Patents by Inventor Erol D. Saydam
Erol D. Saydam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8109770Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component may include a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint, one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system and a frame formed of electrically conductive material and configured to connect with the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts grouped to multi-contact groupings configured to transmit single-ended or differential signals.Type: GrantFiled: April 4, 2006Date of Patent: February 7, 2012Assignee: Advanced Interconnections Corp.Inventors: Michael N. Perugini, Gary D. Eastman, Alfred J. Langon, Raymond A. Prew, Erol D. Saydam
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Patent number: 7350290Abstract: A compression device has a frame sized to accept an integrated circuit package and a pressor. The frame includes a surface defining an opening with an axis and at least one ramp extending from the surface. The ramp or ramps have upper and lower flat portions, substantially parallel with a plane perpendicular to the axis, and a sloped portion at an angle relative to the plane, the sloped portion connecting the upper and lower flat portions. The pressor is configured to engage the ramp and rotate in response to applied force. When the pressor is engaged with the sloped portion(s) of the ramp(s), this rotation causes movement of the pressor along the axis. However, when engagement between the ramps and the pressor is in the flat portions of the ramp, continued movement of the pressor along the axis is limited in spite of any continued rotation.Type: GrantFiled: November 12, 2004Date of Patent: April 1, 2008Assignee: Advanced Interconnections CorporationInventors: Glenn Goodman, Gary D. Eastman, Alfred J. Langon, Erol D. Saydam
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Patent number: 7094069Abstract: An intercoupling component is of the type used to couple an array of electrical connection regions disposed on a first substrate to an array of electrical connection regions disposed on a second substrate. The intercoupling component comprises: an insulative support member; a plurality of electrically conductive terminal elements; a second insulative support member; and a seal member positioned between the first insulative support member and the second insulative member to restrict fluid flow along the terminal elements.Type: GrantFiled: August 24, 2005Date of Patent: August 22, 2006Assignee: Advanced Interconnections CorporationInventors: Erol D. Saydam, Curtis Wilmot, Glenn Goodman, Richard J. Alviti
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Patent number: 7021945Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.Type: GrantFiled: April 8, 2004Date of Patent: April 4, 2006Assignee: Advanced Interconnection CorporationInventors: Michael N. Perugini, Gary D. Eastman, Alfred J. Langon, Raymond A. Prew, Erol D. Saydam
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Patent number: 6899550Abstract: An intercoupling component for receiving an array of contacts includes a non-conductive substrate having a plurality of holes disposed on its upper surface and arranged in a predetermined footprint corresponding to the array of contacts. Contacts are disposed within the holes and a cavities, which may be open to air or filled with some other dielectric material, are disposed in the substrate between adjacent contacts.Type: GrantFiled: February 25, 2004Date of Patent: May 31, 2005Assignee: Advanced Interconnections CorporationInventors: Michael N. Perugini, Gary D. Eastman, Alfred J. Langon, Raymond A. Prew, Erol D. Saydam
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Publication number: 20040192089Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.Type: ApplicationFiled: April 8, 2004Publication date: September 30, 2004Applicant: Advanced Interconnections Corporation, a Rhode Island corporationInventors: Michael N. Perugini, Gary D. Eastman, Alfred J. Langon, Raymond A. Prew, Erol D. Saydam
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Publication number: 20040166704Abstract: An intercoupling component for receiving an array of contacts includes a non-conductive substrate having a plurality of holes disposed on its upper surface and arranged in a predetermined footprint corresponding to the array of contacts. Contacts are disposed within the holes and a cavities, which may be open to air or filled with some other dielectric material, are disposed in the substrate between adjacent contacts.Type: ApplicationFiled: February 25, 2004Publication date: August 26, 2004Applicant: Advanced Interconnections Corporation, a Rhode Island corporationInventors: Michael N. Perugini, Gary D. Eastman, Alfred J. Langon, Raymond A. Prew, Erol D. Saydam
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Patent number: 6743049Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component may include a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint, one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system and a frame formed of electrically conductive material and configured to connect with the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts grouped to multi-contact groupings configured to transmit single-ended or differential signals.Type: GrantFiled: June 24, 2002Date of Patent: June 1, 2004Assignee: Advanced Interconnections CorporationInventors: Michael N. Perugini, Gary D. Eastman, Alfred J. Langdon, Raymond A. Prew, Erol D. Saydam
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Publication number: 20030236031Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.Type: ApplicationFiled: June 24, 2002Publication date: December 25, 2003Inventors: Michael N. Perugini, Gary D. Eastman, Alfred J. Langon, Raymond A. Prew, Erol D. Saydam