Abstract: This invention relates to adhesive compositions which may be used for bonding laminated glass and for glueing silicon semiconductor elements onto substrates in manufacturing solar cells. These adhesive compositions contain organopolysiloxanes having SiC-bonded vinyl groups and Si-bonded hydrogen as well as catalysts which promote the addition of Si-bonded hydrogen to vinyl groups. All of the organopolysiloxanes in these compositions are free of Si-bonded hydroxylk or alkoxy groups and contain on the average 2 to 1,000 silicon atoms per molecule in which at least 99.5 percent and preferably 99.9 percent of the number of Si-bonded hydrogen atoms are present in organopolysiloxanes containing one Si-bonded hydrogen atom per molecule and one SiC-bonded vinyl group per molecule or containing 2 Si-bonded hydrogen atoms per molecule and at least 99.5 percent and preferably 99.