Abstract: A chip package includes a semiconductor chip and a substrate integrated waveguide. The substrate integrated waveguide includes a first metal layer, a second metal layer arranged over the first metal layer and a dielectric substrate arranged between the first metal layer and the second metal layer. The chip package further includes a slot formed in the second metal layer and a signal line electrically coupling the semiconductor chip and the second metal layer. The signal line crosses the slot when viewed in a direction perpendicular to the second metal layer.

Abstract: A radio frequency (RF) device includes at least one RF chip, and a structure coupled to the at least one RF chip, wherein the at least one RF chip and the structure are integrated in a same semiconductor package, wherein the structure is configured to couple at least two RF signals of the at least one RF chip to at least two modes of a package-external waveguide and/or vice versa, and wherein the at least two modes are orthogonal to each other.

Abstract: A radio frequency (RF) device includes a substrate; an RF chip arranged on a first main surface of the substrate; a first coupling element arranged in the substrate and configured to couple an RF signal into or out of the substrate; a second coupling element arranged in the substrate and configured to couple an RF signal into or out of the substrate; a first RF signal path coupling the RF chip and the first coupling element, wherein the first RF signal path is at least partially arranged in the substrate and includes a first section with an RF signal propagation parallel to the first main surface; and a second RF signal path coupling the RF chip and the second coupling element, the second RF signal path including a first section with an RF signal propagation parallel to the first main surface.

Abstract: A radio frequency (RF) package includes an RF chip, a coupling element configured to couple an RF signal into or out of the RF package, an RF signal path coupling the RF chip and the coupling element, and a waveguide arranged in the RF signal path, wherein the waveguide is arranged inside the RF package and includes a first metal layer, a second metal layer opposite the first metal layer and a first slot formed in the first metal layer, wherein a main portion of the first slot is arranged perpendicular to a propagation direction of the waveguide.

Abstract: An RF module comprises a circuit board, a waveguide antenna, first and second semiconductor circuit devices, and first, second, and third RF ports. The first semiconductor circuit device including a local oscillator to generate a local oscillator signal. The circuit board includes a first opening between the first RF port and a first waveguide port for transferring the local oscillator signal from the first RF port into the first hollow waveguide. The circuit board includes a second opening between the second RF port and a second waveguide port to receive the local oscillator signal from the first hollow waveguide. The second semiconductor circuit device is configured to process a first RF signal based on the received local oscillator signal. The circuit board includes a third opening for transferring the first RF signal between the third RF port and a third waveguide port.

Abstract: A chip package includes a semiconductor chip and a substrate integrated waveguide. The substrate integrated waveguide includes a first metal layer, a second metal layer arranged over the first metal layer and a dielectric substrate arranged between the first metal layer and the second metal layer. The chip package further includes a slot formed in the second metal layer and a signal line electrically coupling the semiconductor chip and the second metal layer. The signal line crosses the slot when viewed in a direction perpendicular to the second metal layer.

Abstract: According to a first example implementation, the method comprises providing a local oscillator signal in a first radar chip based on a local oscillator signal generated in a further radar chip; supplying the local oscillator signal to a transmission channel of the first radar chip which, based on the local oscillator signal, generates an HF output signal; changing the temperature and/or supply voltage of the first radar chip; measuring phase values based on the local oscillator signal supplied to the transmission channel and of the corresponding HF output signal for different temperature values and/or for different supply voltage values of the first radar chip; and ascertaining calibration data based on the measured phase values for a phase calibration to compensate for changes in the phase of the HF output signal resulting from a change in the temperature and/or in the supply voltage.

Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.

Abstract: A radio-frequency device comprises a semiconductor device, comprising a radio-frequency chip, and a first connection element, which is configured to mechanically and electrically connect the semiconductor device to a circuit board. The radio-frequency device furthermore comprises a waveguide component arranged over the semiconductor device, comprising a waveguide embodied in the waveguide component, and a second connection element, which mechanically connects the waveguide component to the semiconductor device. At least one from the first connection element or the second connection element is embodied in an elastic fashion.

Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.

Abstract: The present disclosure relates to a radar transmitting device, comprising a CMOS transceiver chip configured to provide at least one local oscillator signal at an output of the CMOS transceiver chip, and at least one BiCMOS transmitter chip coupled to the CMOS transceiver chip. The BiCMOS transmitter chip has an input for the local oscillator signal, at least one amplifier coupled to the input, a plurality of outputs for outputting a radar transmission signal on the basis of the local oscillator signal, and a plurality of transmission paths between the input and the plurality of outputs. Each of the transmission paths has a controllable analog phase shifter for controllable beam scanning during emission of the radar transmission signal. Additionally or alternatively, individual transmission paths of the BiCMOS transmitter chip can be selectively activated or deactivated using control signals.

Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.

Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.

Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.

Abstract: A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.

Abstract: According to a first example implementation, the method comprises providing a local oscillator signal in a first radar chip based on a local oscillator signal generated in a further radar chip; supplying the local oscillator signal to a transmission channel of the first radar chip which, based on the local oscillator signal, generates an HF output signal; changing the temperature and/or supply voltage of the first radar chip; measuring phase values based on the local oscillator signal supplied to the transmission channel and of the corresponding HF output signal for different temperature values and/or for different supply voltage values of the first radar chip; and ascertaining calibration data based on the measured phase values for a phase calibration to compensate for changes in the phase of the HF output signal resulting from a change in the temperature and/or in the supply voltage.

Abstract: A radar sensor for use in a vehicle is described. The radar sensor comprising: at least one transmitter and at least once receiver to transmit and receive radar signals of the radar sensor; an acceleration sensor to measure the acceleration of said radar sensor or the chassis of said vehicle; a processor coupled to said acceleration sensor to calculate a tilt in a radar signal projected from said vehicle using said measured acceleration; a memory for storing said calculated radar tilt.

Abstract: A radio-frequency device comprises a semiconductor device, comprising a radio-frequency chip, and a first connection element, which is configured to mechanically and electrically connect the semiconductor device to a circuit board. The radio-frequency device furthermore comprises a waveguide component arranged over the semiconductor device, comprising a waveguide embodied in the waveguide component, and a second connection element, which mechanically connects the waveguide component to the semiconductor device. At least one from the first connection element or the second connection element is embodied in an elastic fashion.

Abstract: A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.

Abstract: The present disclosure relates to a radar transmitting device, comprising a CMOS transceiver chip configured to provide at least one local oscillator signal at an output of the CMOS transceiver chip, and at least one BiCMOS transmitter chip coupled to the CMOS transceiver chip. The BiCMOS transmitter chip has an input for the local oscillator signal, at least one amplifier coupled to the input, a plurality of outputs for outputting a radar transmission signal on the basis of the local oscillator signal, and a plurality of transmission paths between the input and the plurality of outputs. Each of the transmission paths has a controllable analog phase shifter for controllable beam scanning during emission of the radar transmission signal. Additionally or alternatively, individual transmission paths of the BiCMOS transmitter chip can be selectively activated or deactivated using control signals.