Abstract: A vertical plug-in single-in-line circuit module with a carrier for carrying a row of single-in-line mounted metal pins lying in the plane of the carrier along one carrier edge as outer electrical connections of one or more resistive elements such as a resistance area or resistance path. A first region of the resistive element is located closer to the metal pins of the carrier than a second region of the resistive element. Leads couple the metal pins to the resistive element. The first region lying closest to the metal pins is so constructed that it sees a higher heat dissipation per unit surface area during operation than the second region. The leads are connected to the resistive element such that the current can flow between the first region and second region.