Patents by Inventor Ernst SELER

Ernst SELER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11854917
    Abstract: A radio-frequency device comprises a semiconductor device, comprising a radio-frequency chip, and a first connection element, which is configured to mechanically and electrically connect the semiconductor device to a circuit board. The radio-frequency device furthermore comprises a waveguide component arranged over the semiconductor device, comprising a waveguide embodied in the waveguide component, and a second connection element, which mechanically connects the waveguide component to the semiconductor device. At least one from the first connection element or the second connection element is embodied in an elastic fashion.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: December 26, 2023
    Assignee: Infineon Technologies AG
    Inventors: Ernst Seler, Ulrich Moeller, Bernhard Rieder
  • Patent number: 11824019
    Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: November 21, 2023
    Assignee: Infineon Technologies AG
    Inventors: Tuncay Erdoel, Walter Hartner, Ulrich Moeller, Bernhard Rieder, Ernst Seler, Maciej Wojnowski
  • Patent number: 11747437
    Abstract: The present disclosure relates to a radar transmitting device, comprising a CMOS transceiver chip configured to provide at least one local oscillator signal at an output of the CMOS transceiver chip, and at least one BiCMOS transmitter chip coupled to the CMOS transceiver chip. The BiCMOS transmitter chip has an input for the local oscillator signal, at least one amplifier coupled to the input, a plurality of outputs for outputting a radar transmission signal on the basis of the local oscillator signal, and a plurality of transmission paths between the input and the plurality of outputs. Each of the transmission paths has a controllable analog phase shifter for controllable beam scanning during emission of the radar transmission signal. Additionally or alternatively, individual transmission paths of the BiCMOS transmitter chip can be selectively activated or deactivated using control signals.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: September 5, 2023
    Assignee: Infineon Technologies AG
    Inventors: Ernst Seler, Ulrich Moeller, Markus Treml
  • Publication number: 20230275046
    Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.
    Type: Application
    Filed: May 5, 2023
    Publication date: August 31, 2023
    Inventors: Ernst SELER, Markus Josef LANG, Maciej WOJNOWSKI
  • Patent number: 11658135
    Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: May 23, 2023
    Assignee: Infineon Technologies AG
    Inventors: Ernst Seler, Markus Josef Lang, Maciej Wojnowski
  • Publication number: 20220415830
    Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.
    Type: Application
    Filed: June 24, 2021
    Publication date: December 29, 2022
    Applicant: Infineon Technologies AG
    Inventors: Tuncay ERDOEL, Walter HARTNER, Ulrich MOELLER, Bernhard RIEDER, Ernst SELER, Maciej WOJNOWSKI
  • Patent number: 11482771
    Abstract: A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: October 25, 2022
    Assignee: Infineon Technologies AG
    Inventors: Thomas Lampersberger, Reinhard Feger, Markus Josef Lang, Juergen Minichshofer, Ernst Seler, Andreas Stelzer
  • Publication number: 20220026527
    Abstract: According to a first example implementation, the method comprises providing a local oscillator signal in a first radar chip based on a local oscillator signal generated in a further radar chip; supplying the local oscillator signal to a transmission channel of the first radar chip which, based on the local oscillator signal, generates an HF output signal; changing the temperature and/or supply voltage of the first radar chip; measuring phase values based on the local oscillator signal supplied to the transmission channel and of the corresponding HF output signal for different temperature values and/or for different supply voltage values of the first radar chip; and ascertaining calibration data based on the measured phase values for a phase calibration to compensate for changes in the phase of the HF output signal resulting from a change in the temperature and/or in the supply voltage.
    Type: Application
    Filed: July 14, 2021
    Publication date: January 27, 2022
    Inventors: Josef KULMER, Ernst SELER, Hao LI, Gunther KRAUT, Oleksiy KLYMENKO, Patrick HOELZL
  • Patent number: 11194018
    Abstract: A radar sensor for use in a vehicle is described. The radar sensor comprising: at least one transmitter and at least once receiver to transmit and receive radar signals of the radar sensor; an acceleration sensor to measure the acceleration of said radar sensor or the chassis of said vehicle; a processor coupled to said acceleration sensor to calculate a tilt in a radar signal projected from said vehicle using said measured acceleration; a memory for storing said calculated radar tilt.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: December 7, 2021
    Assignee: NXP USA, Inc.
