Patents by Inventor Ernst Wipfelder

Ernst Wipfelder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6716535
    Abstract: The invention relates to the field of machine elements for designing a composite of two parts, one of which is a rare-earth permanent magnet and the other of which is a metallic support.
    Type: Grant
    Filed: October 17, 2002
    Date of Patent: April 6, 2004
    Assignee: Siemens Aktiengesellschaft
    Inventors: Winfried Plundrich, Ernst Wipfelder, Peter Hein, Ralf Wilcke
  • Patent number: 6613438
    Abstract: The invention relates to a one-component epoxy resin adhesive which is elasticated with silicone rubber and whose open joint time is adaptable to whichever production process it is being used in by the concentration of UV initiator and/or the duration and/or intensity of UV activation and which is therefore particularly suitable for automatable manufacturing processes, since the workpieces after initial fixing require no additional mounts even during thermal aftercuring. This adhesive is preferentially suitable for the extensive adhesive bonding of permanent magnets, such as in the assembly of a permasyn motor, for example.
    Type: Grant
    Filed: July 26, 2001
    Date of Patent: September 2, 2003
    Assignee: Siemens Aktiengesellschaft
    Inventors: Peter Hein, Winfried Plundrich, Ralf Wilcke, Ernst Wipfelder
  • Patent number: 6248854
    Abstract: An epoxysiloxane condensate is modified by means of an in situ reaction with an organic compound, which is di-functional or multifunctional if warranted. By means of the disclosed method, the characteristics of epoxysiloxane condensates, epoxy resin mixtures, epoxy resin formulations and molded bodies manufactured therefrom can be varied easily and economically.
    Type: Grant
    Filed: January 26, 1999
    Date of Patent: June 19, 2001
    Assignee: Siemens Aktiengesellschaft
    Inventors: Klaus Höhn, Ernst Wipfelder
  • Patent number: 6200408
    Abstract: A rapid and precise cementing of components to a surface is achieved using a specially modified cement on an epoxy base in that the parts to be cemented are precisely aligned at the cemented location, are fixed with UV light and are subsequently thermally hardened.
    Type: Grant
    Filed: July 20, 1999
    Date of Patent: March 13, 2001
    Assignee: Siemens Aktiengesellschaft
    Inventors: Heiner Bayer, Ernst Wipfelder
  • Patent number: 6160077
    Abstract: Halogen-free epoxy resins that arise from the addition of an epoxy component to a phenol component with base catalysis are disclosed, whereby the molar mass can be adjusted by means of the molar ratios of the initial materials. The resulting resins can be used in the field of electronics, both as molding compounds and as circuit board materials and adhesives.
    Type: Grant
    Filed: November 20, 1998
    Date of Patent: December 12, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Heiner Bayer, Walter Fischer, Wilhelm Hekele, Ernst Wipfelder
  • Patent number: 6150435
    Abstract: A one-component epoxy resin for coverage of bare chips and for underfilling of flip chips is disclosed. Two polyol components are combined in the inventive epoxy resin which decidedly improve the properties of the resin with respect to coefficient of expansion, shrinkage stress, substrate adhesion, and reactivity.
    Type: Grant
    Filed: November 12, 1998
    Date of Patent: November 21, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Heiner Bayer, Barbara Lehner, Ernst Wipfelder
  • Patent number: 5883214
    Abstract: Epoxysilanes having epoxide groups bonded via SiC are obtained by reaction of epoxyalkoxysilanes with silanols. The transparent siloxane mixtures containing epoxide can be employed directly as resin components for mixing with epoxy resins for casting resin applications.
    Type: Grant
    Filed: February 23, 1996
    Date of Patent: March 16, 1999
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ernst Wipfelder, Klaus Hohn
  • Patent number: 5837771
    Abstract: For improved flame retardant finishing and better processability of an epoxy anhydride reaction resin system, the present invention provides a reaction resin system supplemented with phosphinic and/or phosphonic acid anhydride as the hardener component. The phosphorus-containing anhydrides do not deteriorate the hardening characteristics. Molded members manufactured therefrom exhibit adequate flame retardant behavior even with slight proportions of phosphinic or phosphonic acid anhydride given a property profile that is otherwise unmodified.
    Type: Grant
    Filed: January 11, 1996
    Date of Patent: November 17, 1998
    Assignee: Lemens Aktiengesellschaft
    Inventors: Ernst Wipfelder, Winfried Plundrich
  • Patent number: 5811486
    Abstract: For better flame-retardant finishing and better workability of an epoxy-anhydride reaction resin system, it is proposed to supplement the reaction resin system with phosphonic semi-ester as additional reactive constituents. These are produced by conversion of phosphonic acid anhydride with single-valent or multi-valent alcohols. As a result of the selection of the alcohol constituent, property features of the molding material modified therewith that are already advantageous can be designationally set without thereby negatively influencing the hardening characteristic. Even with slight parts of phosphonic acid semi-ester, shaped members manufactured therefrom exhibit an adequate flame-retardant behavior given an otherwise unmodified property profile.
    Type: Grant
    Filed: July 25, 1997
    Date of Patent: September 22, 1998
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ernst Wipfelder, Windfried Plundrich
  • Patent number: 5804680
    Abstract: A flame-resistant, UV-curable single-component reactive resin system comprises a phosphorus-containing acrylate, another unsaturated compound which can undergo free radical copolymerization with acrylates and a free radical initiator system.
