Patents by Inventor Ernst Andrascek

Ernst Andrascek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroplating apparatus for producing humps on chip components
    Patent number: 4906346
    Abstract: The present invention provides an improved electroplating apparatus having an electroplating cell equipped with an anode, cathode and diaphragm ring. The electroplating cell is suspended in an electrolytic bath. The cell is composed of a plastic tube whose lower opening is covered by an anode surface and whose upper opening is covered by a wafer holder for holding the semiconductor wafer. The electroplating apparatus further includes an activated carbon filtering aimed at the levelling effect.
    Type: Grant
    Filed: February 8, 1988
    Date of Patent: March 6, 1990
    Assignee: Siemens Aktiengesellschaft
    Inventors: Hans Hadersbeck, Ernst Andrascek
  • Method of producing copper platforms for integrated circuits
    Patent number: 4652336
    Abstract: A method for producing a copper platform on integrated circuits formed on a semiconductor wafer wherein an aluminum layer is back-sputtered over the circuits to provide contact surfaces thereon, followed by sputtering on successive layers of titanium and copper on the aluminum layer. A copper platform is electrolytically built up above the aluminum layer and thereafter the copper layer is etched away. The copper platform is then metallized by electroless deposition, and finally the titanium layer is etched away.
    Type: Grant
    Filed: August 20, 1985
    Date of Patent: March 24, 1987
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ernst Andrascek, Hans Hadersbeck
  • Chemical gilding bath
    Patent number: 4481035
    Abstract: A chemical gilding bath is formulated on the basis of an alkaline, aqueous solution of an alkali gold cyanide complex and has a reducing agent and a stabilizing agent therein. The reducing agent is an organic compound containing at least one enol group within the molecular structure thereof, such as ascorbic acid or salts thereof. The pH value of the bath is adjusted by a buffer solution so as to range between about 7.5 to 12 and preferably is about 8.
    Type: Grant
    Filed: August 25, 1983
    Date of Patent: November 6, 1984
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ernst Andrascek, Hans Hadersbeck, Friedhelm Wallenhorst
  • Flexible through-contacted printed circuits
    Patent number: 4121044
    Abstract: A flexible printed circuit board has conductors on opposite sides thereof which are through-contacted by die-punching the board to form an angularly-displaced tongue portion about which solder is flowed to contact both conductors. A terminal pin is optionally inserted through the board to connect a component, the pin being engaged by the angularly-displaced tongue to ensure reliable mechanical and electrical contact in the soldered joint. The through-contact is formed with a bevel-faced die in conjunction with a cutting plate.
    Type: Grant
    Filed: May 26, 1976
    Date of Patent: October 17, 1978
    Assignee: Siemens Aktiengesellschaft
    Inventors: Hans Hadersbeck, Ernst Andrascek, Alfred Groeber
  • Process for improving the solderability of electric circuit boards
    Patent number: 4046620
    Abstract: A process is provided for improving the solderability of electric circuit boards with conductor paths composed of copper or copper alloys, in which, at least at the locations to be soldered, the conductor paths are cleansed in a first solution and are thereby deoxidized, and are then activated in a second solution.
    Type: Grant
    Filed: July 8, 1976
    Date of Patent: September 6, 1977
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ernst Andrascek, Hans Hadersbeck