    Inventor: Ernst Seler
  • Publication number: 20210225719
    Abstract: A radio-frequency device comprises a semiconductor device, comprising a radio-frequency chip, and a first connection element, which is configured to mechanically and electrically connect the semiconductor device to a circuit board. The radio-frequency device furthermore comprises a waveguide component arranged over the semiconductor device, comprising a waveguide embodied in the waveguide component, and a second connection element, which mechanically connects the waveguide component to the semiconductor device. At least one from the first connection element or the second connection element is embodied in an elastic fashion.
    Type: Application
    Filed: January 15, 2021
    Publication date: July 22, 2021
    Inventors: Ernst SELER, Ulrich MOELLER, Bernhard RIEDER
  • Publication number: 20210218127
    Abstract: A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.
    Type: Application
    Filed: January 12, 2021
    Publication date: July 15, 2021
    Inventors: Thomas LAMPERSBERGER, Reinhard FEGER, Markus Josef LANG, Juergen MINICHSHOFER, Ernst SELER, Andreas STELZER
  • Publication number: 20210055376
    Abstract: The present disclosure relates to a radar transmitting device, comprising a CMOS transceiver chip configured to provide at least one local oscillator signal at an output of the CMOS transceiver chip, and at least one BiCMOS transmitter chip coupled to the CMOS transceiver chip. The BiCMOS transmitter chip has an input for the local oscillator signal, at least one amplifier coupled to the input, a plurality of outputs for outputting a radar transmission signal on the basis of the local oscillator signal, and a plurality of transmission paths between the input and the plurality of outputs. Each of the transmission paths has a controllable analog phase shifter for controllable beam scanning during emission of the radar transmission signal. Additionally or alternatively, individual transmission paths of the BiCMOS transmitter chip can be selectively activated or deactivated using control signals.
    Type: Application
    Filed: August 10, 2020
    Publication date: February 25, 2021
    Inventors: Ernst SELER, Ulrich MOELLER, Markus TREML
  • Patent number: 10921421
    Abstract: A radar module (100; 200) comprises a low temperature co-fired ceramic, LTCC, substrate (101; 201), with a radar chip (102; 202) attached to a first surface (101a; 201a) of the LTCC substrate (101; 201) and a transmitting antenna (105, 106) for transmitting the radar signal attached to a second surface (101b; 201b) of the LTCC substrate (101; 201). The radar chip (102; 202) is configured to generate a radar signal for transmission. The transmitting antenna (105, 106) is configured to communicate with the radar chip (102; 202) through the LTCC substrate (101; 201). The radar module (100; 200) further comprises a beam steering element (205) configured to introduce a phase delay to the radar signal in order to adjust a first component of a direction of transmission of the radar signal.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: February 16, 2021
    Assignee: NXP USA, INC.
    Inventors: Arnaud Sion, Ralf Reuter, Shamsuddin Ahmed, Ernst Seler
  • Patent number: 10921443
    Abstract: An automotive radar system comprises: a master module, a first radar module, a second radar module, and an optical waveguide arrangement operably coupling the master module to the first and second radar modules. The master module comprises an electro-optical interface device having an electrical domain side and an optical domain side. The optical domain side is operably coupled to the optical waveguide arrangement. The master module comprises a digital clock signal generator operably coupled to the electrical domain side of the electro-optical interface device.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: February 16, 2021
    Assignee: NXP B.V.
