Patents by Inventor Ernesto Nicanor Santillan Guerrero

Ernesto Nicanor Santillan Guerrero has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic assembly remanufacturing system and method
    Patent number: 7681778
    Abstract: A method for remanufacturing an electronic assembly includes removing a first portion of an assembly housing to expose an underside of an enclosed circuit assembly. One or more solder joints on the underside of the circuit assembly are associated with at least one component that is also affixed to a portion of the housing. The opened electronic assembly is lowered onto a desoldering fixture having a plurality of solder pots configured to encompass, and thus desolder, the solder joints associated with the component that is affixed to a portion of the housing. Once the affected solder joints are melted, the remaining portion of the housing and the component affixed thereto may be lifted away, exposing the top surface of the circuit assembly for analysis, repair, and or adjustment.
    Type: Grant
    Filed: November 20, 2007
    Date of Patent: March 23, 2010
    Assignee: Caterpillar Inc.
    Inventors: Paul C Gottshall, Ernesto Nicanor Santillan Guerrero
  • ELECTRONIC ASSEMBLY REMANUFACTURING SYSTEM AND METHOD
    Publication number: 20090127321
    Abstract: A method for remanufacturing an electronic assembly includes removing a first portion of an assembly housing to expose an underside of an enclosed circuit assembly. One or more solder joints on the underside of the circuit assembly are associated with at least one component that is also affixed to a portion of the housing. The opened electronic assembly is lowered onto a desoldering fixture having a plurality of solder pots configured to encompass, and thus desolder, the solder joints associated with the component that is affixed to a portion of the housing. Once the affected solder joints are melted, the remaining portion of the housing and the component affixed thereto may be lifted away, exposing the top surface of the circuit assembly for analysis, repair, and or adjustment.
    Type: Application
    Filed: November 20, 2007
    Publication date: May 21, 2009
    Applicant: CATERPILLAR INC.
    Inventors: Paul C. Gottshall, Ernesto Nicanor Santillan Guerrero