Patents by Inventor Ernie Johannus Antonius Schoot Uiterkamp

Ernie Johannus Antonius Schoot Uiterkamp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microfused silicon strain gauge (MSG) pressure sensor package
    Patent number: 9746390
    Abstract: Methods and apparatus for a microfused silicon strain gauge pressure sensor. A pressure sensor package includes a sense element configured to be exposed to a pressure environment, the sense element including at least one strain gauge, an electronics package disposed on a carrier and electrically coupled to the sense element, the carrier disposed on a port that includes the sense element, the port enabling a decoupling feature for sealing and parasitic sealing forces and a reduction of a port length, a housing disposed about the sense element and electronics package, and a connector joined to the housing and electrically connected to the electronics package, the connector including an external interface.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: August 29, 2017
    Assignee: SENSATA TECHNOLOGIES, INC.
    Inventors: Ernie Johannus Antonius Schoot Uiterkamp, Dedde Hedzer Wiersma, Frank Hendri Jacobs
  • MICROFUSED SILICON STRAIN GAUGE (MSG) PRESSURE SENSOR PACKAGE
    Publication number: 20160252418
    Abstract: Methods and apparatus for a microfused silicon strain gauge pressure sensor. A pressure sensor package includes a sense element configured to be exposed to a pressure environment, the sense element including at least one strain gauge, an electronics package disposed on a carrier and electrically coupled to the sense element, the carrier disposed on a port that includes the sense element, the port enabling a decoupling feature for sealing and parasitic sealing forces and a reduction of a port length, a housing disposed about the sense element and electronics package, and a connector joined to the housing and electrically connected to the electronics package, the connector including an external interface.
    Type: Application
    Filed: February 26, 2015
    Publication date: September 1, 2016
    Inventors: Ernie Johannus Antonius Schoot Uiterkamp, Dedde Hedzer Wiersma, Frank Hendri Jacobs