sheets with conductor patterns, interconnected by means of plated-through vias.Type: GrantFiled: March 19, 2002Date of Patent: August 5, 2003Assignee: Lockheed Martin CorporationInventors: James Wilson Rose, Thomas Bert Gorczyca, Christopher James Kapusta, Ernest Wayne Balch, Kevin Matthew Durocher