Patents by Inventor Ernian Pan

Ernian Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7627428
    Abstract: The present invention generally relates to methods for rapidly calculating the surface displacement that results from an arbitrarily shaped load on the surface of a layered substrate. Some embodiments include sparse direct calculations of surface displacement in combination with interpolation methods for estimating surface displacement at other points. Some embodiments include methods for reducing computer time required for calculating surface displacement caused by an arbitrarily shaped load on a layered surface.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: December 1, 2009
    Assignee: The University of Akron
    Inventors: Ernian Pan, Michael Bevis, Feng Han, Hao Zhou, Ronghua Zhu
  • Publication number: 20080177483
    Abstract: The present invention generally relates to methods for rapidly calculating the surface displacement that results from an arbitrarily shaped load on the surface of a layered substrate. Some embodiments include sparse direct calculations of surface displacement in combination with interpolation methods for estimating surface displacement at other points. Some embodiments include methods for reducing computer time required for calculating surface displacement caused by an arbitrarily shaped load on a layered surface.
    Type: Application
    Filed: November 1, 2007
    Publication date: July 24, 2008
    Applicant: THE UNIVERSITY OF AKRON
    Inventors: Ernian PAN, Michael BEVIS, Feng HAN, Hao ZHOU, Ronghua ZHU