Abstract: A chip package includes a semiconductor chip and a substrate integrated waveguide. The substrate integrated waveguide includes a first metal layer, a second metal layer arranged over the first metal layer and a dielectric substrate arranged between the first metal layer and the second metal layer. The chip package further includes a slot formed in the second metal layer and a signal line electrically coupling the semiconductor chip and the second metal layer. The signal line crosses the slot when viewed in a direction perpendicular to the second metal layer.

Abstract: According to a first example implementation, the method comprises providing a local oscillator signal in a first radar chip based on a local oscillator signal generated in a further radar chip; supplying the local oscillator signal to a transmission channel of the first radar chip which, based on the local oscillator signal, generates an HF output signal; changing the temperature and/or supply voltage of the first radar chip; measuring phase values based on the local oscillator signal supplied to the transmission channel and of the corresponding HF output signal for different temperature values and/or for different supply voltage values of the first radar chip; and ascertaining calibration data based on the measured phase values for a phase calibration to compensate for changes in the phase of the HF output signal resulting from a change in the temperature and/or in the supply voltage.

Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.

Abstract: A radio-frequency device comprises a semiconductor device, comprising a radio-frequency chip, and a first connection element, which is configured to mechanically and electrically connect the semiconductor device to a circuit board. The radio-frequency device furthermore comprises a waveguide component arranged over the semiconductor device, comprising a waveguide embodied in the waveguide component, and a second connection element, which mechanically connects the waveguide component to the semiconductor device. At least one from the first connection element or the second connection element is embodied in an elastic fashion.

Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.

Abstract: The present disclosure relates to a radar transmitting device, comprising a CMOS transceiver chip configured to provide at least one local oscillator signal at an output of the CMOS transceiver chip, and at least one BiCMOS transmitter chip coupled to the CMOS transceiver chip. The BiCMOS transmitter chip has an input for the local oscillator signal, at least one amplifier coupled to the input, a plurality of outputs for outputting a radar transmission signal on the basis of the local oscillator signal, and a plurality of transmission paths between the input and the plurality of outputs. Each of the transmission paths has a controllable analog phase shifter for controllable beam scanning during emission of the radar transmission signal. Additionally or alternatively, individual transmission paths of the BiCMOS transmitter chip can be selectively activated or deactivated using control signals.

Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.

Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.

Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.

Abstract: A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.

Abstract: According to a first example implementation, the method comprises providing a local oscillator signal in a first radar chip based on a local oscillator signal generated in a further radar chip; supplying the local oscillator signal to a transmission channel of the first radar chip which, based on the local oscillator signal, generates an HF output signal; changing the temperature and/or supply voltage of the first radar chip; measuring phase values based on the local oscillator signal supplied to the transmission channel and of the corresponding HF output signal for different temperature values and/or for different supply voltage values of the first radar chip; and ascertaining calibration data based on the measured phase values for a phase calibration to compensate for changes in the phase of the HF output signal resulting from a change in the temperature and/or in the supply voltage.

Abstract: A radar sensor for use in a vehicle is described. The radar sensor comprising: at least one transmitter and at least once receiver to transmit and receive radar signals of the radar sensor; an acceleration sensor to measure the acceleration of said radar sensor or the chassis of said vehicle; a processor coupled to said acceleration sensor to calculate a tilt in a radar signal projected from said vehicle using said measured acceleration; a memory for storing said calculated radar tilt.

Abstract: A radio-frequency device comprises a semiconductor device, comprising a radio-frequency chip, and a first connection element, which is configured to mechanically and electrically connect the semiconductor device to a circuit board. The radio-frequency device furthermore comprises a waveguide component arranged over the semiconductor device, comprising a waveguide embodied in the waveguide component, and a second connection element, which mechanically connects the waveguide component to the semiconductor device. At least one from the first connection element or the second connection element is embodied in an elastic fashion.

Abstract: A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.

Abstract: The present disclosure relates to a radar transmitting device, comprising a CMOS transceiver chip configured to provide at least one local oscillator signal at an output of the CMOS transceiver chip, and at least one BiCMOS transmitter chip coupled to the CMOS transceiver chip. The BiCMOS transmitter chip has an input for the local oscillator signal, at least one amplifier coupled to the input, a plurality of outputs for outputting a radar transmission signal on the basis of the local oscillator signal, and a plurality of transmission paths between the input and the plurality of outputs. Each of the transmission paths has a controllable analog phase shifter for controllable beam scanning during emission of the radar transmission signal. Additionally or alternatively, individual transmission paths of the BiCMOS transmitter chip can be selectively activated or deactivated using control signals.

Abstract: A radar module (100; 200) comprises a low temperature co-fired ceramic, LTCC, substrate (101; 201), with a radar chip (102; 202) attached to a first surface (101a; 201a) of the LTCC substrate (101; 201) and a transmitting antenna (105, 106) for transmitting the radar signal attached to a second surface (101b; 201b) of the LTCC substrate (101; 201). The radar chip (102; 202) is configured to generate a radar signal for transmission. The transmitting antenna (105, 106) is configured to communicate with the radar chip (102; 202) through the LTCC substrate (101; 201). The radar module (100; 200) further comprises a beam steering element (205) configured to introduce a phase delay to the radar signal in order to adjust a first component of a direction of transmission of the radar signal.

Abstract: An automotive radar system comprises: a master module, a first radar module, a second radar module, and an optical waveguide arrangement operably coupling the master module to the first and second radar modules. The master module comprises an electro-optical interface device having an electrical domain side and an optical domain side. The optical domain side is operably coupled to the optical waveguide arrangement. The master module comprises a digital clock signal generator operably coupled to the electrical domain side of the electro-optical interface device.

Abstract: A transmission line coupling arrangement comprising: a substrate comprising: a plurality of transmission lines each having a terminal radiating end for providing an electromagnetic wave as a result of a signal provided to the transmission line; and a footprint region extending over a portion of the substrate, wherein each of the terminal radiating ends of each of the plurality of transmission lines extend to a respective point within the footprint region; and the footprint region configured to receive a single transition housing thereover, the transition housing having at least one waveguide for receipt of the electromagnetic wave from one of the terminal radiating ends for coupling the at least one of the plurality of transmission lines to one of an output waveguide and an output antenna.

Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.

Abstract: A radar sensor for use in a vehicle is described. The radar sensor comprising: at least one transmitter and at least once receiver to transmit and receive radar signals of the radar sensor; an acceleration sensor to measure the acceleration of said radar sensor or the chassis of said vehicle; a processor coupled to said acceleration sensor to calculate a tilt in a radar signal projected from said vehicle using said measured acceleration; a memory for storing said calculated radar tilt.