Abstract: An electronic device includes a die attach pad with a set of cantilevered first leads for down bond connections, a set of second leads spaced apart from the die attach pad, a semiconductor die mounted to the die attach pad and enclosed by a package structure, a set of first bond wires connected between respective bond pads of the semiconductor die and at least some of the first leads, and a set of second bond wires connected between respective further bond pads of the semiconductor die and at least some of the second leads.

Abstract: A gang clip includes a plurality of clips formed from a metal each having a center region oriented along a first plane and an angled clip foot having a foot height, a length and a bend angle sufficient to electrically contact a lead terminal of the leadframe to be used to form a device. Adjacent ones of the plurality of clips are joined to one another by a first tie bar also oriented along the first plane. The first tie bar extends to a saw street region located between adjacent ones of the clips. A second tie bar attached to the first tie bar is positioned in the saw street region.

Abstract: An integrated circuit package includes a lead frame, a first die adhered to the lead frame on a first side of the first die, and a first clip having a clip foot adhered to the lead frame. The first clip has a first side and a second side. A first die attachment region is defined by a first group of four notches in the first side of the first clip. The first clip extends from the lead frame and contacts a second side of the first die at the first die attachment region via a first layer of solder paste. The integrated circuit package further has a second die adhered to the second side of the first clip on a first side of the second die, and a second clip having a clip foot adhered to the lead frame. The second clip has a first side and a second side. A second die attachment region is defined by a second group of four notches in the first side of the second clip.

Abstract: An electronic device includes a die attach pad with a set of cantilevered first leads for down bond connections, a set of second leads spaced apart from the die attach pad, a semiconductor die mounted to the die attach pad and enclosed by a package structure, a set of first bond wires connected between respective bond pads of the semiconductor die and at least some of the first leads, and a set of second bond wires connected between respective further bond pads of the semiconductor die and at least some of the second leads.

Abstract: An electronic device includes a die attach pad with a set of cantilevered first leads for down bond connections, a set of second leads spaced apart from the die attach pad, a semiconductor die mounted to the die attach pad and enclosed by a package structure, a set of first bond wires connected between respective bond pads of the semiconductor die and at least some of the first leads, and a set of second bond wires connected between respective further bond pads of the semiconductor die and at least some of the second leads.

Abstract: An electronic package includes an electronic component including terminals, a plurality of leads, at least some of the leads being electrically coupled to the terminals within the electronic package, and a mold compound covering the electronic component and partially covering the leads. Each of the leads include an exposed bottom face coplanar with a bottom surface of the mold compound and an exposed end face coplanar with one of a plurality of side surfaces of the mold compound. For at least some of the leads, the exposed end face includes a narrow portion forming a concave recess, the narrow portion being between top and bottom edges of the exposed end face.

Abstract: A gang clip includes a plurality of clips formed from a metal each having a center region oriented along a first plane and an angled clip foot having a foot height, a length and a bend angle sufficient to electrically contact a lead terminal of the leadframe to be used to form a device. Adjacent ones of the plurality of clips are joined to one another by a first tie bar also oriented along the first plane. The first tie bar extends to a saw street region located between adjacent ones of the clips. A second tie bar attached to the first tie bar is positioned in the saw street region.

Abstract: An electronic device includes a die attach pad with a set of cantilevered first leads for down bond connections, a set of second leads spaced apart from the die attach pad, a semiconductor die mounted to the die attach pad and enclosed by a package structure, a set of first bond wires connected between respective bond pads of the semiconductor die and at least some of the first leads, and a set of second bond wires connected between respective further bond pads of the semiconductor die and at least some of the second leads.

Abstract: A lead frame includes a first side having a first die attach pad that is bondable to a die, and a second side that has a second die attach pad that is bondable to another die. The lead frame includes multiple leads on the edges of the lead frame to connect the die. As part of a no-leads device, such as a quad flat no leads (QFN) or dual flat no-leads (DFN), one of the die attach pads is used in binding to a die, and the other die attach pad is used for thermal dissipation and mounting to a structure such as printed circuit board (PCB).

Abstract: A lead frame with an IC chip pad with an alignment notch. A method of mounting a packaged IC chip on a lead frame at a precise angle by aligning a corner of the packaged IC chip to an alignment notch on the lead frame.