Patents by Inventor Ernesto Alapit Opiniano

Ernesto Alapit Opiniano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for stack-packaging integrated circuit die using at least one die in the package as a spacer
    Publication number: 20040067606
    Abstract: A method for producing a semiconductor package without spacer components has steps of (a) providing at least two rectangular die components each having a length greater than a width and bond pads implemented on the short sides only; (b) cross stacking the die components on a substrate for package assembly such that the bond-pad arrays are unobstructed; (c) wire bonding the unobstructed bond pads on each die component to the substrate; and (d) encapsulating the package.
    Type: Application
    Filed: October 2, 2002
    Publication date: April 8, 2004
    Inventors: Gerald K. Fehr, Ernesto Alapit Opiniano