    Inventors: Ernst Seler, Gustavo Adolfo Guarin Aristizabal
  • Patent number: 10777899
    Abstract: A transmission line coupling arrangement comprising: a substrate comprising: a plurality of transmission lines each having a terminal radiating end for providing an electromagnetic wave as a result of a signal provided to the transmission line; and a footprint region extending over a portion of the substrate, wherein each of the terminal radiating ends of each of the plurality of transmission lines extend to a respective point within the footprint region; and the footprint region configured to receive a single transition housing thereover, the transition housing having at least one waveguide for receipt of the electromagnetic wave from one of the terminal radiating ends for coupling the at least one of the plurality of transmission lines to one of an output waveguide and an output antenna.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: September 15, 2020
    Assignee: NXP USA, INC.
    Inventors: Ziqiang Tong, Ernst Seler, Shamsuddin Ahmed
  • Publication number: 20200251430
    Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.
    Type: Application
    Filed: January 21, 2020
    Publication date: August 6, 2020
    Inventors: Ernst SELER, Markus Josef LANG, Maciej WOJNOWSKI
  • Publication number: 20200110153
    Abstract: A radar sensor for use in a vehicle is described. The radar sensor comprising: at least one transmitter and at least once receiver to transmit and receive radar signals of the radar sensor; an acceleration sensor to measure the acceleration of said radar sensor or the chassis of said vehicle; a processor coupled to said acceleration sensor to calculate a tilt in a radar signal projected from said vehicle using said measured acceleration; a memory for storing said calculated radar tilt.
    Type: Application
    Filed: April 16, 2019
    Publication date: April 9, 2020
    Inventor: Ernst Seler
  • Publication number: 20190198985
    Abstract: The embodiments described herein provide radar systems for use on unmanned vehicles. The radar systems can be applied to a wide variety of unmanned vehicles, including unmanned aerial vehicles and unmanned land vehicles. In general, the unmanned vehicle comprises a housing having at least one propulsion motor, a radar processing unit coupled to the body, and an antenna. In accordance with the embodiments described herein, the antenna includes an antenna body defining at least one transmitting waveguide and at least one receiving waveguide coupled to the radar processing unit. The antenna body is formed from plastic and includes metalized surface. In one embodiment, the antenna body is formed from 3-dimensional (3D) plastic printing.
    Type: Application
    Filed: December 26, 2017
    Publication date: June 27, 2019
    Applicant: NXP USA, INC.
    Inventors: Ernst Seler, Ziqiang Tong
  • Publication number: 20190107600
    Abstract: A radar module (100; 200) comprises a low temperature co-fired ceramic, LTCC, substrate (101; 201), with a radar chip (102; 202) attached to a first surface (101a; 201a) of the LTCC substrate (101; 201) and a transmitting antenna (105, 106) for transmitting the radar signal attached to a second surface (101b; 201b) of the LTCC substrate (101; 201). The radar chip (102; 202) is configured to generate a radar signal for transmission. The transmitting antenna (105, 106) is configured to communicate with the radar chip (102; 202) through the LTCC substrate (101; 201). The radar module (100; 200) further comprises a beam steering element (205) configured to introduce a phase delay to the radar signal in order to adjust a first component of a direction of transmission of the radar signal.
    Type: Application
    Filed: August 30, 2018
    Publication date: April 11, 2019
    Inventors: ARNAUD SION, Ralf Reuter, Shamsuddin Ahmed, Ernst Seler
  • Publication number: 20190109382
    Abstract: A transmission line coupling arrangement comprising: a substrate comprising: a plurality of transmission lines each having a terminal radiating end for providing an electromagnetic wave as a result of a signal provided to the transmission line; and a footprint region extending over a portion of the substrate, wherein each of the terminal radiating ends of each of the plurality of transmission lines extend to a respective point within the footprint region; and the footprint region configured to receive a single transition housing thereover, the transition housing having at least one waveguide for receipt of the electromagnetic wave from one of the terminal radiating ends for coupling the at least one of the plurality of transmission lines to one of an output waveguide and an output antenna.
    Type: Application
    Filed: August 30, 2018
    Publication date: April 11, 2019
    Inventors: Ziqiang Tong, Ernst Seler, Shamsuddin Ahmed