Patents by Inventor Ernie Geronaga

Ernie Geronaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070012982
    Abstract: The present invention adds a plurality of substrate barriers for reducing substrate noise. The barriers, consisting of a plurality of equally sized n-well regions formed within the p-substrate, are formed between the analog and digital portions and on at least one side of sensitive analog circuits. A MOSFET transistor configured as a capacitor is formed within each of the n-well regions and is coupled between supply and circuit common to filter supply noise. A metal layer capacitor is formed above each MOSFET capacitor and is coupled between supply and circuit common. The present inventive circuit adds metallization to satisfy metal percentage requirements and to improve noise filtering. Each barrier region includes a plurality of coupled (shorted) n-wells with MOSFET transistors configured as capacitors. Additionally, in the described embodiment, the metallization layer is formed to create metal capacitors on top layers of the n-well regions to create additional noise filtering between supply and ground.
    Type: Application
    Filed: September 25, 2006
    Publication date: January 18, 2007
    Applicant: Broadcom Corporation, a California Corporation
    Inventors: Stephen Wu, Ernie Geronaga
  • Patent number: 7112838
    Abstract: The present invention adds a plurality of substrate barriers for reducing substrate noise. The barriers, consisting of a plurality of equally sized n-well regions formed within the p-substrate, are formed between the analog and digital portions and on at least one side of sensitive analog circuits. A MOSFET transistor configured as a capacitor is formed within each of the n-well regions and is coupled between supply and circuit common to filter supply noise. A metal layer capacitor is formed above each MOSFET capacitor and is coupled between supply and circuit common. The present inventive circuit adds metallization to satisfy metal percentage requirements and to improve noise filtering. Each barrier region includes a plurality of coupled (shorted) n-wells with MOSFET transistors configured as capacitors. Additionally, in the described embodiment, the metallization layer is formed to create metal capacitors on top layers of the n-well regions to create additional noise filtering between supply and ground.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: September 26, 2006
    Assignee: Broadcom Corporation
    Inventors: Stephen Wu, Ernie Geronaga
  • Publication number: 20050224885
    Abstract: The present invention adds a plurality of substrate barriers for reducing substrate noise. The barriers, consisting of a plurality of equally sized n-well regions formed within the p-substrate, are formed between the analog and digital portions and on at least one side of sensitive analog circuits. A MOSFET transistor configured as a capacitor is formed within each of the n-well regions and is coupled between supply and circuit common to filter supply noise. A metal layer capacitor is formed above each MOSFET capacitor and is coupled between supply and circuit common. The present inventive circuit adds metallization to satisfy metal percentage requirements and to improve noise filtering. Each barrier region includes a plurality of coupled (shorted) n-wells with MOSFET transistors configured as capacitors. Additionally, in the described embodiment, the metallization layer is formed to create metal capacitors on top layers of the n-well regions to create additional noise filtering between supply and ground.
    Type: Application
    Filed: March 31, 2004
    Publication date: October 13, 2005
    Inventors: Stephen Wu, Ernie Geronaga