    Type: Grant
    Filed: March 5, 1997
    Date of Patent: September 8, 1998
    Assignee: Siemens Aktiengesellschaft
    Inventors: Winfried Plundrich, Ernst Wipfelder
  • Patent number: 5618872
    Abstract: The invention relates to the use of momodisperse, non-porous, spherical particles based on SiO.sub.2, TiO.sub.2, ZrO.sub.2, Al.sub.2 O.sub.3, V.sub.2 O.sub.5, Nb.sub.2 O.sub.5 or mixed systems thereof, which are optionally modified on the surface by covalently bonded organic groups, as fillers in organic matrix materials, the refractive index of the particles being adapted to the refractive index of the organic matrix according to the use.Polymeric or polymerizable systems which comprise these particles can be used, for example, as embedding compositions for optical, electro-optical and optoelectronic components. Such embedding compositions show an improved optical homogeneity. Light-emitting diodes produced with them are distinguished, inter alia, by an improved light yield.
    Type: Grant
    Filed: December 9, 1994
    Date of Patent: April 8, 1997
    Assignees: Merck Patent Gesellschaft mit beschrankter Haftung, Siemens AG
    Inventors: Ludwig Pohl, Kurt Marquard, G unter Waitl, Ulrike Reeh, Ernst Wipfelder
  • Patent number: 5576357
    Abstract: A one-component reactive resin system which is stable in storage but nevertheless can readily be cured completely comprises a mixture of commercially available epoxy resins and phosphorus-containing glycidyl esters, in particular phosphonic acid diglycidyl esters, as well as cationic photoinitiators. The low-viscosity reactive resin systems cannot be cured purely by means of heat and can be processed at high temperatures and in particular can have a high filler content. The reactive resin systems, which are stable to storage even after UV activation, can be cured to flame-resistant molded materials under moderate conditions.
    Type: Grant
    Filed: May 3, 1995
    Date of Patent: November 19, 1996
    Assignee: Siemens Aktiengesellschaft
    Inventors: Heiner Bayer, Winfried Plundrich, Ernst Wipfelder
  • Patent number: 5492981
    Abstract: A casting resin system containing epoxyalkylsiloxane is provided for covering optoelectronic components. The casting resin system includes a resin constituent containing a mixture of epoxyalkylsiloxanes and cycloaliphatic epoxy resins. The casting resin system can be hardened with a polycarboxylic acid anhydride as a hardener component to form molding materials that are transparent and color-stable.
    Type: Grant
    Filed: August 24, 1994
    Date of Patent: February 20, 1996
    Assignee: Siemens Aktiengesellschaft
    Inventors: Klaus Hoehn, Ulrike Reeh, Ernst Wipfelder, Guenther Waitl
  • Patent number: 5262456
    Abstract: A halogen free casting resin suitable for covering electron devices with a fire retardant material contains an acidic ester of an hydroxy-functional phosphor compound and an organic anhydride. A stable mixture can be generated from the acidic ester and the hardener component of the casting resin, and further used for the hardening of epoxides resins. The acidic ester is chemically integrated in the epoxide resin matrix in a stable mixture, thereby improving the long term fire-retardancy of the casting resin molding compound without increasing the volatility of the mixture.
    Type: Grant
    Filed: November 5, 1992
    Date of Patent: November 16, 1993
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ernst Wipfelder, Winfried Plundrich
  • Patent number: 5006055
    Abstract: An apparatus for manufacturing an otoplastic. An otoplastic is manufactured directly in the ear of a hearing-impaired person in that a deformable envelope is pulled over a die or over a shell or over an overlayed over-shell. This apparatus is then supplied with flowing otoplastic material between the die and the envelope, being supplied therewith in the ear. The envelope expands and assumes the shape of the auditory canal. After hardening or curing of the otoplastic material in the ear of the hearing-impaired person, the envelope and the die are removed and a module of either an in-the-ear or of a behind-the-ear hearing aid is integrated therewith.
    Type: Grant
    Filed: August 4, 1989
    Date of Patent: April 9, 1991
    Assignee: Siemens Aktiengesellschaft
    Inventors: Helmut Lebisch, Rainer Basel, Georg Fuchs, Hermann Dietmar, Ernst Wipfelder, Wilhelm Hekele
  • Patent number: 4871502
    Abstract: A method and apparatus for manufacturing an otoplastic. An otoplastic is manufactured directly in the ear of a hearing-impaired person in that a deformable envelope is pulled over a die or over a shell or over an overlayed over-shell. This apparatus is then supplied with flowing otoplastic material between the die and the envelope, being supplied therewith in the ear. The envelope expands and assumes the shape of the auditory canal. After hardening or curing of the otoplastic material in the ear of the hearing-impaired person, the envelope and the die are removed and a module of either an in-the-ear or of a behind-the-ear hearing aid is integrated therewith.
    Type: Grant
    Filed: April 22, 1988
    Date of Patent: October 3, 1989
    Assignee: Siemens Aktiengesellschaft
    Inventors: Helmut LeBisch, Rainer Basel, Georg Fuchs, Hermann Dietmar, Ernst Wipfelder, Wilhelm Hekele